• 한국표면공학회지
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• 제36권4호
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• pp.347-355
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• 2003

Roughening of metal surfaces frequently enhances the adhesion strength of metals to polymers by mechanical interlocking. When a failure occurs at a roughened metal/polymer interface, the failure prone to be cohesive. In a previous work, an adhesion study on a roughened metal (oxidized copper-based leadframe)/polymer (Epoxy Molding Compound, EMC) interface was carried out, and the correlation between adhesion strength and failure path was investigated. In the present work, an attempt to interpret the failure path was made under the assumption that microvoids are formed in the EMC as well as near the roots of the CuO needles during compression-molding process. A simple adhesion model developed from the theory of fiber reinforcement of composite materials was introduced to explain the adhesion behavior of the oxidized copper-based leadframe/EMC interface and failure path. It is believed that this adhesion model can be used to explain the adhesion behavior of other similarly roughened metal/polymer interfaces.

• 한국표면공학회지
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• 제29권4호
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• pp.238-252
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• 1996

In order to study the effect of interface oxides on the adhesion strength of the copper/epoxy system, copper foils were immersed in black oxide or brown oxide forming solutions before lamination with epoxy prepregs, and variation of peel strength with the treatment time were investigated. Results showed that peel strength decreased rapidly up to 1 minute of treatment lime and remained constant in the case of the black oxide treated specimens, which was accompanied by the thickening of $Cu_2O$ at the Copper/Epoxy interface during the period. In contrast, peel strength increased rapidly up to 1 minute of treatment time and remained constant in the case of the brown oxide treated specimens, which could be ascribed to the thickening of CuO. Subsequent heat treatments of the Copper/Epoxy laminations at $120^{\circ}C$ in air showed that peel strength remained constant in the case of the black oxide treated specimens but decreased gradually in the case of the brown oxide treated specimens. Following XPS analyses revealed that the latter was possibly caused by the coalescence of CuO at the Copper/Epoxy interface into $Cu_2O$.

• 한국해양공학회지
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• 제17권6호
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• pp.72-76
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• 2003

This paper deals with the stress singularity developed in a polymer layer that is coated to a concrete surface, due to temperature change. The boundary element method is employed to investigate the behavior of interface stresses. The polymeric layer is assumed to be a linear viscoelastic material, and is thermorheologically simple. The order of the singularity is obtained, numerically, for a given viscoelastic model. Numerical results exhibit the relaxation of interface stresses, and large gradients are observed in the vicinity of the free surface. Results show that the stress singularity factor is relaxed with time, while the order of the singularity increases with time for the viscoelastic model.

• 대한기계학회논문집
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• 제19권9호
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• pp.2249-2260
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• 1995

An experiment of close contact melting of phase-change medium partially filled in an isothermally heated horizontal cylinder is performed which involves the volume expansion of liquid induced by the solid-liquid density difference. The solid-liquid interface motion and the free surface behavior of liquid were reported photographically. The experimental results show that the curvature of upper solid-liquid interface varied to flat as melting progresses. In addition to the varying interface shape, the melting rate increases with the lower initial height of solid and the free surface height of liquid increases linearly. The experimental results of molten mass fraction were expressed in a function of dimensionless time Fo.Ste$^{3}$4/ and agreed well with the analytical solutions.

• 한국안전학회지
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• 제16권3호
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• pp.26-30
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• 2001

Creep crack growth lift of high temperature pressure equipments was assessed for various crack locations and for various material properties. Surface cracks at the inner and outer surface of the vessel in the axial and circumferential directions were considered. The crack was located in the weld metal, in the parent metal or at the weld interface. Results shored that the crack at the weld interface was the most dangerous one. The crack located outside is weaker than that located inside. Safety factors of the case in which improper material properties were used the to unavailability of the correct material properties were discussed.

