• Title/Summary/Keyword: stress-sensor

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Relationship between Stress Level and Reworks for Construction Professionals

  • Chae, Jeonghyeun;Kang, Youngcheol
    • International conference on construction engineering and project management
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    • 2020.12a
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    • pp.169-178
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    • 2020
  • This paper presents a study investigating the relationship between stress level and reworks for construction professionals. As employees' work-life balance (WLB) becomes more important nowadays, controlling the level of stress in the workplace becomes more important as occupational stress has negative impacts on WLB. Reworks can be one severe occupational stressor as people suffer from stress when they need to redo their works. This study hypothesizes that there is a positive correlation between reworks and level of stress, meaning that people tend to show high level of stress when they need to redo their works. The hypothesis will be tested by checking the stress level when engineers redo their works because of changes or errors. An electroencephalography (EEG) sensor will be used to measure the stress level of engineers when they redo their works. For more accurate measure of stress, the stress level will also be measured by the galvanic skin response (GSR). This experiment is expected to prove that rework process is a severe stressor for construction professionals, which will contribute to lower productivity and poorer WLB. The finding will emphasize the importance of managing reworks in the construction industry, which will eventually help construction managers to control the level of employees' stress successfully.

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Miniature Ultrasonic and Tactile Sensors for Dexterous Robot

  • Okuyama, Masanori;Yamashita, Kaoru;Noda, Minoru;Sohgawa, Masayuki;Kanashima, Takeshi;Noma, Haruo
    • Transactions on Electrical and Electronic Materials
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    • v.13 no.5
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    • pp.215-220
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    • 2012
  • Miniature ultrasonic and tactile sensors on Si substrate have been proposed, fabricated and characterized to detect objects for a dexterous robot. The ultrasonic sensor consists of piezoelectric PZT thin film on a Pt/Ti/$SiO_2$ and/or Si diaphragm fabricated using a micromachining technique; the ultrasonic sensor detects the piezoelectric voltage as an ultrasonic wave. The sensitivity has been enhanced by improving the device structure, and the resonant frequency in the array sensor has been equalized. Position detection has been carried out by using a sensor array with high sensitivity and uniform resonant frequency. The tactile sensor consists of four or three warped cantilevers which have NiCr or $Si:B^+$ piezoresistive layer for stress detection. Normal and shear stresses can be estimated by calculation using resistance changes of the piezoresitive layers on the cantilevers. Gripping state has been identified by using the tactile sensor which is installed on finger of a robot hand, and friction of objects has been measured by slipping the sensor.

Development of a Digital Device for Measuring Soil Physical Properties (I) - Digital Shear Stress Sensor - (토양 물리성 측정을 위한 디지털 장치 개발(I) - 디지털 전단저항 측정장치 -)

  • Park, Jun-Gul;Lee, Kyou-Seung;Cho, Seung-Chan;Lee, Dong-Hoon;Chang, Young-Chang;Noh, Kwang-Mo
    • Journal of Biosystems Engineering
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    • v.33 no.6
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    • pp.416-422
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    • 2008
  • This study was performed to design and construct a digital soil shear stress sensor in order to replace the conventional devices for measuring soil shear property. The developed digital shear stress measuring device can store measured data with GPS position information as a vector format into a computer. Based on the experiments at various field conditions, the measuring characteristic of the device was quite similar to that of a conventional device, SR-2 that has been a major tool to measure the soil shear property. It was concluded that the digital shear stress measuring device was an effective and comprehensive sensor for measuring soil shear property.

Signal Characteristics of Fiber Bragg Grating Sensor with Gage Length (광섬유 브래그 격자 센서의 게이지 길이에 따른 신호 특성)

  • 강동훈;김대현;방형준;홍창선;김천곤
    • Proceedings of the Korean Society For Composite Materials Conference
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    • 2002.10a
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    • pp.155-160
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    • 2002
  • A new fabrication method of FBG sensor with gage length shorter than 10 mm is introduced using the reflection prism with special coating on the surface. It is verified that the bandwidth of FBG sensor increases exponentially as the gage length of it decreases. The transverse stress and strain gradient induced by local stress concentration which occurs during curing has an influence on the FBG sensor with gage length of 2 mm less than that of 10 mm.

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Stress estimation of exposed gas pipeline using MEMS wireless tilt sensor (MEMS 무선 기울기 센서를 이용한 노출 배관 응력 추정)

  • Kim, Tack-Keun;Kang, In-Goo;Shin, Dong-Hoon;Chung, Tae-Yong;Nam, Jin-Hyun;Lim, Si-Hyung
    • Proceedings of the SAREK Conference
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    • 2009.06a
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    • pp.404-408
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    • 2009
  • Gas pipelines in bridges, roads and subway construction sections can undergo abrupt stress and vibration changes. To protect human life from any gas leakage accidents induced by the abrupt stress and vibration, the gas pipeline system needs to be continuously monitored. The estimation method of pipeline stress using MEMS wireless tilt sensor has been developed and its validity has been evaluated using a lab test bench.

