• Proceedings of the KIEE Conference
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• 1990.11a
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• pp.173-175
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• 1990

A dc magnetron system for cathode sputtering with a spool-shaped cathode is described. The sputtering conditions are discussed concerning pressure, magnetic field and discharge current.

• Korean Journal of Crystallography
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• v.11 no.3
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• pp.167-172
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• 2000

CaTiO₃:Pr phosphor thin films were prepared on Si(100), ZnO/glass, Corning glass and ITO/glass by rf magnetron reactive sputtering. The effects of deposition parameters such as oxygen partial pressure, substrate temperature, and annealing conditions on crystallinity and compositional variation of the films were investigated. PL spectra of CaTiO₃:Pr phosphor thin films exhibited red regime peaking at 613 nm and enhanced PL intensity was observed for the film annealed in vacuum atmosphere as compared to the deposit annealed in N₂ environment.

• Proceedings of the Materials Research Society of Korea Conference
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• 2005.05a
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• pp.142-142
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• 2005

• Proceedings of the Korean Magnestics Society Conference
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• 2002.04a
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• pp.72-73
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• 2002

No Abstract, See Full Text

• Journal of the Korean institute of surface engineering
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• v.50 no.3
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• pp.192-197
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• 2017

A 6-way-cross consisting of a 2.75-inch CF flange was used as a main chamber on a PFEIFFER VACUUM TMP station based on a 67 l / sec turbo molecular pump and a diaphragm pump to produce a magnet array with a volume ratio of 5.5: 1.A 1-inch diameter copper target and graphite target were fabricated using MDX-1.5K from Advanced Energy Industries, Inc as a DC power supply. Ion current density of copper target and graphite target was measured by unbalanced magnetron sputtering. The basic pressure condition was $6.3{\times}10^{-7}mbar$ and the process pressure was Ar 50 sccm at $1.0{\times}10^{-2}mbar$ (7.5 mTorr) in the Ar atmosphere. Therefore, the relative density of copper ions reaching the substrate with the measured ion current density was derived.

• Proceedings of the Korean Vacuum Society Conference
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• 2015.08a
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• pp.184.1-184.1
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• 2015

RF magnetron sputtering법을 이용하여 IGZO박막을 RF power 100W로 일정하게 유지시켜, 열처리 변화에 따른 구조적, 전기적, 광학적 특성 분석을 연구하였다. IGZO 타겟은 $In_2$ $O_3$, $Ga_2$ $O_3$, ZnO 분말을 각각 1:1:2 mol% 조성비로 혼합하여 소결한 타겟을 사용하였고, $20mm{\times}20mm$ XG glass 기판위에 IGZO박막을 증착하였다. sputtering의 조건은 base pressure $2.0{\times}$10^-6Torr, working pressure $2.0{\times}$10^-2Torr, RF power 100 W, 증착온도는 실온으로 고정, 증착된 박막은 Annealing장비로 $500^{\circ}C$, $700^{\circ}C$, $800^{\circ}C$로 열처리를 하였다. XRD 분석 결과 열처리 $700^{\circ}C$부터 2theta=31.4도에서 peak intensity가 증가하며 결정화가 진행되는 것을 확인하였다. AFM분석 결과 열처리 $700^{\circ}C$에서 최소 0.31 Roughness를 갖는 것을 확인하였고, Hall 측정 결과 열처리 $700^{\circ}C$에서 carrier concentration $4.91{\times}$10^19cm^-3, Mobility 14.4cm^2/V-s, Resistivity $8.7{\times}$10^-5${\Omega}-cm$로 확인하였으며, UV-Visible-NIR을 이용하여 열처리 한 모든 IGZO박막은 가시광선 영역에서 평균 85%이상의 광 투과성을 확인하였다.

