• Title/Summary/Keyword: sputtering technology

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PREPARATION OF HYDROXYAPATITE COATINGS USING R.F. MAGNETRON SPUTTERING

  • Hosoya, Satoru;Sakamoto, Yukihiro;Hashimoto, Kazuaki;Takaya, Matsufumi;Toda, Yoshitomo
    • Journal of the Korean institute of surface engineering
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    • v.32 no.3
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    • pp.307-311
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    • 1999
  • The well-crystalline hydroxyapatite($Ca_{10}(PO_4)_6(OH)_2$ ; HAp) layer having a biocompatibility was successfully coated onto titanium substrate using a radio-frequency magnetron sputtering, and effects of sputtering gas and the thickness of HAp film on a crystal growth of the HAp layers were investigated. The deposition rate of the layer sputtered with water-vapour gas was slower than that of the layer sputtered with argon gas. The results of X-ray diffraction demonstrated that the about $0.8\mu\textrm{m}$ thick HAp film under water-vapour gas was an amorphous phase, the about $1.2\mu\textrm{m}$ thick film was (100) plane-oriented HAp, and the about $1.5\mu\textrm{m}$ thick film was (001)plane-oriented HAp. FT-IR analysis proved that hydroxyl group of the layer sputtered with argon gas was defected, but that of the layer sputtered with water-vapour gas was not defected. From these results, it was favorable to use water-vapour gas on the HAp coatings onto metal surface.

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Sputtering Technology and Prospect for Transparent Conductive Thin Film (투명전도성 박막의 활용을 위한 스퍼터링 증착 기술과 전망)

  • Sangmo Kim;Kyung Hwan Kim
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.36 no.2
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    • pp.109-124
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    • 2023
  • For decades, sputtering as a physical vapor deposition (PVD) method has been a widely used technique for film coating processes. The sputtering enables oxides, metals, alloys, nitrides, etc to be deposited on a wide variety of substrates from silicon wafers to polymer substrates. Meanwhile, transparent conductive oxides (TCOs) have played important roles as electrodes in electrical applications such as displays, sensors, solar cells, and thin-film transistors. TCO films fabricated through a sputtering process have a higher quality leading to an improved device performance than other films prepared with other methods. In this review, we discuss the mechanism of sputtering deposition and detail the TCO materials. Related technologies (processing conditions, materials, and applications) are introduced for electrical applications.

Effects of Sputtering Conditions on the Growth of Ag/CoFeB Layer on MgO(100) Substrate (MgO(100) 기판 위에 증착된 Ag/CoFeB 박막의 스퍼터링 조건에 따른 미세성장구조 변화 연구)

  • Jeon, Bo-Geon;Jeong, Jong-Ryul;Takahashi, Hirokazu;Tsunoda, Masakiyo;Takahashi, Migaku
    • Journal of the Korean Magnetics Society
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    • v.21 no.6
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    • pp.214-218
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    • 2011
  • In this study, we have systematically investigated the effect of sputtering conditions on the microstructural properties of Ag/CoFeB thin film on MgO substrate. It was found that the crystallinity and surface roughness of the Ag film strongly depends on the Ar sputtering pressure and sputtering power. Epitaxial growth of Ag(100) film on MgO(100) substrate was achieved under the sputtering conditions of high sputtering power and elevated temperature. XRR (X-ray reflectivity) and high-resolution TEM (transmission electron microscopy) measurements also revealed the interfacial roughening in the Ag/CoFeB interface due to the island structure formation and intermixing between Ag and CoFeB.

A study on the low temperature process of ITO film by magnetron sputtering (Magnetron Sputtering 법으로 증착한 ITO 박막의 저온공정에 관한 연구)

  • Choe, Dong-Hun;Geum, Min-Jong;Lee, Gyo-Ung;Kim, Gap-Seok;Han, Jeon-Geon
    • Proceedings of the Korean Institute of Surface Engineering Conference
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    • 2007.04a
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    • pp.139-140
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    • 2007
  • 본 연구에서는 ion bombardment에 의한 폴리머 기판의 손상을 줄이기 위해 FTS (Facing Target Sputtering) 장치를 이용하여 투명 전극용 ITO 박막을 합성하였다. 산소와 헬륨의 혼합비율을 변수로 하여 박막을 합성한 결과, 투명전극에 적합한 낮은 비저항과 80% 이상의 투과도를 갖는 박막을 합성할 수 있었다.

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Electrical Characteristics of the SiC SBD Prepared by using the Facing Targets Sputtering Method (대향 타겟 스퍼터링법으로 제작한 SiC SBD의 전기적 특성)

  • Lee, Jinseon;Kang, Tai Young;Kim, Kyung Hwan
    • Journal of the Semiconductor & Display Technology
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    • v.14 no.1
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    • pp.27-30
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    • 2015
  • SiC based Schottky barrier diodes were prepared by using the facing targets sputtering method. In this research, 4H-SiC polytypes of SiC were adopted and Molybdenum, Titanium was employed as the Schottky metal of the metal-semiconductor contacts. Both structures showed the rectifying nature in their forward and reverse J-V characteristic curve and the ideality factors calculated from these plots that were close to unity were represented the nearly ideal behavior. Difference of Schottky barrier height between prepared devices was also corresponding with the electrical characteristics of themselves. Therefore the suitability of the facing targets sputtering method for fabrication of Schottky diodes could be suggested from these results.