• Structural Engineering and Mechanics
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• 제9권1호
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• pp.69-88
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• 2000

A relatively simple model of a buried structure response to a surface loading that can simulate a possible opening and closure of a gap between the soil and the structure is presented. Analysis of the response of small and medium scale buried roof slabs under surface impulsive loading shows that the model's predictions are in fairly good agreement with the experimental results. Application of the model to a study case shows the relative influence of system parameters such as, the depth of burial, the arching coefficient, and the roof thickness, on the interface pressure and on the roof displacement. This model demonstrates the effect of a gap between the structure and the soil. The relative importance of including a gap opening and closure in the analysis is examined by the application of the model to a study case. This study results show that the deeper the depth of burial, the longer the gap duration, and the shorter the duration of the initial interface impact, while the higher the soil's shear resistance, the higher the gap duration, and the shorter the initial interface impact duration.

• 한국지반환경공학회 논문집
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• 제19권12호
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• pp.33-39
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• 2018

본 연구에서는 토목섬유-점토의 접촉면 압밀 전단거동 평가를 위하여 상재하중 및 해수와 담수를 이용해 토목섬유-점토의 경계면에 대한 중요 특성인자를 규명하였다. 또한 폐기물 매립으로 바다에 매립공간을 확보하고 폐기물 처리 및 향후 토지이용 등 새롭게 필요 공간으로 변모가 가능하다. 토목섬유-점토의 접촉면에 거동특성을 분석한 결과 표준 압밀시험기를 이용하여 분석한 경우 해수보다 담수에서 압밀응력이 크게 증가하는 경향을 보였고, 동적 접촉면 전단 시험기를 이용하여 분석한 경우 해수와 담수 두 개의 조건에서 모두 동일하게 하부모듈에 가까운 와이어게이지일수록 변위값이 증가하고, 담수보다 해수의 조건에서 전단파괴가 급격히 일어나는 경향을 볼 수 있다. 따라서 토목섬유-점토의 접촉면에 작용하는 해수와 담수, 차수시설 설치여부(토목섬유)는 차수 시설 동적설계인자에 반드시 필요한 중요 변수로써 고려하여야 한다.

• 접착 및 계면
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• 제4권2호
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• pp.30-36
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• 2003

• 대한전기학회:학술대회논문집
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• 대한전기학회 2009년도 제40회 하계학술대회
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• pp.2067_2068
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• 2009

Resistivity changes and intermetallic growth after thermal aging of Matter tin-plated copper sheet for current collector in fuel cell were investigated to survey the diffusion of Cu into Sn in interface and surface. The results show that the intermetallic growth and resistivity depended on thermal aging temperature and dwell time. In Sn plate on a Cu substrate, $Cu_6Sn_5({\mu})$ and $Cu_3Sn({\varepsilon})$ intermetallics layer were formed at plate/substrate interface. $Cu_6Sn_5({\mu})$ intermetallics layer gradually changed $Cu_3Sn({\varepsilon})$. Moreover Cu get through Sn layer and it was diffused in the surface at $200^{\circ}C$. On the other hand, only $Cu_3Sn({\varepsilon})$ intermetallics layer were formed at plate/substrate interface at $300^{\circ}C$. Consequently, the intermetallics formation, thermal condition and oxidation of surface, causes increase in the resistivity of Tin-plated copper sheet.

• 전기학회논문지
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• 제58권8호
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• pp.1559-1565
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• 2009

Resistivity changes and intermetallic growth after thermal aging of Matter tin-plated copper sheet for current collector in fuel cell were investigated to survey the diffusion of Cu into Sn in interface and surface. The results show that the intermetallic growth and resistivity depended on thermal aging temperature and dwell time. In Sn plate on a Cu substrate, Cu6Sn5(${\mu}$) and Cu3Sn(${\varepsilon}$) intermetallics layer were formed at plate/substrate interface. Cu6Sn5(${\mu}$) intermetallics layer gradually changed Cu3Sn(${\varepsilon}$). Moreover Cu get through Sn layer and it was diffused in the surface at $200^{\circ}C$. On the other hand, only Cu3Sn(${\varepsilon}$) intermetallics layer were formed at plate/substrate interface at $300^{\circ}C$. Consequently, the intermetallics formation, thermal condition and oxidation of surface, causes increase in the resistivity of Tin-plated copper sheet.