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Dispersive Wave Analysis of a Beam under Impact Load by Piezo-Electric Film Sensor and Wavelet Transform (충격하중을 받는 보에서 압전 필름센서와 웨이브렛 변환을 이용한 문산파동의 해석)

  • Kwon., Il-Bum;Choi, Man-Yong;Jeong., Hyun-Jo
    • Journal of the Korea institute for structural maintenance and inspection
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    • v.5 no.4
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    • pp.215-225
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    • 2001
  • Stress waves monitored on the surface of structures under various loading conditions can provide useful information on the structural health status. In this paper, stress waves are measured by several sensors when a steel beam is impacted by a ball drop. The sensors used include the piezo-electric film Sensor, the electrical strain gage, and the ultrasonic transducer, and special attention is given to the pieza film sensor. The wavelet transform is used for the time-frequency analysis of dispersive waves propagating in the beam. The velocities of the wave produced in the team due to the lateral impact is found to be frequency-dependent and identified as the flexural wave velocity based on the comparisons with the Timoshenko beam theory. A linear impact site identification method is developed using the flexural wave, and the impact sites of the beam can be accurately estimated by the piezo film sensors. It is found that the piezo film sensor is appropriate for sensing stress waves due to impact and for locating impact sites in the beam.

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Finite Element Analysis of Packaging Shape for Pulse Diagnosis Sensor (FEM 분석을 통한 맥진센서모듈의 패키징 형태와 응력분포)

  • Shin, Ki-Young;Lee, Sang-Sik;Joo, Su-Bin
    • The Journal of Korea Institute of Information, Electronics, and Communication Technology
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    • v.4 no.3
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    • pp.167-173
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    • 2011
  • Since many blood pressure pulse analyzer made to measurement of a pulse wave in quantitative way has been started, some sorts of pressure sensors are being developed. The result could differ and this cause either type of sensor or module shape, when pulse wave is measured. In this paper, calculate and compare the pressure sensor's stress distribution according to thickness of PDMS coating and existence of guide through Finite Element Method. As a result, the center of pressure sensor's stress increase as much as 24% as it is reduced as much as 0.3 mm that the PDMS coating thichness of pulse diagnostic sensor module, on the other hand the surrouding censor of center sensor's stress is reduced as much as 4.9%, and transmissive proportion of stress is small as little as 2.7%, When coating has guide.

Evaluation of the Residual Stress with Respect to Supporting Type of Multi-layer Thin Film for the Metallization of Pressure Sensor (압력센서의 배선을 위한 다층 박막의 지지조건 변화에 따른 잔류응력 평가)

  • Shim, Jae-Joon;Han, Geun-Jo;Han, Dong-Seup
    • Transactions of the Korean Society of Mechanical Engineers A
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    • v.28 no.5
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    • pp.532-538
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    • 2004
  • MEMS technology applying to the sensors and micro-electro devices is complete system. These microsystems are made by variable processes. Especially, the mentallization process has very important functions to transfer the power operating the sensor and signal induced from sensor part. But in the structures of MEMS the local stress concentration and deformation are often yielded by an irregular geometrical shape and different constraint. Therefore, this paper studies the effect of supporting type and thickness ratio about thin film of the substrate on the residual stress variation when the thermal loads is applied to the multi-layer thin film fabricated by metallization process. Specimens were made from several materials such as Al, Au and Cu. Then, uniform thermal load was applied, repeatedly. The residual stress was measured by FE Analysis and nano-indentation method using AFM. Generally, the specimen made of Al induced the larger residual stress than that of made of other materials. Specimen made of Cu and Au having the low thermal expansion coefficient induces the minimum residual stress. Similarly, the lowest indentation length was measured by nano-indentation method in the Si/Au/Cu specimen. Particularly, clusters are created in the specimen made of Cu by thermal load and the indentation length became increasingly large by cluster formation.

The Method of Determining Stress Levels Regarding the Electrical ALT through Optical Temperature Sensor

  • Ryu, Haeng-Soo;Han, Gyu-Hwan;Yoon, Nam-Sik
    • Journal of Electrical Engineering and Technology
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    • v.3 no.2
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    • pp.184-191
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    • 2008
  • Electrical endurance is the critical characteristic of Magnetic contactors(MCs), which are widely used in such power equipment as elevators, cranes, and factory control rooms in order to close and open control circuits. Testing time, however, is not short in typical cases in which some method of reducing the testing period is required. This study shows the method of determining the stress level of electrical ALT(Accelerated Life Test) through optical temperature sensor and the relationship between 0.05 s and 0.1 s for on-time. The tool used for analyzing the test result is MINITAB. I will propose the method of determining the optimized stress level through optical temperature sensor, which will contribute to minimize the testing time and development period and also raise the product reliability.

Electrical stabilities of half-Corbino thin-film transistors with different gate geometries

  • Jung, Hyun-Seung;Choi, Keun-Yeong;Lee, Ho-Jin
    • Journal of Information Display
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    • v.13 no.1
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    • pp.51-54
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    • 2012
  • In this study, the bias-temperature stress and current-temperature stress induced by the electrical stabilities of half-Corbino hydrogenated-amorphous-silicon (a-Si:H) thin-film transistors (TFTs) with different gate electrode geometries fabricated on the same substrate were examined. The influence of the gate pattern on the threshold voltage shift of the half-Corbino a-Si:H TFTs is discussed in this paper. The results indicate that the half-Corbino a-Si:H TFT with a patterned gate electrode has enhanced power efficiency and improved aperture ratio when compared with the half-Corbino a-Si:H TFT with an unpatterned gate electrode and the same source/drain electrode geometry.