• Journal of the Korean Geotechnical Society
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• v.30 no.4
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• pp.35-45
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• 2014

Limit equilibrium methods of slope stability analysis have been widely adopted mainly due to their simplicity and applicability. However, the conventional methods may not give reliable and convincing results for various geological conditions such as nonhomogeneous and anisotropic soils. Also, they do not take into account soil slope history nor the initial state of stress, for example excavation or fill placement. In contrast to the limit equilibrium analysis, the analysis of deformation and stress distribution by finite element method can deal with the complex loading sequence and the growth of inelastic zone with time. This paper proposes a technique to determine the critical slip surface as well as to calculate the factor of safety for shallow failure on partially saturated soil slope. Based on the effective stress field in finite element analysis, all stresses are estimated at each Gaussian point of elements. The search strategy for a noncircular critical slip surface along weak points is appropriate for rainfall-induced shallow slope failure. The change of unit weight by seepage force has an effect on the horizontal and vertical displacements on the soil slope. The Drucker-Prager failure criterion was adopted for stress-strain relation to calculate coupling hydraulic and mechanical behavior of the partially saturated soil slope.

• Geotechnical Engineering
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• v.12 no.4
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• pp.157-178
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• 1996

Current design methods for reinforced earth structures take no account of the magnitude of the strains induced in the tensile members as these are invariably manufactured from high modulus materials, such as steel, where straits are unlikely to be significant. With fabrics, however, large strains may frequently be induced and it is important to determine these to enable the stability of the structure to be assessed. In the present paper internal design method of analysis relating to the use of fabric reinforcements in reinforced earth structures for both stress and strain considerations is presented. For the internal stability analysis against rupture and pullout of the fabric reinforcements, a strain compatibility analysis procedure that considers the effects of reinforcement stiffness, relative movement between the soil and reinforcements, and compaction-induced stresses as studied by Ehrlich 8l Mitchell is used. I Bowever, the soil-reinforcement interaction is modeled by relating nonlinear elastic soil behavior to nonlinear response of the reinforcement. The soil constitutive model used is a modified vertsion of the hyperbolic soil model and compaction stress model proposed by Duncan et at., and iterative step-loading approach is used to take nonlinear soil behavior into consideration. The effects of seepage pressures are also dealt with in the proposed method of analy For purposes of assessing the strain behavior oi the fabric reinforcements, nonlinear model of hyperbolic form describing the load-extension relation of fabrics is employed. A procedure for specifying the strength characteristics of paraweb polyester fibre multicord, needle punched non-woven geotHxtile and knitted polyester geogrid is also described which may provide a more convenient procedure for incorporating the fablic properties into the prediction of fabric deformations. An attempt to define improvement in bond-linkage at the interconnecting nodes of the fabric reinforced earth stracture due to the confining stress is further made. The proposed method of analysis has been applied to estimate the maximum tensions, deformations and strains of the fabric reinforcements. The results are then compared with those of finite element analysis and experimental tests, and show in general good agreements indicating the effectiveness of the proposed method of analysis. Analytical parametric studies are also carried out to investigate the effects of relative soil-fabric reinforcement stiffness, locked-in stresses, compaction load and seepage pressures on the magnitude and variation of the fabric deformations.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2006.05a
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• pp.57-58
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• 2006

