• Journal of Sensor Science and Technology
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• v.11 no.4
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• pp.247-253
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• 2002

For fabrication of the pyroelectric IR sensor $(Pb,La)TiO_3(PLT)$/$LiTaO_3$/(LTO)/PLT ferroelectric thin films was deposited by rf magnetron sputtering followed by rapid thermal annealing and the crystallinity as a function of annealing temperature and time was investigated. Permittivity and dielectric loss factor of ferroelectric thin films as a function of c-axis preffered orientation was measured. Also pyroelectric coefficient of ferroelectric thin films with largest c-axis preffered orientation was measured and obtain figure of merit of voltage response($F_V$) and detectivity($F_D$). In this case $F_V$, $F_D$ was $5.63{\times}10^{-10}\;C{\cdot}cm/J$, $1.98{\times}10^{-8}\;C{\cdot}cm/J$, respectively.

• Proceedings of the Korean Vacuum Society Conference
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• 1992.02a
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• pp.17-18
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• 1992

SIMS is an indispensable surface analysis instrument in trace element depth p profiling because of high detection sensitivity and excellent depth r resolution, however, it requires standard sample to do quantitative analysis d due to matrix effect depending on the species of impurities and sample m matricies and on the sputtering rates. A Among the SNMS technology developed to supply the deficiency, we researched i into CsX+ SNMS which improved the resul t quanti tati vely wi thout any extra epuipments. So basic SNMS functions were confirmed through matrix element composition rate a analysis using Si02 layer etc. and adaptability to trace element c concentration analysis was tried. For that purpose we compared SIMS depth profile data for Boron which presented s strong matrix effect on account of Fluorin existence after BF2 ion implantation on silicon substrate with SNMS data. d dynamic range were investigated. A After these experements we concluded that CsX+ SNMS reduced matrix effect and we could apply it to profile impurity elements.

• Journal of the Korean Vacuum Society
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• v.1 no.1
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• pp.115-120
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• 1992

SIMS is an indispensable surface analysis instrument in trace element depth profiling because of high detection sensitivity and excellent depth resolution, however, it requires a standard sample to do quantitative analysis due to matrix effect depending on the species of impurities and sample matricies and on the sputtering rates. Among the SNMS technology developed to supply the deficiency, we researched into CsX+ SNMS which improved the result quantitatively without any extra epuipments. So basic SNMS functions were confirmed through matrix element composition rate analysis using Siq layer etc., and adaptability to trace element concentration alaysis was tried. For that purpose we compared SIMS depth profile data for Boron which presented strong matrix effect on account of Fluorin existence after BF2 ion implantation on silicon substrate with SNMS data. Also detection limit and dynamic range were investigated. After these experements we concluded that CsX+ SNMS reduced matrix effect and we could apply it to profile impurity elements.

• Journal of Sensor Science and Technology
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• v.9 no.1
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• pp.83-89
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• 2000

BST thin films were deposited on the ITO coated glass for using TFELD insulating layer by rf magnetron sputtering method. $O_2/(Ar+O_2)$ mixing ratio was 10%, substrate temperature was changed from R.T. to $500^{\circ}C$, and working pressure was changed from 5 mTorr to 30 mTorr. BST thin films deposited with various conditions were investigated electrical, optical, structural properties, and stoichiometry. The result of investigation was achieved good fabrication condition that substrate temperature of $400^{\circ}C$, and working pressure of 30 mTorr. Relative dielectric constant of 254 at 1 kHz, leakage current density was below $3.3{\times}10^{-7\;}A/cm^2$ at 5\;MV/cm applied electric field, and transmittance was over 82% at visible range.

• Journal of Sensor Science and Technology
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• v.8 no.2
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• pp.189-194
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• 1999

The heat treatment effects of the undoped ZnO and Al doped ZnO(AZO) transparent conductive films prepared by rf magnetron sputtering were investigated. The variations of the electrical and optical properties with heat treatment temperature and ambient were studied. The resistivity of the un doped ZnO films heat treated in air and $H_z$ plasma for 1 hour increased rapidly above $200^{\circ}C$ and $300^{\circ}C$, respectively. And that of the ZnO:Al films heat treated in air also increased rapidly above $300^{\circ}C$. On the other hand that of the ZnO:Al films heat treated in $H_z$ plasma was constant regardless of heat treatment temperature. The optical transmittance above 550nm is about 90% for all thin films regardless of impurity doping, the heat treatment temperature and ambient.

