• 한국결정성장학회지
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• 제11권5호
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• pp.207-210
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• 2001

Metal-organic VPE (MOVPE) epitaxial growth procedure and related device fabrication technique are reported for GaInP-based epitaxial materials and devices. For GaInP/GaInAs two-dimensional electron-gas field-effect transistor (TEGFET), a promising epitaxial stacking structure resulting in enhanced electron mobility is given. In conjunction with this, a new device fabrication technique to improve luminous intensity of GaInP-based LED is also shown.

• 한국복합재료학회:학술대회논문집
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• 한국복합재료학회 1999년도 추계학술발표대회 논문집
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• pp.242-245
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• 1999

In aerospace industry improvement of structural performance of flight structure without increasing weight has great advantage. In this study, an innovative design method to increase the buckling load and tension failure load at the same time without increasing the weight was investigated by using the curvilinear fiber format in composite plates with central hole. It was investigated how much gain can be obtained with curvilinear fiber format for the plates with different hole size and different stacking sequence.

• 한국지구물리탐사학회:학술대회논문집
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• 한국지구물리탐사학회 2011년도 학술대회 및 정기총회
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• pp.137-142
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• 2011

• 제어로봇시스템학회:학술대회논문집
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• 제어로봇시스템학회 2004년도 ICCAS
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• pp.1802-1807
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• 2004

When a construction company builds a high structure, many piles should be driven into the ground by a hammer whose weight is 7,000 Kg in order to make the ground under the structure safe and strong. So, it is essential to determine whether a pile is penetrated into the ground enough to support the weight of the structure since ground characteristics at different locations are different each other. This paper proposes a visual measurement system for pile rebound and penetration movement including vibration using a high-speed line-scan camera and a specially designed mark to recognize two-dimensional motion parameters of the mark using only a line-scan camera. A mark stacking white and black right-angled triangles is used for the measurement, and movement information for vertical distance, horizontal distance and rotational angle is determined simultaneously

• 대한기계학회:학술대회논문집
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• 대한기계학회 2001년도 추계학술대회논문집A
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• pp.703-709
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• 2001

In this paper, we analyzed the laminated composite sandwich plate structure of truss core with changing values of the designing parameters. As a result, in designing parameters of that, the more height and thickness of the laminated composite plate's core, the more increase of natural frequency. In this type of structure, in the case of applying core of the laminated composite plate and antisymmetric stacking, natural frequency has high value and we calculated the optimum angle-ply making natural frequency maximum. Natural frequency of CFRP is higher than that of GFRP. Both are materials of the laminated composite plate. The mode shapes are various along with the angle-ply of the laminated composite plate.

• 반도체디스플레이기술학회지
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• 제14권2호
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• pp.41-45
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• 2015

From 20nm technology node, the finFET has become standard device for ULSI's. However, the finFET process made stacking gate non-volatile memory obsolete. Some reported capacitor-less DRAM structure by utilizing the FBE. We present possible non-volatile memory device structure similar to the dual gate MOSFET. One of the gates is left floating. Since body of the finFET is only 40nm thick, control gate bias can make electron tunneling through the floating gate oxide which sits across the body. For programming, gate is biased to accumulation mode with few volts. Simulation results show that the programming electron current flows at the interface between floating gate oxide and the body. It also shows that the magnitude of the programming current can be easily controlled by the drain voltage. Injected electrons at the floating gate act similar to the body bias which changes the threshold voltage of the device.

• 대한전자공학회:학술대회논문집
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• 대한전자공학회 2006년도 하계종합학술대회
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• pp.595-596
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• 2006

A novel Si via structure is suggested and fabricated for 3D MEMS package using the doped silicon as an interconnection material. Oxide isolations which define Si via are formed simultaneously when fabricating the MEMS structure by using DRIE and oxidation. Silicon Direct Bonding Multi-stacking process is used for stacked package, which consists of a substrate, MEMS structure layer and a cover layer. The bonded wafers are thinned by lapping and polishing. A via with the size of $20{\mu}m$ is fabricated and the electrical and mechanical characteristics of via are under testing.