The effects of lowering ECAP temperature during ECAP process and Post-ECAP annealing on microstructure, texture and mechanical properties of the AZ31 alloys have been investigated in the present study. The as-extruded materials were ECAP processed to 2 passes at 553K prior to subsequent pressing up to 6 passes at 523K or 493K. When this method of lowering ECAP temperature during ECAP was used, the rods could be successfully deformed up to 6 passes without any surface cracking. Grain refinement during ECAP process at 553K might have helped the material to endure further straining at lower deformation temperatures probably by increasing the strain accommodation effect by grain boundary sliding, causing stress relaxation. Texture modification during ECAP has a great influence on the strength of Mg alloys because HCP metals have limited number of slip systems. As slip is most prone to take place on basal planes in Mg at room temperature, the rotation of high fraction of basal planes to the directions favorable for slip as in ECAP decreases the yield stress appreciably. The strength of AZ31 Mg alloys increases with decrease of grain size if the texture is constant though ECAP deformation history is different. A standard positive strength dependence on the grain size for Mg alloys with the similar texture (Fig. 1) supports that the softening of ECAPed Mg alloys (a negative slope) typically observed despite the significant grain refinement is due to the texture modification where the rotation of basal planes occurs towards the orientation for easier slip. It could be predicted that if the original fiber texture is restored after ECAP treatment yielding marked grain refinement, yield stress as high as 500 MPa will be obtained at the grain size of ${\sim}1{\mu}m$. Differential speed rolling (DSR) with a high speed ratio between the upper and lower rolls was applied to alter the microstructure and texture of the AZ31 sheets. Significant grain refinement took place during the rolling owing to introduction of large shear deformation. Grain size as small as $1.4{\mu}m$ could be obtained at 423K after DSR. There was a good correlation between the (0002) pole intensity and tensile elongation. This result indicates that tensile ductility improvement in the asymmetrically rolled AZ31 Mg alloys is closely related to the weakening of basal texture during DSR. Further basal texture weakening occurred during annealing after DSR. According to Hall-Petch relation shown in Fig. 1, the strength of the asymmetrically rolled AZ31 is lower than that of the symmetrically rolled one when compared at the same grain size. This result was attributed to weakening of fiber texture during DSR. The DSRed AZ31, however, shows higher strength than the ECAPed AZ31 where texture has been completely replaced by a new texture associated with high Schmid factors.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2004.09a
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• pp.233-241
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• 2004

A new alloy definition will be presented concerning increasing demands for the board level reliability of miniaturized interconnections. The damage mechanism for LFBGA components on different board finishes is not quite understood. Further demands from mobile phones are the drop test, characterizing interface performance of different package constructions in relation to decreased pad constructions and therefore interfaces. The paper discusses the characterization of interfaces based on SnPb, SnPbXYZ, SnAgCu and SnAgCuInNd ball materials and SnAgCuInNd as solder paste, the stability after accelerated tests and the description of modified interfaces strictly related to the assembly conditions, dissolution behavior of finishes on board side and the influence of intermetallic formation. The type of intermetallic as well as the quantity of intermetallics are observed, primaliry the hardness, E modules describing the ability of strain/stress compensation. First results of board level reliability are presented after TCT-40/+150. Improvement steps from the ball formulation will be discussed in conjunction to the implementation of lead free materials In order to optimize ball materials for area array devices accelareted aging conditions like TCTs were used to analyze the board level reliability of different ball materials for BGA, LFBGA, CSP, Flip Chip. The paper outlines lead-free ball analysis in comparison to conventional solder balls for BGA and chip size packages. The important points of interest are the description of processability related to existing ball attach procedures, requirements of interconnection properties and the knowledge gained the board level reliability. Both are the primary acceptance criteria for implementation. Knowledge about melting characteristic, surface tension depend on temperature and organic vehicles, wetting behavior, electrical conductivity, thermal conductivity, specific heat, mechanical strength, creep and relaxation properties, interactions to preferred finishes (minor impurities), intermetallic growth, content of IMC, brittleness depend on solved elements/IMC, fatigue resistance, damage mechanism, affinity against oxygen, reduction potential, decontamination efforts, endo-/exothermic reactions, diffusion properties related to finishes or bare materials, isothermal fatigue, thermo-cyclic fatigue, corrosion properties, lifetime prediction based on board level results, compatibility with rework/repair solders, rework temperatures of modified solders (Impurities, change in the melting point or range), compatibility to components and laminates.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2004.09a
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• pp.211-219
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• 2004

