• 제목/요약/키워드: surface accumulation

검색결과 589건 처리시간 0.027초

무연솔더 범프 접촉 탐침 핀의 Sn 산화막 형성 기제 (Formation Mechanisms of Sn Oxide Films on Probe Pins Contacted with Pb-Free Solder Bumps)

  • 배규식
    • 한국재료학회지
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    • 제22권10호
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    • pp.545-551
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    • 2012
  • In semiconductor manufacturing, the circuit integrity of packaged BGA devices is tested by measuring electrical resistance using test sockets. Test sockets have been reported to often fail earlier than the expected life-time due to high contact resistance. This has been attributed to the formation of Sn oxide films on the Au coating layer of the probe pins loaded on the socket. Similar to contact failure, and known as "fretting", this process widely occurs between two conductive surfaces due to the continual rupture and accumulation of oxide films. However, the failure mechanism at the probe pin differs from fretting. In this study, the microstructural processes and formation mechanisms of Sn oxide films developed on the probe pin surface were investigated. Failure analysis was conducted mainly by FIB-FESEM observations, along with EDX, AES, and XRD analyses. Soft and fresh Sn was found to be transferred repeatedly from the solder bump to the Au surface of the probe pins; it was then instantly oxidized to SnO. The $SnO_2$ phase is a more stable natural oxide, but SnO has been proved to grow on Sn thin film at low temperature (< $150^{\circ}C$). Further oxidation to $SnO_2$ is thought to be limited to 30%. The SnO film grew layer by layer up to 571 nm after testing of 50,500 cycles (1 nm/100 cycle). This resulted in the increase of contact resistance and thus of signal delay between the probe pin and the solder bump.

Comparative Study on Various Ductile Fracture Models for Marine Structural Steel EH36

  • Park, Sung-Ju;Lee, Kangsu;Cerik, Burak Can;Choung, Joonmo
    • 한국해양공학회지
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    • 제33권3호
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    • pp.259-271
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    • 2019
  • It is important to obtain reasonable predictions of the extent of the damage during maritime accidents such as ship collisions and groundings. Many fracture models based on different mechanical backgrounds have been proposed and can be used to estimate the extent of damage involving ductile fracture. The goal of this study was to compare the damage extents provided by some selected fracture models. Instead of performing a new series of material constant calibration tests, the fracture test results for the ship building steel EH36 obtained by Park et al. (2019) were used which included specimens with different geometries such as central hole, pure shear, and notched tensile specimens. The test results were compared with seven ductile fracture surfaces: Johnson-Cook, Cockcroft-Latham-Oh, Bai-Wierzbicki, Modified Mohr-Coulomb, Lou-Huh, Maximum shear stress, and Hosford-Coulomb. The linear damage accumulation law was applied to consider the effect of the loading path on each fracture surface. The Swift-Voce combined constitutive model was used to accurately define the flow stress in a large strain region. The reliability of these simulations was verified by the good agreement between the axial tension force elongation relations captured from the tests and simulations without fracture assignment. The material constants corresponding to each fracture surface were calibrated using an optimization technique with the minimized object function of the residual sum of errors between the simulated and predicted stress triaxiality and load angle parameter values to fracture initiation. The reliabilities of the calibrated material constants of B-W, MMC, L-H, and HC were the best, whereas there was a high residual sum of errors in the case of the MMS, C-L-O, and J-C models. The most accurate fracture predictions for the fracture specimens were made by the B-W, MMC, L-H, and HC models.

육방정 질화붕소 나노입자의 결정성에 미치는 불화칼슘 첨가의 영향 (Effect of CaF2 Addition on the Crystallinity of Hexagonal Boron Nitride Nanoparticles)

  • 정재용;김양도;김영국
    • 대한금속재료학회지
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    • 제56권12호
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    • pp.915-920
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    • 2018
  • With the development of modern microelectronics technologies, the power density of electronic devices is rapidly increasing, due to the miniaturization or integration of device elements which operate at high frequency, high power conditions. Resulting thermal problems are known to cause power leakage, device failure and deteriorated performance. To relieve heat accumulation at the interface between chips and heat sinks, thermal interface materials (TIMs) must provide efficient heat transport in the through-plane direction. We report on the enhanced thermal conduction of $Al_2O_3-based$ polymer composites, fabricated by the surface wetting and texturing of thermally conductive hexagonal boron nitride(h-BN) nanoplatelets with large anisotropy in morphology and physical properties. The thermally conductive polymer composites were prepared with hybrid fillers of $Al_2O_3$ macro beads and surface modified h-BN nanoplatelets. Hexagonal boron nitride (h-BN) has high thermal conductivity and is one of the most suitable materials for thermally conductive polymer composites, which protect electronic devices by efficient heat dissipation. In this study, we synthesized hexagonal boron nitride nanoparticles by the pyrolysis of cost effective precursors, boric acid and melamine. Through pyrolysis at $900^{\circ}C$ and subsequent annealing at $1500^{\circ}C$, hexagonal boron nitride nanoparticles with diameters of ca. 50nm were synthesized. We demonstrate that the addition of a small amount of calcium fluoride ($CaF_2$) during the preparation of the melamine borate adduct significantly enhanced the crystallinity of the h-BN and assisted the growth of nanoplatelets up to 100nm in diameters. The addition of a small amount of h-BN enhanced the thermal conductivity of the $Al_2O_3-based$ polymer composites, from 1.45W/mK to 2.33 W/mK.

