• Proceedings of the Korean Vacuum Society Conference
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• 2012.08a
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• pp.231-231
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• 2012

Correct determination of the interface locations is critical for the calibration of the depth scale and measurement of layer thickness in SIMS depth profiling analysis of multilayer films. However, the interface locations are difficult to determine due to the unwanted distortion from the real ones by the several effects due to sputtering with energetic ions. In this study, the layer thicknesses of Si/Ge and Si/Ti multilayer films were measured by SIMS depth profiling analysis using the oxygen and cesium primary ion beam. The interface locations in the multilayer films could be determined by two methods. The interfaces can be determined by the 50 at% definition where the atomic fractions of the constituent layer elements drop or rise to 50 at% at the interfaces. In this method, the raw depth profiles were converted to compositional depth profiles through the two-step conversion process using the alloy reference relative sensitivity factors (AR-RSF) determined by the alloy reference films with well-known compositions determined by Rutherford backscattering spectroscopy (RBS). The interface locations of the Si/Ge and Si/Ti multilayer films were also determined from the intensities of the interfacial composited ions (SiGe+, SiTi+). The determination of the interface locations from the composited ions was found to be difficult to apply due to the small intensity and the unclear variation at the interfaces.

• Proceedings of the Korean Magnestics Society Conference
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• 1993.11a
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• pp.10-11
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• 1993

• Proceedings of the Korean Vacuum Society Conference
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• 2001.02a
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• pp.21-21
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• 2001

• Proceedings of the Korean Magnestics Society Conference
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• 1999.04a
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• pp.102-103
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• 1999

• Proceedings of the KWS Conference
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• 2002.10a
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• pp.469-474
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• 2002

Laser and hot air reflow soldering of PBGA solder ball was investigated. Experimental results showed that surface quality and shear strength of solder bumps reflowed by laser was superior than the solder bumps reflowed by hot air, and the microstructure inside the solder bumps reflowed by laser was much finer. Analysis on interfacial reaction showed that eutectic solder reacted with Au/Ni/Cu pad shortly after the solder was melted. Interface of solder bump reflowed by laser consists of a continuous AuSn$_4$ layer and remnant Au element. Needle-like AuSn$_4$ grew sidewise from interface, and then spread out to the entire interface region. A thin layer of Ni$_3$Sn$_4$ intermetallic compound was found at the interface of solder bump reflowed by hot air, AuSn$_4$ particles distributed inside the whole solder bump randomly. It is the combination effect of the continuous AuSn$_4$ layer and finer eutectic microstructure inside the solder bump reflowed by laser that resulted in higher shear strength.

• Journal of Magnetics
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• v.6 no.4
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• pp.145-147
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• 2001

The effect of interface roughness between [Ni/Mn] superlattice and pinned NiFe layer on magnetoresistance (MR) of [Ni/Mn] superlattice-based spin valve films was investigated. Antiferromagnetic phase structure and interface roughness of [Ni/Mn] superlattice spin valve films were compared in the as-deposited and the annealed samples at 240$\^{C}$, respectively. Surface morphology of spin valves was substantially flattened due to the formation of the antiferromatic NiMn phase. In case of Co insertion between Cu and NiFe, the interlace roughness and MR ratio in the annealed [NiMn] superlattice and pinned NiFe/Co layer increased more than those in the annealed [Ni/Mn] superlattice and pinned NiFe layers respectively.

• Journal of Welding and Joining
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• v.29 no.5
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• pp.90-94
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• 2011

Ag metallic particles from nano-scale to submicron-scale are combined with organic solvent to provide fine circuits and interconnection. Ink-jet printing with Ag nano particle inks demonstrated the potentials of the new printed electronics technology. The bonding at the interface between the Ag wiring layer and the various substrates is very important. In this study, the details of interfaces in Ag wiring are investigated primarily by microstructure observation. By adjusting the materials and sintering conditions, nicely formed interfaces between Ag wiring and Cu, Au or organic substrates are achieved. In contrast, transmission electron microscope (TEM) image clearly shows interface debonding between Ag wiring and Sn substrate. Sn oxides are formed on the surface of the Sn plating. The formation of these is a root cause of the interface debonding.

• Transactions of the Korean Society of Mechanical Engineers B
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• v.20 no.10
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• pp.3322-3333
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• 1996

A numerical analysis has been conducted to investigate a modified floating-zone crystal growth process in which most of the melt surface is covered with a heated ring. The crystal rod is not only pulled downward but rotated around its axisymmetric line during crystal growth process in order to produce the flat interface of crystal growth and the single crystal growth of NaNO3 is considered in 6mm diameter. The present study is made from a full-equation-based analysis considering a pulling velocity in all of solid and liquid domains and both of solid-liquid interfaces are tracked simultaneously with a governing equation in each domain. Numerical results are mainly presented for the comparison of the surface shape of rotational crystal rod with that of no-rotational crystal rod and the effects of revolution speeds of the crystal rod. Results show that the rotation of crystal rod produces more its flat surface. In addition, the shape of crystal growth near the centerline is more concaved with the increase in the revolution speed of crystal rod. The flow pattern and temperature distribution is analyzed and presented in each case. As the pulling velocity of crystal rod is increasing, the free surface of the melt below the heated ring is enlarged due to the crystal interface migrating downward.

• Journal of the Korean GEO-environmental Society
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• v.8 no.1
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• pp.49-55
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• 2007

In order to utilize treads of waste tire as reinforcement material it is necessary to know the interface friction angle between tread surfaces and soil and tensile strength of connection joint of tire treads. In this research large direct shear tests were performed to get the interface friction angle between the inner and outer surfaces of treads and soil for different degree of compaction. From the large direct shear tests, the ratio of interface friction angle to the shear friction angle of sand, ${\delta}/{\phi}$, were 1.06 in outside surface of tire tread and 0.93 in inside surface of tire tread. For weathered granite soil the ratio of interface friction angle was 0.98 and 0.92 for outside and inside of tread, respectively. Also tensile tests were performed using universal testing machine for the connection joint of treads and Tirecell units using bolts. The tensile strength of connection joint increased with the number of bolts and with the sizes of washers. Connection by polypropylene ropes showed lower strength than those of bolts.

• Journal of the Korean Society for Precision Engineering
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• v.19 no.5
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• pp.43-50
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• 2002

Friction welding has many merits such as energy efficiency, simple processing, etc butt difficult to obtain good weld at the welded interface and heat affected zone. To date, the continuum mechanics and fracture mechanics are utilized to analyse stresses at the interface and propagation of cracks. In this study. STS304 and SM15C are selected because they can be differentiated distinctively from metallic point of view and crack can be observed easily. It is ovserved during friction welding that STS304, rotary part is hatter than SH15C, fixed part. The last fracture occurs around the center because the surface of fatigue fracture has smooth regions, due to the separation phenomenon in plastic flows layers and striation dimple pattern.