• 제목/요약/키워드: stress-sensor

검색결과 451건 처리시간 0.028초

만성스트레스 검출을 위한 멀티 센서시스템 연구 (A Study on Multi-Sensor System for Detection of Chronic Mild Stress)

  • 이지형;김경호
    • 전기학회논문지
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    • 제59권6호
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    • pp.1131-1135
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    • 2010
  • The development of modern civilization result from the abundance of material. Yet modern people live with chronic mild stress. Excessive chronic mild stress leads to various diseases. From the risk of the disease in order to protect our bodies need to manage chronic mild stress. The purpose of this study is to inspection the effectiveness of detecting in chronic mild stress using the Multi-sensor system. The Multi-sensor system is designed that can be measure three kinds of vital signals of chronic mild stress for the detection. First Photoplethysmogram(PPG), second Electro Dermal Activity(EDA), third Skin Temperature(SKT). The ages and occupations exposed to chronic mild stress, people often use out of this system was applied to dairy products(Pen). In addition, vital signals that occur when the variety of noise was used to remove the accelerometer. Chronic mild stress by the analysis of measured vital signals from Multi-sensor system to the measurement information to a PC to a wireless transmission(Bluetooth). In this study, using Multi-sensor system writing conditions and a variety of situations in the movement to measure vital signals and measurement results verified the accuracy and reliability. Through this measure chronic mild stress in everyday life and managing to maintain will help more healthy lifestyle.

Study on Stress Transfer Property for Embedded FBG Strain Sensors in Concrete Monitoring

  • Jang, Il-Young;Yun, Ying-Wei
    • International Journal of Concrete Structures and Materials
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    • 제3권1호
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    • pp.33-37
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    • 2009
  • Fiber Bragg grating (FBG) sensors already have been the focus for structural health monitoring (SHM) due to their distinguishing advantages. However, as bare optical fiber is very fragile, bare FBG strain sensor without encapsulation can not properly be applied in practical infrastructures. Therefore encapsulation techniques for making encapsulated FBG strain sensor show very important in pushing forward the application of FBG strain sensors in SHM. In this paper, a simplified approximate method to analyze the stress transferring rules for embedded FBG strain sensors in concrete monitoring is put forward according to mechanics of composite materials. Shear lag theory is applied to analyze the stress transferring rule of embedded FBG strain sensor in measured host material at the first time. The measured host objects (concrete) and the encapsulated FBG strain sensor are regarded as a composite, and then the stress transfer formula and stress transfer coefficient of encapsulated FBG strain sensor are obtained.

A Study on Shear-stress Calibration by the Mid-point Measurements in +45/-45 Degree Semiconductor Resistor-pair

  • Cho, Chun-Hyung;Cha, Ho-Young;Sung, Hyuk-Kee
    • JSTS:Journal of Semiconductor Technology and Science
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    • 제17권2호
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    • pp.180-185
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    • 2017
  • In this research, we proposed the simple and efficient method to calculate the shear stresses by using the mid-point measurements in ${\pm}45^{\circ}$ semiconductor resistor-sensor pair. Compared to the previous works, the measurements became much simpler by combining the approximation theory with the technique of mid-point measurement. In addition, we proposed another novel method for the stress calculation in which we could increase the sensitivity of the stress sensor by controlling the applied voltage between the sensor-pair. For the applied voltage of 8 V, the sensitivity showed a significant increase by 100%.

압전필름센서에 의한 구조물의 응력집중의 측정 (Measurement of Structural Stress Concentration by PVDF Film Sensors)

  • 권일범;김치엽;최만용;임종묵;김인걸
    • 한국구조물진단유지관리공학회 논문집
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    • 제4권4호
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    • pp.109-119
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    • 2000
  • PVDF film sensor was applied to measure the stress concentration for monitoring the structural integrity. The strain calibration of this film sensor was performed by the bending test of aluminum beam. The PVDF sensor and the electrical strain gage were bonded on the beam. When the beam was loaded, the output of electrical strain gage was compared with the output of the PVDF sensor. The waveform of PVDF sensor output was shown as the same form of the output of electrical strain gage. The gain was determined as 1.7 by comparing these two signals to determine the exact value of the strain. In order to experiment the stress concentration, the stress field was analyzed by finite element analysis. The tensile test of notched steel specimens was conducted to develop the measurement technique of stress concentration. The output voltage ratio between the PVDF sensor near the notch and the PVDF sensor far from the notch could give the information about the load bearing capacity of steel specimen.