Effect of Bamboo (Pseudosasa japonica Makino) Leaves on the Quality and Sensory Characteristics of Dongchimi

  • Kim, Mi-Jung;Kim, Byong-Ki;Jang, Myung-Sook
    • Preventive Nutrition and Food Science
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    • 제1권2호
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    • pp.159-167
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    • 1996
  • Effect of covering various levels(0, 1, 3, 5 and 7% per Chinese radish weight) of bamboo(Pseudosasa japonica Makino) leaves on the surface of Dongchimi was studied in the course of fermenting at 1$0^{\circ}C$ up to 75 days. Physicochemical, microbiogical, and sensory characteristics of Dongchimi were analyzed at regular intervals of 5 to 7 days during fermentation. Both the degree of pH drop from the initial 6.47~6.54and increase total acid content from the initial 0.004%, with the accumulation of organic acids tended to be more gradual depending upon the amounts of bamboo leaves covered. The increases of total solid content and turbidity were also suppressed in similar patterns, notably after 13 days of fermentation. The growth of total bacteria(1.5$\times$10$^4$cfu/ml, initial)was partly inhibited while that of lactic acid bacteria(1.8$\times$10$^4$cfu/ml, initial)was favorably encouraged by the presence of bamboo leaves. As a result of sensory evaluation, Dong-chimi covered with 1 and 3% bamboo leaves on showed the higher scores significantly(p<0.05, p<0.01, p<0.001) in overall acceptability till 39 days. But after 61 days, those covered with 3 and 5% bamboo leaves were rather preferable than any other one.

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Cu/Ti/SiO2/Si 구조에서 Ti 층 두께가 Ti 반응에 미치는 효과 (Effects of Ti Thickness on Ti Reactions in Cu/Ti/SiO2/Si System upon Annealing)

  • 홍성진;이재갑
    • 한국재료학회지
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    • 제12권11호
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    • pp.889-893
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    • 2002
  • The reactions of $Cu/Ti/SiO_2$ structures at temperatures ranging from 200 to $700^{\circ}C$ have been studied for various Ti thicknesses. The reaction products initially formed, at around $300^{\circ}C$, were a series of Cu-Ti intermetallics ($Cu_3$Ti/CuTi) with the oxygen dissolved in the Ti moving from the compounds into the remaining unreacted Ti. At $500^{\circ}C$, the $Cu_3$Ti was converted into Cu-rich intermetallics, $Cu_4$Ti, which grew at the expense of the CuTi due to the increased oxygen content in the Ti. In addition, the outdiffusion of Ti, to the Cu surface, and the $Ti-SiO_2$ reactions, caused an abrupt increase in the oxygen content in the Ti layer, which placed thermodynamic restraints on further Ti reactions. Furthermore, thinner Ti layers showed a higher increasing rate of oxygen accumulation for the same consumption of Ti, which led to significantly reduced Ti consumption. The $SiO_2$ film under the Ti diffusion barrier was more easily destroyed with increasing Ti thickness.

The Effect of Thermal Annealing Process on Fermi-level Pinning Phenomenon in Metal-Pentacene Junctions

  • Cho, Hang-Il;Park, Jin-Hong
    • 한국진공학회:학술대회논문집
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    • 한국진공학회 2016년도 제50회 동계 정기학술대회 초록집
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    • pp.290.2-290.2
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    • 2016
  • Recently, organic thin-film transistors have been widely researched for organic light-emitting diode panels, memory devices, logic circuits for flexible display because of its virtue of mechanical flexibility, low fabrication cost, low process temperature, and large area production. In order to achieve high performance OTFTs, increase in accumulation carrier mobility is a critical factor. Post-fabrication thermal annealing process has been known as one of the methods to achieve this by improving the crystal quality of organic semiconductor materials In this paper, we researched the properties of pentacene films with X-Ray Diffraction (XRD) and Atomic Force Microscope (AFM) analyses as different annealing temperature in N2 ambient. Electrical characterization of the pentacene based thin film transistor was also conducted by transfer length method (TLM) with different annealing temperature in Al- and Ti-pentacene junctions to confirm the Fermi level pinning phenomenon. For Al- and Ti-pentacene junctions, is was found that as the surface quality of the pentacene films changed as annealing temperature increased, the hole-barrier height (h-BH) that were controlled by Fermi level pinning were effectively reduced.