Numerical Analysis of the Incident ion Energy and Angle Distribution in the DC Magnetron Sputtering for the Variation of Gas Pressure

  • Hur, Min Young;Oh, Sehun;Kim, Ho Jun;Lee, Hae June
    • Applied Science and Convergence Technology
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    • v.27 no.1
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    • pp.19-22
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    • 2018
  • The ion energy and angle distributions (IEADs) in the DC magnetron sputtering systems are investigated for the variation of gas pressure using particle-in-cell simulation. Even for the condition of collisionless ion sheath at low pressure, it is possible to change the IEAD significantly with the change of gas pressure. The bombarding ions to the target with low energy and large incident angle are observed at low pressure when the sheath voltage drop is low. It is because the electron transport is hindered by the magnetic field at low pressure because of few collisions per electron gyromotion while the ions are not magnetized. Therefore, the space charge effect is the most dominant factor for the determination of IEADs in low-pressure magnetron sputtering discharges.

The study of crystallization to Si films deposited using a sputtering method on a Mo substrate (Mo기판 위에 sputtering 법으로 성장된 Si 박막의 결정화 연구)

  • 김도영;고재경;박중현;이준신
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2002.07a
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    • pp.36-39
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    • 2002
  • Polycrystalline silicon (poly-Si) thin film transistor (TFT) technology is emerging as a key technology for active matrix liquid crystal displays (AMLCD), allowing the integration of both active matrix and driving circuit on the same substrate (normally glass). As high temperature process is not used for glass substrate because of the low softening points below 450$^{\circ}C$. However, high temperature process is required for getting high crystallization volume fraction (i.e. crystallinity). A poly-Si thin film transistor has been fabricated to investigate the effect of high temperature process on the molybdenum (Mo) substrate. Improve of the crystallinity over 75% has been noticed. The properties of structural and electrical at high temperature poly-Si thin film transistor on Mo substrate have been also analyzed using a sputtering method

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Numerical Analysis of the Incident Ion Energy and Angle Distribution in the DC Magnetron Sputtering for the Variation of Gas Pressure

  • Hur, Min Young;Oh, Sehun;Kim, Ho Jun;Lee, Hae June
    • Applied Science and Convergence Technology
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    • v.27 no.2
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    • pp.26-29
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    • 2018
  • The ion energy and angle distributions (IEADs) in the DC magnetron sputtering systems are investigated for the variation of gas pressure using particle-in-cell simulation. Even for the condition of collisionless ion sheath at low pressure, it is possible to change the IEAD significantly with the change of gas pressure. The bombarding ions to the target with low energy and large incident angle are observed at low pressure when the sheath voltage drop is low. It is because the electron transport is hindered by the magnetic field at low pressure because of few collisions per electron gyromotion while the ions are not magnetized. Therefore, the space charge effect is the most dominant factor for the determination of IEADs in low-pressure magnetron sputtering discharges.

Preparation of AlN thin films on silicon by reactive RF magnetron sputtering (RF 마그네트론 스퍼터링을 이용한 Si 기판상의 AlN 박막의 제조)

  • 조찬섭;김형표
    • Journal of the Semiconductor & Display Technology
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    • v.3 no.2
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    • pp.17-21
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    • 2004
  • Aluminum nitride(AlN) thin films were deposited on silicon substrate by reactive RF magnetron sputtering without substrate heating. We investigated the dependence of some properties for AlN thin film on sputtering conditions such as working pressure, $N_2$ concentration and RF power. XRD, Ellipsometer and AES has been measured to find out structural properties and preferred orientation of AlN thin films. Deposition rate of AlN thin film was increased with an increase of RF power and decreased with an increase of $N_2$ concentration. AES in-depth measurements showed that stoichiometry of Aluminium and Nitrogen elements were not affected by $N_2$ concentration. It has shown that low working pressure, low $N_2$ concentration and high RF power should be maintained to deposit AlN thin film with a high degree of (0002) preferred orientation.

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Effect of substrate temperature on the properties of AZO thin film deposited by using facing targets sputtering system

  • Jung, Yu Sup;Choi, Myung Kyu;Kim, Kyung Hwan
    • Journal of the Semiconductor & Display Technology
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    • v.11 no.1
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    • pp.1-5
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    • 2012
  • Al doped ZnO (AZO) thin film was deposited by using Facing Target Sputtering (FTS) system. This work examined the properties of AZO thin film as a function of the substrate temperature. The sputtering targets were 4 inch diameter disks of AZO (ZnO : $Al_2O_3$ = 98 : 2 wt.% ). The properties of electrical, structural and optical were investigated by 4-point probe, Hall effect measurement, x-ray diffractometer (XRD), field-emitting scanning electron microscopy (FE-SEM), and UV/VIS spectrometer. The lowest resistivity of films was $5.67{\times}10^{-4}{\Omega}.cm$ and the average optical transmittance of the films was above 85% in the visible range.