• Journal of ILASS-Korea
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• v.16 no.2
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• pp.69-75
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• 2011

This article presents computational fluid dynamics (CFD) simulations of sub-micron particle movements and flow characteristics in laboratory-scale electrostatic precipitator (ESP) without corona discharge, and for simulation, it uses the commercial CFD program (CFD-ACE) including electrostatic theory and Lagrangian-based equation for sub-micron particle movement. For validation of CFD results, a simple cylindrical type of ESP is simulated and numerical prediction shows fairly good agreement with the analytical solution. In particular, the present study investigates the effect of particle diameter, inlet flow rate, and applied electric potential on particle collection efficiency and compares the numerical prediction with the experimental data, showing good agreement. It is found that the particle collection efficiency decreases with increasing inlet flow rate because the particle detention time becomes shorter, whereas it decreases with the increase in sub-micron particle diameter and with the decrease of applied electric voltage resulting from smaller terminal electrostatic velocity.

• The Korean Journal of Ceramics
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• v.7 no.2
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• pp.70-73
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• 2001

Phase transformation of TiSi$_2$ confined in sub-micron area of which the size is around or smaller than the grain size of C49 TiSi$_2$ phase is studied. It has been known that the C49 to C54 phase change is massive transformation that occurs abruptly starting from C54 nuclei located at triple point grain boundaries of C49 phase. When the C49 phase is confined in sub-micron area, however, the massive phase transformation is observed to be hindered due to the lack of the triple point grain boundaries of C49 phase. Heat treatment at higher temperatures starts to decompose the C49 phase, and the resulting decomposed Ti atoms diffuse to, and react with, the underneath Si material to form C54 phase that exhibits spherical interface with silicon. The newly formed C54 grains can also trigger the massive phase transformation to convert the remaining undecomposed C49 grains to C54 grains by serving as nuclei like conventional C54 nuclei located at triple point grain boundaries.

• The Transactions of the Korean Institute of Electrical Engineers C
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• v.50 no.9
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• pp.466-470
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• 2001

We have developed a sub-micron gap fabrication technology using chemical-mechanical polishing (CMP) without /the sub-micron lithography equipments (0.18∼0.25 7m). And it has been applied to a lateral field emission device (FED), in which narrow gap distance is very important for reducing turn-on voltage. As a result, the turn-on voltage (at which the current level is 1 nA) of the fabricated device with the gap distance of 256 nm is as low as 4.0 V, which is the lowest turn-on voltage among lateral FEDs ever reported.

• Journal of the Korean Institute of Telematics and Electronics
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• v.26 no.9
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• pp.1348-1358
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• 1989

We analyzed electrostatic lens with axi-symmetic configurations using the analytic equation for a single apertured lens. The developed computer code afforded to estimate ion optical properties such as ion trajectories, aberrations and ion beam diameters, and was found to have advantages of a shorter calculation time. The calculated ion optical properties for several types of electrostatic lens were in good agreement with Burghard's ones and it was seem that 20% reduction of ion beam diameter could be obtained by the change of aperture diameters.

• Journal of the Korean institute of surface engineering
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• v.38 no.5
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• pp.198-201
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• 2005

Nickel amalgam was Prepared by the electro-deposition with mercury cathode in a modified Watts bath. Homogeneous nickel amalgam was obtained. The fluidity of the amalgam decreased gradually with increased nickel quantity and become solid finally. Nickel powders of sub-micron size were obtained by a distillation of mercury from the amalgam. The characterization of the nickel amalgam was studied by SEM and x-ray diffractometry.

• Proceedings of the Korean Society for Agricultural Machinery Conference
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• v.10 no.1
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• pp.361-368
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• 2005

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2004.07a
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• pp.421-424
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• 2004

As the deep sub-micron devices are recently integrated high package density, novel process method for sub $0.1{\mu}m$ devices is required to get the superior thin gate oxide characteristics and reliability. However, few have reported on the electrical quality and reliability on the thin gate oxide. In this paper I will recommand a novel shallow trench isolation structure for thin gate oxide $30{\AA}$ of deep sub-micron devices. Different from using normal LOCOS technology, novel shallow trench isolation have a unique 'inverse narrow channel effects' when the channel width of the devices is scaled down shallow trench isolation has less encroachment into the active device area. Based on the research, I could confirm the successful fabrication of shallow trench isolation(STI) structure by the SEM, in addition to thermally stable silicide process was achiever. I also obtained the decrease threshold voltage value of the channel edge and the contact resistance of $13.2[\Omega/cont.]$ at $0.3{\times}0.3{\mu}m^2$. The reliability was measured from dielectric breakdown time, shallow trench isolation structure had tile stable value of $25[%]{\sim}90[%]$ more than 55[sec].

• Progress in Superconductivity
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• v.10 no.2
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• pp.99-102
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• 2009

We report our development of the fabrication process of sub-micron scale $Al-AlO_x-Al$ tunnel junction by using electron-beam lithography and double-angle shadow evaporation technique. We used double-layer resist to construct a suspended bridge structure, and double-angle electron-beam evaporation to form a sub-micron scale overlapped junction. We adopted an e-beam insensitive resist as a bottom sacrificing layer. Tunnel barrier was formed by oxidation of the bottom aluminum layer between the bottom and top electrode deposition, which was done in a separate load-lock chamber. The junction resistance is designed and controlled to be 50 $\Omega$ to match the impedance of the transmission line. The junctions will be used in the broadband shot noise thermometry experiment, which will serve as a link between the electrical unit and the thermodynamic unit.

• Proceedings of the KIEE Conference
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• 1991.07a
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• pp.155-157
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• 1991

This paper describe a Laser CVD technology which realizes planarized interlevel dielectrics in sub-micron VLSI's. This technology comprises sub-micron gap filling with $SiO_2$ films between metal lines. Laser CVD process conditions have been investigated to improve step coverage of interlevel dielectrics. An ArF(193nm) Excimer Laser was used to excite and dissociate gas phase $SiH_4\;and\;N_2O$ molecules. The Laser CVD by $N_2O\;and \;SiH_4$. mixture gases has realized conformal deposition above the temperature of $300^{\circ}C$, as a result sub-micron gaps were buried with $SiO_2$ films.

• Journal of the Korean Institute of Telematics and Electronics A
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• v.31A no.5
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• pp.94-100
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• 1994

The junction failure mechanism of W plugs has not been fully understood while the selective W deposition has been widely used for plugging interconnection lines. In this paper, the thermal stability and junction failure mechanism of sub-micron contacts using selective CVD-W plugs were intensively studied with the metal lines of AISiCu, Ti/AISiCu and TiN/AISiCu. The experimental results showed that the contact chain resistance and leakage current in the AISiCu and Ti/AISiCu metallizations were significantly degraded after annealing. From the SEM analysis, it was found that the junction spiking, due to the Al atoms diffusion along the porous interface between selective CVD-W and contactside wall, caused the junction failure. In constast, there was no degradation of the contact resistance and junction leakage current in TiN/AISiCu metal structu-re. It is believed that the TiN barrier layer could prevent AI(Ti) atoms Fromdiffusing. Therefore, TiN barrier between W plug and Al should be used to impro-ve the thermal stability of sub-micron contacts using the selective CVD-W plugs.