• Journal of Korean Vacuum Science & Technology
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• 제2권1호
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• pp.43-48
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• 1998

The effect of mcirostructure on the electrical properties of yttria stabilized zirconia (YSZ) was analyzed by modeling layer arrangements and mixed phase structure. The YSZ thin films were deposited by RF magnetron sputtering using 30mol% YSZ and 8 mol% YSZ targets with yttrium pellets on porous alumina substrates. The structure, composition and electricla properties of the YSZ films were investigated as functions of sputtering conditons and layer arrangements by XRD, TEM, XPS and acimpedance spectroscopy. The results showed that the triple palyered YSZ films had highermicrohardness, lower compressive stress state and higher ionic conductivity by one order than single and double layered YSZ films. However, sputtered YSZ films have low conductivity compared to YSZ pellets or doctor bladed YSZ thin plates. These results were probably due to the influence of insulating alumina substrates, impractical for most stacking geometries and inductance induced by relatively long platinum, lead wire on YSZ conductivity.

• Bulletin of the Korean Chemical Society
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• 제6권4호
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• pp.222-224
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• 1985

The crystal structure of sulindac, $C_{20}H_{17}Fo_3S$, one of the nonsteroid antiinflammatory agents, has been determined by the X-ray diffraction techniques using diffractometer data obtained by the $\varpi-2{\theta}$ scan technique with Cu $$K_{\alpha}$$ radiation from a crystal with space group symmetry Pbca and unit cell parameters a = 8.166(1), b = 18.291(8), c = 23.245(10) ${\AA}.$ The structure was solved by direct methods and refined by full-matrix least-squares to a final R = 0.11 for the 1153 observed reflections. The carboxyl group is nearly perpendicular to the indenyl ring as observed in indomethacin. The dihedral angle between the indenyl and phenyl rings is $35^{\circ}while$ the corresponding angle in indomethacin is $67^{\circ}.$ Crystal packing consists of a hydrogen bond and partial ring stacking between the indenyl rings.

• 한국구조물진단유지관리공학회 논문집
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• 제16권2호
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• pp.19-30
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• 2012

사회적 생활 환경이 향상되고 도시개발이 안정화됨에 따라 신규 주택건설공사에 대한 요구는 점진적으로 감소하고 있다. 이에, 신축 보다는 정비를 통해 구조물의 사용수명을 연장시키는 리모델링의 중요성이 강조되고 있으며, 이와 관련된 많은 연구들이 진행중에 있다. 그러나 국내의 경우 리모델링 해체공사를 위한 구조해석 관련 기준이 미흡한 실정이다. 국내 보고된 리모델링 해체 공사도중에 발생한 사고중 슬래브 붕괴사고는 다수를 차지하고 있으며, 대형사고로 발전할 수 있는 위험성을 내포하고 있어 리모델링 해체공사에 적용할 수 있는 구조해석 관련 기준의 개발은 중요하면서도 시급하다. 슬래브의 경우 하중을 직접적으로 저항하기 때문에 균열에 취약해 질수 있고 균열이 발생할 경우 리모델링의 근본취지에 어긋남과 동시에 붕괴사고의 원인이 될 수 있으므로, 초기균열을 억제함은 상당히 중요하다고 볼 수 있다. 따라서 이 연구는 슬래브 구조물의 초기균열을 억제하기 위한 기준을 마련하기 위한 기초자료를 제공하기 위해 수행되었다. 슬래브 구조물의 구조적 거동과 관련된 주요 요소로는 구조물의 형상과 구조물에 작용하는 하중이 있다. 슬래브 구조물의 형상과 작용하중과의 상호관계를 파악하기 위해 국내 아파트 평면도를 분석하였으며, 해체잔해물의 단위중량, 콘크리트 강도 등과 관련된 자료를 분석하였다. 분석결과를 활용하여 유한요소해석을 실시하였으며, 유한요소해석결과 주요 하중요소인 해체잔해물의 적재제한높이 및 적재방법에 대해 검토할 수 있었다. 또한, 소형해체장비의 이동에 따른 슬래브의 구조적 거동을 파악하기 위해 동적, 정적 재하실험을 실시하였으며, 실험결과 이동하중에 따른 충격의 영향을 반영할 수 있는 충격계수를 결정할 수 있었다.