• Journal of the Korean Ceramic Society
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• v.33 no.5
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• pp.514-518
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• 1996

Sb doped SnO2(ATO: Antinomy doped Tin Oxide) thin films were prepared by a DC magnetron spttuering method using an oxide target and the electrical characteristics of ATO films were investigated. The experimen-tal conditions are as follows :Ar flow rate ; 0~100 sccm deposition tempera-ture ; 250~40$0^{\circ}C$ DC sputter powder ; 150~550W and sputteing pressure ; 2~7 mTorr, The thickness of depositied ATO films were 600$\AA$~1100 $\AA$ ranges. The resistivity of ATO films was decreased due to the increase of the crystallinity of ATO films with deposition temperature. The decrease of carrier concentration of films with the increase of oxygen flow rate and working pressure is responsible for the increase of resistivity. Increasing of sputtering power raised the resistivity of films by decreasing the carrier mobility.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2010.06a
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• pp.387-387
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• 2010

최근 ZnO 박막은 투명 박막, 태양전지, LED 등으로의 응용을 위한 새로운 기능성 박막으로 활발히 연구되어 지고 있다. ZnO 기반의 투명 박막 트랜지스터는 상온에서 증착 가능하여 유리기판을 이용한 광학소자와 플라스틱 기판을 이용한 플럭서블 소자 같은 차세대 전자소자를 구현 할 수 있다. 본 연구에서는 RF Magnetron Sputtering System을 이용하여 coming 1737 유리기판 위에 ZnO 박막을 공정압력에 따라 증착하고, 투명 반도체에 적합한 활용을 위한 구조적, 광학적 분석을 실시하였다. 박막 증착 조건은 초기 압력 $1.0{\times}10^{-6}$Torr, RF 파워는 100W, Ar 유량은 100sccm, 그리고 증착온도는 상온이었다. 증착 압력은 $7.0{\times}10^{-3}$, $2.0{\times}10^{-2}$, $7.0{\times}10^{-2}$Torr로 변화시켰다. 표면 분석 (SEM, AFM) 결과 증착압력이 고진공으로 변화함에 따라 결정립들이 감소하였고 RMS roughness값이 낮아졌다. 그리고 XRD 분석을 통해 피크강도는 증가하고 FWHM은 감소함을 보이고 있는데 이는 결정성이 좋아짐을 나타낸다. 그리고 광학 투과도를 통해 가시광 영역에서의 높은 투과도(85% 이상)을 확인하였고, 고진공으로 변화함에 따라 밴드갭이 넓어지는 것을 확인하였다.

• Journal of the Korean institute of surface engineering
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• v.29 no.6
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• pp.829-833
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• 1996

Superconducting YBaCuO thin films were deposited on MgO (100) single crystal substrate by rf reactive sputtering method. Sputtering target was prepared by mixing the original powders of $Y_2O_3$, $BaCO_3$, and CuO at $830^{\circ}C$, and its composition was $YBa_2Cu_{3.3}O_x$ adding the excess CuO to compensate for the loss of Cu in the deposition process. The sputtering conditions for a high quality of YBCO thin film were: substrate temperature of 13$0^{\circ}C$; gas pressure of 10 mTorr; gas mixture ($O_2$: Ar =10: 90); distance of 2.5 inch; and rf power density of 4.87 W /$\textrm{cm}^2$. The deposition rate was 2.4~2.6 nm/min. From the RBS results, it was found that Cu and Ba contents in thin films decreased with the increase of substrate temperature. The increase of gas pressure resulted in significant deficiency of Ba elements.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.13 no.8
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• pp.704-710
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• 2000

Metal electrode materials for plasma display panel should have low electrical resistivity in order to maintain stable gas discharge and have fast response time. They should also hae good film uniformity adhesion and thermal stability. In this study Cr/Cu/Cr metal electrode structure is formed by DC magnetron sputtering. Cr and Cu films were deposited on ITO coated glasses with various DC power density and main pressures as the major parameters. After metal electrodes were formed a heat treatment was followed at 55$0^{\circ}C$ for 20 min in a vacuum furnace. The intrinsic stress of the sputtered Cr film passed a tensile stress maximum decreased and then became compressive with further increasing DC power density. Also with increasing the main pressure stress turned from compression to tension. After heat the treatment the electrical resistivity of the sputtered Cu film of 2${\mu}{\textrm}{m}$ in thickness prepared at 1 motor with the applied power density of 3.70 W/cm$^2$was 2.68 $\mu$$\Omega$.cm With increasing the main pressure the DC magnetron sputtered Cu film became more open structure. The heat treatment decreased the surface roughness of the sputtered Cr/Cu/Cr metal electrodes.