• Applied Microscopy
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• v.34 no.4
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• pp.223-230
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• 2004

To identify the structural basis of mutations that affect synaptic transmission we have begun quantitative ultrastructural descriptions of synapses in cultured Drosophila embryonic neurons. In wild-type cultures, synapses are distinguished by the parallel arrangement of a thickened pre- and post synaptic membrane separated by a synaptic cleft. The presynaptic active zones and postsynaptic densities are defined by electron dense material close to the membrane. Presynaptic regions are also characterized by the presence of one or more electron dense regions, presynaptic densities, around which a variable number of small, clear core synaptic vesicles (mean $35.1{\pm}1.44$ nm in diameter) are clustered. Subsets of these vesicles are in direct contact with either the presynaptic density or the membrane and are considered morphologically docked. A small number of larger, dense core vesicles are also observed in most presynaptic profiles.

• Tunnel and Underground Space
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• v.11 no.2
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• pp.174-181
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• 2001

The cavities created by underground mining, if remained unfilled, can cause ground settlement and surface subsidence as a result of relaxation and breakdown of the carven roof. Construction of structures above the underground mine cavity will have serious problems concerning both structural stability and safely even if the cavity is back-filled. This study was conducted to confirm the location and condition of the cavern as well as the state of the back-fill in A mine area using core logging and borehole camera. The bearing capacity and other mechanical properties of the ground were also measured by the standard penetration test(SPT). Obtained data were used to assess the stability of the ground and the structures to be built by numerical analysis using FLAC. The site investigation results showed that the mine cavities were filled with materials such as boulder and silty sand(SM by unified classification). Result of the numerical analyses indicated that constructing building structures on the over-lying ground above the filled cavities is secure against the potential problems such as surface subsidence and ground settlement.

• International Journal of Highway Engineering
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• v.14 no.5
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• pp.31-45
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• 2012

PURPOSES: In Korea, rapid maintenance of distressed concrete pavement is required to prevent traffic jam of the highway. Asphalt concrete overlay has been used as a general maintenance method of construction for aged concrete pavement. AC overlay on existing concrete pavements experience various early distresses such as reflection crack, pothole and rutting, due to different physical characteristics between asphalt overlay and existing concrete pavement. Bonded concrete overlay(BCO) is a good alternative since it has advantages that can reduce various distresses during the service life since overlay material has similar properties with existing concrete pavements. Recently, BCO which uses the ultra rapid harding cement has been applied for maintenance of highway. BCO has advantage of structural performance since it does monolithic behave with existing pavement. Therefore, it is important to have a suitable bond strength criteria for securing performance of BCO. Bond strength criteria should be larger than normal tensile stress and horizontal shear stress occurred by traffic and environmental loading at bond interface. Normal tensile stress and horizontal shear stress need to estimated for the establishment of practical bond strength criteria. METHODS: This study aimed to estimate the bond stresses at the interface of BCO using the three dimensional finite element analysis. RESULTS: As a result of this study, major failure mode and maximum bond stress are evaluated through the analysis of normal tensile stress and horizontal shear stress for various traffic and environmental load conditions. CONCLUSIONS: It was known that normal tensile stresses are dominated by environmental loading, and, horizontal shear stresses are dominated by traffic loading. In addition, bond failure occurred by both of normal tensile stresses and horizontal shear stresses; however, normal tensile stresses are predominated over horizontal shear stresses.