• Journal of Sensor Science and Technology
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• v.6 no.6
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• pp.491-499
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• 1997

We fabricated the ceramic PLT tablet which was composed of 5, 10 and 15 mol% lanthanum concentration and thin film PLT to develope pyroelectric materials, and investigated their characteristics. Using TG/DTA, we determined calcination and sintering temperature to sinter the PLT completely and to prevent volatilization of the Pb components. The calcination and sintering temperature were $850^{\circ}C$, $1150^{\circ}C$ respectively, and there was a lot of mass loss at higher sintering temperature. By measuring temperature-dielectric constant characteristics of ceramic tablet we investigated dielectric constant characteristics depends on La concentration. The Curie point of PLT with 5, 10 and 15 mol% lanthanum concentration were $330^{\circ}C$, $269^{\circ}C$ and $210^{\circ}C$ respectively. Using PLT ceramic tablet we observed IR detection characteristics, and then deposited PLT thin film by rf magnetron sputtering. We verified that PLT thin film fabricated with completely sintered PLT target had the same structure to target by investigating lattice constant and optical transparency.

• Journal of the Microelectronics and Packaging Society
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• v.7 no.3
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• pp.31-36
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• 2000

We developed embedded inductors in MCM-D substrate for RF applications. The increasing demand for high density packaging was the driving forces to the development of MCM-D technology. Most of these development efforts have been focused on high performance digital circuits. However, recently there is a great need fur mixed mode circuits with a combination of digital, analog and microwave devices. Mixed mode modules often have a large number of passive components that are connected to a small number of active devices. Integration of passive components into the high density MCM substrate becomes desirable to further reduce cost, size, and weight of electronic systems while improving their performance and reliability. The proposed MCM-D substrate was based on Cu/photosensitive BCB multilayer and Ti/Cu is used to form the interconnect layer. Seed metal was formed with 1000 $\AA$ Ti/3000 $\AA$ Cu by sputtering method and main metal was formed with 3 $\mu\textrm{m}$ Cu by electrical plating method. The multi-turn sprial inductors were designed in coplanar fashion. This paper describe the manufacturing process of integrated inductors in MCM-D substrate and the results of electrical performance test.

• Proceedings of the Korean Vacuum Society Conference
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• 2011.08a
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• pp.394-394
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• 2011

급속한 산업의 발달은 심각한 환경오염 및 에너지 문제를 가져왔다. 이를 해결하기 위하여 무한한 에너지원인 태양에너지를 원천으로 하는 친환경 정화소재로서의 광촉매(photocatalyst)를 통하여 인류의 에너지를 확보하는 것에 대한 관심이 급격하게 증가하고 있는 추세이다. 현재 광촉매로 가장 많이 사용되는 $TiO_2$의 경우 뛰어난 광활성과 저렴한 가격, 광 안정성, 화학적 안정성을 가짐에도 불구하고, 3.2 eV라는 상대적으로 넓은 band gap을 가지기 때문에 약 386 nm보다 짧은 파장을 갖는 자외선만 흡수할 수 있다. 이로 인한 가시광 응답성의 부재를 해결하기 위해 수십년간 많은 연구가 진행되어 왔다. 따라서 본 연구에서는 ICP assisted pulsed DC reactive magnetron sputtering을 이용하여 $TiO_2$를 기반으로 하면서 가시광영역의 빛을 흡수하여 높은 효율을 얻을 수 있도록 Nitrogen doping, Low band gap semi-conductor sensitization 등의 방법을 사용하여 광촉매를 제작하였다. 시료의 chemical state와 crystallinity를 확인하기 위하여 X-ray photoelectron spectroscopy와 X-ray diffraction method를 이용하여 분석을 수행하였으며, 이러한 공정을 통해 제작된 $TiO_2$기반 광촉매의 가시광 응답성을 확인하기 위하여 UV/Vis 스펙트럼을 측정하였다. 또한 물 분해 장치(water splitting device)를 제작하여 수소와 산소 생성시 흐르는 전류를 측정하여 광특성을 평가하였다.