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Effect of Stress of MgO protecting layer on Discharge Characteristics of AC-PDP

  • Lee, Mi-Jung;Park, Sun-Young;Kim, Soo-Gil;Kim, Hyeong-Joon;Moon, Sung-Hwan;Kim, Jong-Kuk
    • 한국정보디스플레이학회:학술대회논문집
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    • 한국정보디스플레이학회 2004년도 Asia Display / IMID 04
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    • pp.540-543
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    • 2004
  • The stress of MgO thin film, which is used as a dielectric protective layer in AC-PDP, was measured by a laser scanning method. MgO films were deposited bye-beam evaporation on glass substrates with dielectrics layer on them in various deposition temperatures ranging from room temperature to 300 $^{\circ}C$. The compressive stress of MgO films was increased with increasing substrate temperature due to intrinsic stress accumulation, causing the densification of the films. Both firing voltage ($V_f$) and sustaining voltage ($V_s$) were reduced for the higher compressively stressed and densified films. In the other hand, another film properties such as preferred crystallographic orientation and surface roughness seemed not to influence the discharge characteristics of $V_f$ and $V_s$ significantly.

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Analysis of Aerodynamic Performance in an Annular Compressor Bowed Cascade with Large Camber Angles

  • Chen, Shaowen;Chen, Fu
    • International Journal of Fluid Machinery and Systems
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    • 제2권1호
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    • pp.13-20
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    • 2009
  • The effects of positively bowed blade on the aerodynamic performance of annular compressor cascades with large camber angle were experimentally investigated under different incidences. The distributions of the exit total pressure loss and secondary flow vectors of compressor cascades were analyzed. The static pressure was measured by tapping on the cascade surfaces, and the ink-trace flow visualizations were conducted. The results show that the value of the optimum bowed angle and optimum bowed height decrease because of the increased losses at the mid-span with the increase of the caber angle. The C-shape static pressure distribution along the radial direction exists on the suction surface of the straight cascade with large r camber angles. When bowed blade is applied, the larger bowed angle and larger bowed height will further enhance the accumulation of the low-energy fluid at the mid-span, thus deteriorate the flow behavior. Under $60^{\circ}$ camber angle, flow behavior near the end-wall region of some bowed cascades even deteriorates instead of improving because the blockage of the separated flow near the mid-span keeps the low-energy fluid near the end-walls from moving towards the mid-span region, and as a result, a rapid augmentation of the total loss is easy to take place under large bowed angle. With the increase of camber angle, the choice range of bowed angle corresponding to the best performance in different incidences become narrower.

Influence of Modeling Errors in the Boundary Element Analysis of EEG Forward Problems upon the Solution Accuracy

  • Kim, Do-Won;Jung, Young-Jin;Im, Chang-Hwan
    • 대한의용생체공학회:의공학회지
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    • 제30권1호
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    • pp.10-17
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    • 2009
  • Accurate electroencephalography (EEG) forward calculation is of importance for the accurate estimation of neuronal electrical sources. Conventional studies concerning the EEG forward problems have investigated various factors influencing the forward solution accuracy, e.g. tissue conductivity values in head compartments, anisotropic conductivity distribution of a head model, tessellation patterns of boundary element models, the number of elements used for boundary/finite element method (BEM/FEM), and so on. In the present paper, we investigated the influence of modeling errors in the boundary element volume conductor models upon the accuracy of the EEG forward solutions. From our simulation results, we could confirm that accurate construction of boundary element models is one of the key factors in obtaining accurate EEG forward solutions from BEM. Among three boundaries (scalp, outer skull, and inner skull boundary), the solution errors originated from the modeling error in the scalp boundary were most significant. We found that the nonuniform error distribution on the scalp surface is closely related to the electrode configuration and the error distributions on the outer and inner skull boundaries have statistically meaningful similarity to the curvature distributions of the boundary surfaces. Our simulation results also demonstrated that the accumulation of small modeling errors could lead to considerable errors in the EEG source localization. It is expected that our finding can be a useful reference in generating boundary element head models.

Characterizing of Rice Blast Lesion Mimic

  • Lee, Joo-Hee;Jaw, Nam-Soo
    • 한국식물병리학회:학술대회논문집
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    • 한국식물병리학회 2003년도 정기총회 및 추계학술발표회
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    • pp.68.1-68
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    • 2003
  • When plants are infected by plant pathogens, typical disease symptom termed lesion, appears in compatible interaction. Whereas, in incompatible interactions, only small speck of lesions are visible on the leaf surfaces. Hypersensitive response (HR) of plant which is the result of infection by incompatible pathogens, is a well known defense response inducing rapid cell death resulting in complete resistance. However, some rice mutants show spontaneous disease symptoms during the growth stages without interaction with pathogens. We investigated the spontaneous cell death mutant called Blast Lesion Mimic(BLM) generated by EMS mutation, on the relationship with the hypersensitive response as well as resistant characteristics. Accumulation of phenolic compounds were detected around the lesions as lesions develop on leaf surface. Activation of PR gene was detected before the lesion appeared, and that result indicates the defense-related response are started earlier than lesion formation. The BLM mutant showed resistant response to inoculation of Magnaporthe grisea KJ201 with which the wild type Hwacheong is totally susceptible. Informations on the formation of spontaneous lesions and detail analysis of lesion mimic mutants and related genes are very limited to date. It is really important to understand the phenomenon of the defense-related lesion formation for developing resistant cultivar for rice blast pathogens

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