• Toxicological Research
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• v.24 no.2
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• pp.151-159
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• 2008

Rhus verniciflua Stokes(RVS), one of traditional medicinal plants in Asia, was found to have pharmacological activities such as antioxidative and antiapoptotic effects, raising the possibility for the development of a novel class of anti-cancer drugs. Thus, potential genotoxic effects of RVS in three short-term mutagenicity assays were investigated, which included the Ames assay, in vitro Chromosomal aberration test, and the in vivo Micronucleus assay. In Ames test, the addition of RVS water extracts at doses from 313 up to 5000 mg/plate induced an increase more than 2-fold over vehicle control in the number of revertant colonies in TA98 and TA1537 strains for detecting the frame-shift mutagens. The similar increase in reversion frequency was observed after the addition of RVS ethanol extracts. To assess clastogenic effect, in vitro chromosomal aberration test and in vivo micronucleus assay were performed using Chinese hamster lung cells and male ICR mice, respectively. Both water and ethanol extracts from RVS induced significant increases in the number of metaphases with structural aberrations mostly at concentrations showing the cell survival less than 60% as assessed by in vitro CA test. Also, there was a weak but statistically significant increase in number of micronucleated polychromatic erythrocytes(MNPCEs) in mice treated with water extract at 2000 mg/kg while ethanol extracts of RVS at doses of up to 2000 mg/kg did not induce any statistically significant changes in the incidence of MNPCEs. Therefore, our results lead to conclusion that RVS acts as a genotoxic material based on the available in vitro and in vivo results.

• Magazine of the Korea Concrete Institute
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• v.11 no.1
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• pp.243-254
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• 1999

This paper presents a numerical study for developing the moment magnifier method that is applicable to RC flat plates subject to combined axial compressive and floor load. For the nonlinear finite element analysis, a computer program addressing material and geometric nonlinearities was developed. The flat plates to be studied are designed in accordance with the Direct Design Method in Korean Building Code for Structural Concrete. This paper proposes the buckling force and the moment magnification factor for the flat plate under the governing load condition that is the combined vertical and subsequently applied uniaxial compressive load. The buckling force is defined with two ingredients: the buckling coefficient and the effective flexural rigidity. Parametric studies are performed to investigate variations of the buckling coefficient and the effective flexural rigidity. Based on the numerical results, this paper provides the design values of the buckling coefficient and the effective flexural rigidity, and the design procedure for the moment magnifier method.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2000.04a
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• pp.43-55
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• 2000

In traditional electronic packages the die and the substrate are interconnected with fine wire. Wire bonding technology is limited to bond pads around the peripheral of the die. As the demand for I/O increases, there will be limitations with wire bonding technology. Flip chip technology eliminates the need for wire bonding by redistributing the bond pads over the entire surface of the die. Instead of wires, the die is attached to the substrate utilizing a direct solder connection. Although several steps and processes are eliminated when utilizing flip chip technology, there are several new problems that must be overcome. The main issue is the mismatch in the coefficient of thermal expansion (CTE) of the silicon die and the substrate. This mismatch will cause premature solder Joint failure. This issue can be compensated for by the use of an underfill material between the die and the substrate. Underfill helps to extend the working life of the device by providing environmental protection and structural integrity. Flux residues may interfere with the flow of underfill encapsulants causing gross solder voids and premature failure of the solder connection. Furthermore, flux residues may chemically react with the underfill polymer causing a change in its mechanical and thermal properties. As flip chip packages decrease in size, cleaning becomes more challenging. While package size continues to decrease, the total number of 1/0 continue to increase. As the I/O increases, the array density of the package increases and as the array density increases, the pitch decreases. If the pitch is decreasing, the standoff is also decreasing. This paper will present the keys to successful flip chip cleaning processes. Process parameters such as time, temperature, solvency, and impingement energy required for successful cleaning will be addressed. Flip chip packages will be cleaned and subjected to JEDEC level 3 testing, followed by accelerated stress testing. The devices will then be analyzed using acoustic microscopy and the results and conclusions reported.

• The Journal of the Institute of Internet, Broadcasting and Communication
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• v.16 no.1
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• pp.239-244
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• 2016

The polarization characteristics of polarization-insensitive directional coupler based on double sandwiched rib-type and curved waveguides are explored in detail by using conformal transformation method (CTM) and longitudinal modal transmission-line theory(L-MTLT). To obtain the polarization-insensitive condition of polarization-insensitive curved directional coupler(PI-CDC), the coupling length and coupling efficiency according to the inner radius of PI-CDC are analyzed for quasi-TE and quasi-TM modes. The numerical results show that the PI-CDC with a few micrometer scales can be realized by properly choosing the curvature and structural and material parameters of double sandwiched layers. Furthermore, the mode profiles propagating through PI-CDC are evaluated, and the influence on coupler performance has been investigated.