• Korean Journal of Materials Research
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• v.11 no.9
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• pp.769-775
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• 2001

High quality PZT piezoelectric thin films were sputter- deposited on$ RuO_2$/$SiO_2$/Si substrates by using 2-step deposition method. As the first step, PZT seed layers were fabricated at a low temperature($475^{\circ}C$ ) to form a pure perovskite phase by reducing the volatility of Pb oxide. and then, as the second step, the PZT films were deposited at high temperatures ($530^{\circ}C$~$570^{\circ}C$) to reduce the defect density in the films. By this method, the pure perovskite phase was obtained at high deposition temperature range ($530^{\circ}C$~$570^{\circ}C$) and the superior electrical properties of PZT films were obtained on $RuO_2$substrate : 2Pr : 60$\mu$C/$\textrm{cm}^2$, $E_c: 60kV/cm, \;J_t: 10^{-6}A/cm^2\; at\; 250kV/cm$. The residual stress of PZT films fabricated by the 2-step deposition method was tensile and below 150MPa. It was attempted to control the residual stress in the PZT films by applying a negative bias to the substrate. As the amplitude of the substrate bias was increased, the residual tensile stress was slightly decreased, however, the ferroelectric properties of PZT films were degraded by ion bombardment.

• Proceedings of the Korean Vacuum Society Conference
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• 2013.02a
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• pp.403-404
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• 2013

최근 scaling down의 한계에 부딪힌 DRAM과 Flash Memory를 대체하기 위한 차세대 메모리(Next Generation Memory)에 대한 연구가 활발히 진행되고 있다. ITRS (international technology roadmap for semiconductors)에 따르면 PRAM (phase change RAM), RRAM (resistive RAM), STT-MRAM (spin transfer torque magnetic RAM) 등이 차세대 메모리로써 부상하고 있다. 그 중 RRAM은 간단한 구조로 인한 고집적화, 빠른 program/erase 속도 (100~10 ns), 낮은 동작 전압 등의 장점을 갖고 있어 다른 차세대 메모리 중에서도 높은 평가를 받고 있다 [1]. 현재 RRAM은 주로 금속-산화물계(Metal-Oxide) 저항 변화 물질을 기반으로 연구가 활발하게 진행되고 있다. 하지만 근본적으로 공정 과정에서 산소에 의한 오염으로 인해 수율이 낮은 문제를 갖고 있으며, Endurance 및 Retention 등의 신뢰성이 떨어지는 단점이 있다. 따라서, 본 연구진은 산소 오염에 의한 신뢰성 문제를 근본적으로 해결할 수 있는 다양한 금속-질화물(Metal-Nitride) 기반의 저항 변화 물질을 제안해 연구를 진행하고 있으며, 우수한 열적 안정성($>450^{\circ}C$, 높은 종횡비, Cu 확산 방지 역할, 높은 공정 호환성 [2] 등의 장점을 가진 WN 박막을 저항 변화 물질로 사용하여 저항 변화 메모리를 구현하기 위한 연구를 진행하였다. WN 박막은 RF magnetron sputtering 방법을 사용하여 Ar/$N_2$ 가스를 20/30 sccm, 동작 압력 20 mTorr 조건에서 120 nm 의 두께로 증착하였고, E-beam Evaporation 방법을 통하여 Ti 상부 전극을 100 nm 증착하였다. I-V 실험결과, WN 기반의 RRAM은 양전압에서 SET 동작이 일어나며, 음전압에서 RESET 동작을 하는 bipolar 스위칭 특성을 보였으며, 읽기 전압 0.1 V에서 ~1 order의 저항비를 확보하였다. 신뢰성 분석 결과, $10^3$번의 Endurance 특성 및 $10^5$초의 긴 Retention time을 확보할 수 있었다. 또한, 고저항 상태에서는 Space-charge-limited Conduction, 저저항 상태에서는 Ohmic Conduction의 전도 특성을 보임에 따라 저항 변화 메카니즘이 filamentary conduction model로 확인되었다 [3]. 본 연구에서 개발한 WN 기반의 RRAM은 우수한 저항 변화 특성과 함께 높은 재료적 안정성, 그리고 기존 반도체 공정 호환성이 매우 높은 강점을 갖고 있어 핵심적인 차세대 메모리가 될 것으로 기대된다.