• Journal of the Korean Wood Science and Technology
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• v.39 no.4
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• pp.318-325
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• 2011

Pitch pine (Pinus rigida Miller) retaining walls using Steel bar, of which the constructability and strength performance are good at the construction site, were manufactured and their strength properties were evaluated. The wooden retaining wall using Steel bar was piled into four stories stretcher and three stories header, which is 770 mm high, 2,890 mm length and 782 mm width. Retaining wall was made by inserting stretchers into Steel bar after making 18 mm diameter of holes at top and bottom stretcher, and then stacking other stretchers and headers which have a slit of 66 mm depth and 18 mm width. The strength properties of retaining walls were investigated by horizontal loading test, and the deformation of structure by image processing (AlCON 3D OPA-PRO system). Joint (Type-A) made with a single long stretcher and two headers, and joint (Type-B) made with two short stretchers connected with half lap joint and two headers were in the retaining wall using Steel bar. The compressive shear strength of joint was tested. Three replicates were used in each test. In horizontal loading test the strength was 1.6 times stronger in wooden retaining wall using Steel bar than in wooden retaining wall using square timber. The timber and joints were not fractured in the test. When testing compressive shear strength, the maximum load of type-A and Type-B was 130.13 kN and 130.6 kN, respectively. Constructability and strength were better in the wooden retaining wall using Steel bar than in wooden retaining wall using square timber.

• Journal of the Mineralogical Society of Korea
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• v.15 no.2
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• pp.95-103
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• 2002

The object of this study was to interpret the ralationship between expandability (% $S_{XRD}$), MacEwan crystallite thickness ( $N_{CSD}$), and mean fundamental particle thickness ( $N_{F}$ ) in illite-semctite mixed layer (I-S), quantitatively. This interpretation was extracted from comparison of two structural models (MacEwan crystallite model and fundamental particle model) of I-S mixed layers. In I-S structure, % $S_{XRD}$, $N_{CSD}$, and $N_{F}$ are not independent parameters but are related to each others by particular geometric relations. % $S_{XRD}$ is dependent on $N_{CSD}$ by short-stack effect, whereas, % $S_{XRD}$ and $N_{F}$ have relation to smectite interlayer number (Ns)=( $N_{F-}$1)/(100%/% $S_{XRD-}$ $N_{F}$ . Therefore, % $S_{XRD}$ and $N_{F}$ should satisfy a specific physical condition, 1< $N_{F}$ <100%/% $S_{XRD}$, because $N_{s}$ is positive. Based on this condition, this study suggested % $S_{XRD}$ vs $N_{F}$ diagram which can be used to interpret % $S_{XRD}$, $N_{F}$ , $N_{S}$ , and ordering, quantitatively. The diagram was examined by XRD data for I-S samples from Ceumseongsan volcanic complex, Korea. I-S samples showed that $N_{F}$ departs from the physical upper-limit ( $N_{F}$ =100%/% $S_{XRD}$) with decrease in % $S_{XRD}$. This phenomenon may happen due to decrease of stacking-capability of fundamental particles with their thickening.g.s with their thickening.g.

• Korean Chemical Engineering Research
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• v.45 no.5
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• pp.466-472
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• 2007

A technology platform for wafer-level three-dimensional integration circuits (3D-ICs) is presented, and that uses wafer bonding with low-k polymeric adhesives and Cu damascene inter-wafer interconnects. In this work, one of such technical platforms is explained and characterized using a test vehicle of inter-wafer 3D via-chain structures. Electrical and mechanical characterizations of the structure are performed using continuously connected 3D via-chains. Evaluation results of the wafer bonding, which is a necessary process for stacking the wafers and uses low-k dielectrics as polymeric adhesive, are also presented through the wafer bonding between a glass wafer and a silicon wafer. After wafer bonding, three evaluations are conducted; (1) the fraction of bonded area is measured through the optical inspection, (2) the qualitative bond strength test to inspect the separation of the bonded wafers is taken by a razor blade, and (3) the quantitative bond strength is measured by a four point bending. To date, benzocyclobutene (BCB), $Flare^{TM}$, methylsilsesquioxane (MSSQ) and parylene-N were considered as bonding adhesives. Of the candidates, BCB and $Flare^{TM}$ were determined as adhesives after screening tests. By comparing BCB and $Flare^{TM}$, it was deduced that BCB is better as a baseline adhesive. It was because although wafer pairs bonded using $Flare^{TM}$ has a higher bond strength than those using BCB, wafer pairs bonded using BCB is still higher than that at the interface between Cu and porous low-k interlevel dielectrics (ILD), indicating almost 100% of bonded area routinely.

• Geophysics and Geophysical Exploration
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• v.21 no.3
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• pp.171-182
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• 2018

We performed the seismic field data processing using an open-source software (Madagascar) to verify if it is applicable to processing of field data, which has low signal-to-noise ratio and high uncertainties in velocities. The Madagascar, based on Python, is usually supposed to be better in the development of processing technologies due to its capabilities of multidimensional data analysis and reproducibility. However, this open-source software has not been widely used so far for field data processing because of complicated interfaces and data structure system. To verify the effectiveness of the Madagascar software on field data, we applied it to a typical seismic data processing flow including data loading, geometry build-up, F-K filter, predictive deconvolution, velocity analysis, normal moveout correction, stack, and migration. The field data for the test were acquired in Gunsan Basin, Yellow Sea using a streamer consisting of 480 channels and 4 arrays of air-guns. The results at all processing step are compared with those processed with Landmark's ProMAX (SeisSpace R5000) which is a commercial processing software. Madagascar shows relatively high efficiencies in data IO and management as well as reproducibility. Additionally, it shows quick and exact calculations in some automated procedures such as stacking velocity analysis. There were no remarkable differences in the results after applying the signal enhancement flows of both software. For the deeper part of the substructure image, however, the commercial software shows better results than the open-source software. This is simply because the commercial software has various flows for de-multiple and provides interactive processing environments for delicate processing works compared to Madagascar. Considering that many researchers around the world are developing various data processing algorithms for Madagascar, we can expect that the open-source software such as Madagascar can be widely used for commercial-level processing with the strength of expandability, cost effectiveness and reproducibility.