• The Journal of Korean Institute of Electromagnetic Engineering and Science
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• v.13 no.7
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• pp.667-678
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• 2002

In this paper, a new radiating structure with a multi-layered two-dimensional metallic disk array was proposed for shaping the flat-topped element pattern. It is an infinite periodic planar array structure with metallic disks finitely stacked above the radiating circular waveguide apertures. The theoretical analysis was in detail performed using rigid full-wave analysis, and was based on modal representations for the fields in the partial regions of the array structure and for the currents on the metallic disks. The final system of linear algebraic equations was derived using the orthogonal property of vector wave functions, mode-matching method, boundary conditions and Galerkin's method, and also their unknown modal coefficients needed for calculation of the array characteristics were determined by Gauss elimination method. The application of the algorithm was demonstrated in an array design for shaping the flat-topped element patterns of $\pm$20$^{\circ}$ beam width in Ka-band. The optimal design parameters normalized by a wavelength for general applications are presented, which are obtained through optimization process on the basis of simulation and design experience. A Ka-band experimental breadboard with symmetric nineteen elements was fabricated to compare simulation results with experimental results. The metallic disks array structure stacked above the radiating circular waveguide apertures was realized using ion-beam deposition method on thin polymer films. It was shown that the calculated and measured element patterns of the breadboard were in very close agreement within the beam scanning range. The result analysis for side lobe and grating lobe was done, and also a blindness phenomenon was discussed, which may cause by multi-layered metallic disk structure at the broadside. Input VSWR of the breadboard was less than 1.14, and its gains measured at 29.0 GHz. 29.5 GHz and 30 GHz were 10.2 dB, 10.0 dB and 10.7 dB, respectively. The experimental and simulation results showed that the proposed multi-layered metallic disk array structure could shape the efficient flat-topped element pattern.

• Journal of the Microelectronics and Packaging Society
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• v.27 no.3
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• pp.49-54
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• 2020

To attach a stretchable/flexible electrode to something or something to on electrode, conductive adhesives must be stretchable/flexible to suit the properties of the electrode. In particular, conductive adhesive require durability and heat resistance, and unlike conventional adhesives, they should also have conductivity. To this end, Epoxy, which has good strength and adhesion, was selected as an adhesive, and a plasticizer and a reinforcement were mixed instead of a two-liquid material consisting of a conventional theme and a hardener, and a four-liquid material was used to give stretchability/flexibility to high molecules. The conductive filler was selected as silver, a material with low resistance, and for high conductivity, three shapes of Ag particles were used to increase packing density. Conductivity was compared with these developed conductive adhesives and two epoxy-based conductive adhesives being sold in practice, and about 10 times better conductivity results were obtained than products being actually sold. In addition, conductivity, mechanical properties, adhesion and strength were evaluated according to the presence of plasticizers and reinforcement agent. There was also no problem with 60% tensile after 5 minutes of curing at 120℃, and pencil hardness was excellently measured at 6H. As a result of checking the adhesion of electrodes through 3M tape test, all of them showed excellent results regardless of the mixing ratio of binders. After attaching the Cu sheet on top of the electrode through conductive adhesive, the contact resistance was checked and showed excellent performance with 0.3 Ω.

• Journal of the Microelectronics and Packaging Society
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• v.20 no.3
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• pp.23-29
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• 2013

Development of flexible electronic devices has primarily focused on printing technology using organic materials. However, organic-based flexible electronics have several disadvantages, including low electrical performance and long-term reliability. Therefore, we fabricated nano- and micro-thick silicon film attached to the polymer substrate using transfer printing technology to investigate the feasibility of silicon-based flexible electronic devices with high performance and high flexibility. Flexibility of the fabricated samples was investigated using bending and stretching tests. The failure bending radius of the 200 nm-thick silicon film attached on a PI substrate was 4.5 mm, and the failure stretching strain was 1.8%. The failure bending radius of the micro-thick silicon film attached on a FPCB was 2 mm, and the failure strain was 3.5%, which showed superior flexibility compared with conventional silicon material. Improved flexibility was attributed to a buffering effect of the adhesive between the silicon film and the substrate. The superior flexibility of the thin silicon film demonstrates the possibility for flexible electronic devices with high performance.