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자기이방성센서를 이용한 강판의 비파괴 응력 계측에 관한 연구 (A Study on Non-destructive Stress Measurement of Steel Plate using a Magnetic Anisotropy Sensor)

  • 김대성;문홍득;유지형
    • 한국지반환경공학회 논문집
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    • 제12권11호
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    • pp.71-77
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    • 2011
  • 최근 들어 자기이방성센서를 이용한 비파괴응력계측기법은 강교나 강관 등의 건설 분야에서 적용되어지고 있다. 또한 터널건설현장에서 이용되는 강지보재에 대해서도 적용한 사례가 있다. 본 연구에서는 일본에서 개발된 자기이방성센서와 스트레인 게이지를 이용하여 국산 강재인 SS400에 적합한 응력감도곡선을 도출하기 위해 강재하중재하실험을 수행하였다. 또한 자기이방성센서를 이용한 비파괴 응력계측기법의 적용성을 평가하기 위하여 추가 강재하중재하실험과 수치해석을 실시하였다. 본 연구의 결과, 계측위치에 따라 자기이방성센서에서 측정된 출력전압과 스트레인 게이지로 측정된 응력의 평균을 이용하여 국산 강재인 SS400에 적합한 응력감도곡선을 도출하였다. 그리고 추가 강재하중재하실험과 수치해석을 비교한 결과, 자기이방성센서의 오차범위가 약 20MPa 정도임을 알 수 있었다. 자기이방성센서를 강재의 응력상태를 파악할 목적으로 사용할 경우, 강재의 항복응력의 레벨(245MPa)을 고려하면 공학적으로 충분한 정확도를 가지고 있다고 판단된다. 특히 자기이방성센서는 계측 센서가 부착되어 있지 않은 강구조물에서 잔류응력을 고려한 현재상태의 응력을 용이하게 파악할 수 있으며, 강구조물의 유지관리에 편리하게 적용이 가능함을 확인하였다.

이중보온관 부식감지선의 응력부식파괴에 관한 연구 (A study on Stress Corrosion Cracking of Sensor Wire in Thermally Insulated Underground Pipeline)

  • 최윤제;김정구
    • 한국재료학회지
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    • 제12권2호
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    • pp.103-111
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    • 2002
  • The thermally insulated underground pipelines have been used for district heating system. The sensor wire embedded in the insulation was used for monitoring the insulating resistance between the sensor wire and the pipe. The resistance measurement system detects corrosion of steel pipe under insulation. The corrosion and stress corrosion cracking(SCC) characteristics of sensor wire in synthetic ground water were investigated using the electrochemical methods and constant load SCC tests. The polarization tests were used to study the electrochemical behavior of sensor wire. The sensor wire was passivated at temperatures ranging from 25 to $95^{\circ}C$. However, the applied sensing current larger than passive current resulted in breakdown of passive film. The constant load SCC tests were performed to investigate the effects of applied current and load on the fracture behavior. Stress-corrosion cracks initiated at pits that were produced by sensing current. The growth of the pit involves a tunnelling mechanism, which leads to ductile fracture.

융착 광섬유 커플러를 이용한 회전 각도 센서 (Fiber-optic rotation angle sensor based on fused fiber coupler)

  • 김광택;조규정
    • 센서학회지
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    • 제19권1호
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    • pp.62-66
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    • 2010
  • We have proposed and demonstrated a rotation angle sensor based on the stress -optic effect of a fused fiber coupler whose transmission spectrum is altered by the torsional stress. The peak of transmission spectrum was shifted to longer wavelength region with rotation of the coupler. The rotation angle sensor revealed reproducibility and symmetric behavior with respect to the rotation direction. The sensitivity of the sensor was 0.367 [nm/degee].