A new alloy definition will be presented concerning increasing demands for the board level reliability of miniaturized interconnections. The damage mechanism for LFBGA components on different board finishes is not quite understood. Further demands from mobile phones are the drop test, characterizing interface performance of different package constructions in relation to decreased pad constructions and therefore interfaces. The paper discusses the characterization of interfaces based on SnPb, SnPbXYZ, SnAgCu and SnAgCuInNd ball materials and SnAgCuInNd as solder paste, the stability after accelerated tests and the description of modified interfaces stric시y related to the assembly conditions, dissolution behavior of finishes on board side and the influence of intermetallic formation. The type of intermetallic as well as the quantity of intermetallics are observed, primaliry the hardness, E modules describing the ability of strain/stress compensation. First results of board level reliability are presented after TCT-40/+150. Improvement steps from the ball formulation will be discussed in conjunction to the implementation of lead free materials. In order to optimize ball materials for area array devices accelareted aging conditions like TCTs were used to analyze the board level reliability of different ball materials for BGA, LFBGA, CSP, Flip Chip. The paper outlines lead-free ball analysis in comparison to conventional solder balls for BGA and chip size packages. The important points of interest are the description of processability related to existing ball attach procedures, requirements of interconnection properties and the knowledge gained the board level reliability. Both are the primary acceptance criteria for implementation. Knowledge about melting characteristic, surface tension depend on temperature and organic vehicles, wetting behavior, electrical conductivity, thermal conductivity, specific heat, mechanical strength, creep and relaxation properties, interactions to preferred finishes (minor impurities), intermetallic growth, content of IMC, brittleness depend on solved elements/IMC, fatigue resistance, damage mechanism, affinity against oxygen, reduction potential, decontamination efforts, endo-/exothermic reactions, diffusion properties related to finishes or bare materials, isothermal fatigue, thermo-cyclic fatigue, corrosion properties, lifetime prediction based on board level results, compatibility with rework/repair solders, rework temperatures of modified solders (Impurities, change in the melting point or range), compatibility to components and laminates.

• Proceedings of the Korean Geotechical Society Conference
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• 2010.09a
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• pp.553-558
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• 2010

The behavior of composite piles composed of steel pipe pile in the upper part and concrete pile in the lower part by a mechanical splicing joint was examined by field lateral load tests and bending tests. A total of 7 piles including two instrumented piles for bending test were installed. The soil profile consists of soft clay with weak silt with shallow groundwater level. Laboratory tests were carried out to determine the basic soil characteristics and the strength parameters. This paper presents the composite pile behavior with various portions of the upper steel pile: 0, 20, 30, and 45% of the pile embedded pile length. Three-point bending tests were performed to investigate the stress-strain relation at the mechanical joint. Based on these test results, the behavior of composite piles with various upper steel pile length are evaluated and the stability of mechanical joints are examined. Through comparisons with results of field load tests, it was found that lateral load carrying capacity of the composite piles increased and deflections of the composite piles decreased with increasing the upper steel piles. The mechanical joint was proved to retain its structural stability against the tested load conditions. Economical benefits of composite pile of this kind can be gained by setting adequately the length of the upper steel pipe piles.

• Structural Engineering and Mechanics
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• v.53 no.5
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• pp.997-1016
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• 2015