• Journal of the Korean Crystal Growth and Crystal Technology
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• v.21 no.1
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• pp.27-33
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• 2011

Carbon board, an electromagnetic shielding new material, is expected to be applied to the art wall by combining draft designs. When environment-friendly architecture materials are used as an interior wall, they are suitable as finishing materials. According to the increasing tendency of the application of carbon board, various styles could be made by decorating the whole or a part of a wall with tiles with module structure or by patterning the wall with panel-type woodcut or pictures or sculpture. And more graphic design based on diverse variation, and reconstruction and combination between other motif is being on the rise as a new expression. In this paper, make it possible to applying in MDF board and carbon board pattern design using the woodcut technique. The structural and physical properties were compared by usability of abrasion, toughness, stability. Samples are analyzed dependent on the hardness and relative density, change of detail pattern design and trimming technique. These results have shown that the possibility of applying of carbon board can be a high rank interior materials, capable of creating value of the living system, connects with MDF board, also can express humanism in a beautiful manner.

• Journal of Families and Better Life
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• v.20 no.4
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• pp.149-164
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• 2002

The purpose of this study was to identify the types of social networks of urban housewives according to different network composition patterns and to analyze the structural and functional characteristics of identified types. The data used in this study were collected from 589 full-time housewives residing in Taejeon city. The major findings are as follows: 1) The social networks of housewives in urban nuclear families were classified into eight types: the kin network, the non-kin network, the kin-centered network, the friend-centered network, the neighbor-centered network, the associate-centered network, the parallel network, and the decentralized network. 2) The structual characteristics (size, density, homogeneity, duration, proximity, frequency, closeness, direction) varied according to the type. The kin network type and the non-kin network type showed extreme degrees in network characteristics. The parallel network type and the decentralized network type showed an average level of network characteristics. The kin-, friend-, neighbor-, and the associate-centered types showed network characteristics of an intermediate level between the single-category types and the decentralized type. 3) The average levels of function of social network types were different in only two(service support, interference) of the six function areas(emotional support, service support, material support, information support, social companionship support, interference). The average level of service support by the non-kin network type was higher than other types. The average level of interference by the kin-centered network type was higher than other types, and that of the neighbor-centered network type was lower than other types. On the other hand, the total amount of function performance of social network types was different in all function areas. The total amount of social support given by the decentralized network type was greater than the other types. The total amount of interference given by the non-kin network type was smaller than the other types.

• Transactions on Electrical and Electronic Materials
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• v.18 no.5
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• pp.261-264
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• 2017

$Ni_{0.79}Co_{0.15-x}Cu_xMn_{2.06}O_4$ ($0{\leq}x{\leq}0.09$) thick films were fabricated using the conventional solid-state reaction method and screen-printing method. Structural and electrical properties of specimens based on the amount of Cu were observed in order to investigate their applicability in the infrared detector. All specimens showed a single spinel phase with a homogeneous cubic structure. As the amount of Cu increased, the average grain size increased and was found to be approximately $5.01{\mu}m$ for the $Ni_{0.79}Co_{0.06}Cu_{0.09}Mn_{2.06}O_4$ specimen. The thickness of all specimens was approximately $55{\sim}56{\mu}m$. As Cu content increased, the resistivity and TCR properties at room temperature decreased, and these values for the $Ni_{0.79}Co_{0.06}Cu_{0.09}Mn_{2.06}O_4$ specimen were $502{\Omega}-cm$ and $-3.32%/^{\circ}C$, respectively. The responsivity and noise properties decreased with an increase in Cu content, with the specimen with a Cu content of x=0.09 showing 0.0183 V/W and $5.21{\times}10^{-5}V$, respectively.