CMOS Microcontroller IC와 고밀도 원형모양SOI 마이크로센서의 단일집적 (A Monolithic Integration with A High Density Circular-Shape SOI Microsensor and CMOS Microcontroller IC)

  • 이명옥;문양호
    • 전기전자학회논문지
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    • 제1권1호
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    • pp.1-10
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    • 1997
  • It is well-known that rectangular bulk-Si sensors prepared by etch or epi etch-stop micromachining technology are already in practical use today, but the conventional bulk-Si sensor shows some drawbacks such as large chip size and limited applications as silicon sensor device is to be miniaturized. We consider a circular-shape SOI(Silicon-On-Insulator) micro-cavity technology to facilitate multiple sensors on very small chip, to make device easier to package than conventional sensor like pressure sensor and to provide very high over-pressure capability. This paper demonstrates the cross-functional results for stress analyses(targeting $5{\mu}m$ deflection and 100MPa stress as maximum at various applicable pressure ranges), for finding permissible diaphragm dimension by output sensitivity, and piezoresistive sensor theory from two-type SOI structures where the double SOI structure shows the most feasible deflection and small stress at various ambient pressures. Those results can be compared with the ones of circular-shape bulk-Si based sensor$^{[17]}. The SOI micro-cavity formed the sensors is promising to integrate with calibration, gain stage and controller unit plus high current/high voltage CMOS drivers onto monolithic chip.

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Fabrication of low-stress silicon nitride film for application to biochemical sensor array

  • 손영수
    • 센서학회지
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    • 제14권5호
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    • pp.357-361
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    • 2005
  • Low-stress silicon nitride (LSN) thin films with embedded metal line have been developed as free standing structures to keep microspheres in proper locations and localized heat source for application to a chip-based sensor array for the simultaneous and near-real-time detection of multiple analytes in solution. The LSN film has been utilized as a structural material as well as a hard mask layer for wet anisotropic etching of silicon. The LSN was deposited by LPCVD (Low Pressure Chemical Vapor Deposition) process by varing the ratio of source gas flows. The residual stress of the LSN film was measured by laser curvature method. The residual stress of the LSN film is 6 times lower than that of the stoichiometric silicon nitride film. The test results showed that not only the LSN film but also the stack of LSN layers with embedded metal line could stand without notable deflection.

압력센서의 배선을 위한 다층 박막의 지지조건 변화에 따른 잔류응력 평가 (Evaluation of the Residual Stress with respect to Supporting Type of Multi-layer Thin Film for the Metallization of Pressure Sensor)

  • 심재준;한근조;김태형;한동섭
    • 한국정밀공학회:학술대회논문집
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    • 한국정밀공학회 2003년도 춘계학술대회 논문집
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    • pp.1537-1540
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    • 2003
  • MEMS technology with micro scale is complete system utilized as the sensor. micro electro device. The metallization of MEMS is very important to transfer the power operating the sensor and signal induced from sensor part. But in the MEMS structures local stress concentration and deformation is often happened by geometrical shape and different constraint on the metallization. Therefore. this paper studies the effect of supporting type and thickness ratio about thin film thickness of the substrate thickness for the residual stress variation caused by thermal load in the multi-layer thin film. Specimens were made from materials such as Al, Au and Cu and uniform thermal load was applied, repeatedly. The residual stress was measured by FEA and nano-indentation using AFM. Generally, the specimen made of Al induced the large residual stress and the 1st layer made of Al reduced the residual stress about half percent than 2nd layer. Specimen made of Cu and Au being the lower thermal expansion coefficient induce the minimum residual stress. Similarly the lowest indentation length was measured in the Au_Cu specimen by nano-indentation.

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