The contribution of tensioned concrete between cracks (tension-stiffening) cannot be ignored when analysing deformation of reinforced concrete elements. The tension-stiffening effect is crucial when it comes to adequately estimating the load-deformation response of steel reinforced concrete and the more recently appeared fibre reinforced polymer (FRP) reinforced concrete. This paper presents a unified methodology for numerical modelling of the tension-stiffening effect in steel as well as FRP reinforced flexural members using the concept of equivalent deformation modulus and the smeared crack approach to obtain a modified stress-strain relation of the reinforcement. A closed-form solution for the equivalent secant modulus of deformation of the tensioned reinforcement is proposed for rectangular sections taking the Eurocode 2 curvature prediction technique as the reference. Using equations based on general principles of structural mechanics, the main influencing parameters are obtained. It is found that the ratio between the equivalent stiffness and the initial stiffness basically depends on the product of the modular ratio and reinforcement ratio ($n{\rho}$), the effective-to-total depth ratio (d/h), and the level of loading. The proposed methodology is adequate for numerical modelling of tension-stiffening for different FRP and steel reinforcement, under both service and ultimate conditions. Comparison of the predicted and experimental data obtained by the authors indicates that the proposed methodology is capable to adequately model the tension-stiffening effect in beams reinforced with FRP or steel bars within wide range of loading.

• Journal of the Korean Society for Aeronautical & Space Sciences
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• v.35 no.2
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• pp.101-106
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• 2007

The optical performance of the mirror for satellite camera is highly dependent on the adhesive properties between the mirror and its support. Therefore, in order to design a mirror with high optical performance, the mechanical properties of adhesives should be well defined. In this paper, the mechanical properties of three kinds of space adhesives are studied. Elastic moduli of the adhesives are determined by tensile tests. Stress-strain relation is obtained by using exponential curve fitting for the adhesive which shows non-linear behavior. In case of the linear behavior material, elastic modulus is calculated through linear curve fitting. For the tensile tests, several points have been selected in the operating temperature range of the adhesive. The elastic modulus of each adhesive is expressed as a function of temperature. Characteristics of the adhesives are discussed regarding their temperature sensitivity.

• Korean Journal of Human Ecology
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• v.9 no.1
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• pp.51-61
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• 2006

The purpose of this study is to examine the relation between the trend of art and fashion which predominate a certain time. In order to achieve this goal, this study intends to analyze how plasticity found in Mondrian's pictures are applied to modern fashion with its focus on formative elements. Mondrian was ahead of abstractionism, a major trend of contemporary art, and defined the theory of neo-plasticism. The theory of neo-plasticism defined by Mondrian is characterized by the limited expression of lines and shapes by using only vertical and horizontal straight lines, and right angles and four-sided figures weaved by the lines, and the use of achromatic color(black, white, and gray) in three primary colors(red, blue, and yellow). Based on his theory, he fully displayed the world of geometric abstraction. Mondrian's formative elements which have been applied in modern fashion can be divided into shape and color, For the element of shape, first, horizontal and vertical lines have been applied to patterns, trimmings, detail, and plane of textiles through simplification of design, representing proportion, balance, and stress in a silhouette, Second, plane and diamond shapes made of horizontal and vertical lines have been applied to textiles or patterns with uniqueness. For the element of color, first, three primary colors and achromatic colors are used to seek the aesthetics of balance and harmony that are produced in the strain of conflict through brightness, chroma, and complementary colors, Second, primary colors of high chroma and brightness which are much stronger than pictures are used to express a modern sense. Formative elements of neo-plasticism, which have been applied to modern fashion suggested by this study, are connected with the trend of art contemporary designers have borrowed, Accordingly, this study will become a very helpful material which provides designers with original ideas in developing materials and patterns which connect design with art.

• Journal of Korean Society of Steel Construction
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• v.20 no.2
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• pp.279-288
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• 2008

In this study, the slip behavior of high-tension bolted joints subjected to compression force is investigated through 3D finite element analysis and experiments. The relation with sliding load, bolt deformation, and failure load are studied with the metal thickness affecting the bolted joint. The post-sliding behavior considering bolt stiffness is presented and compared with the results by finite element and experiments. The finite element model is constructed by solid elements in ABAQUS, in consideration of all the friction effects between metal plates and bolts. The stress-strain relations in the literature are used, and the sliding displacements and axial stresses around the bolt connection are investigated. The flexural buckling of species happened when the plate thickness is less than the bolt diameter. However, the shear failures of bolt occurred in the opposite case.