• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.18 no.3
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• pp.216-218
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• 2005

Planar spiral inductors on silicon substrates were optimally designed using MATLAB, which is a tool to perform numerical computations with matrices. The equivalent circuit parameters of the spiral inductors were extracted from the data measured from the spiral inductors fabricated using a 0.18 $\mu\textrm{m}$ RF CMOS process. The metal width, which is a critical design parameter, was optimized for the maximum quality factor with respect to the operating frequency.

• The Transactions of The Korean Institute of Electrical Engineers
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• v.56 no.11
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• pp.1967-1971
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• 2007

In this paper, we verified basic forms and equivalent circuits of spiral inductors and various kinds of parasitics of equivalent circuits by using HFSS and Nexxim program that were 3-D EM analysis tools, and fabrication on-chip spiral inductors using Hynix's 0.25um 1-poly and 5-metal CMOS process. Comparing with PGS(patterned ground shield) and NPGS(non patterned ground shield) of spiral inductors of 3.5 turn, 4.5 turn and 5.5 turn, etc, the application of PGS could improve maximum Q value by 8-12%.

• Proceedings of the KIEE Conference
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• 2006.07c
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• pp.1301-1302
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• 2006

In this paper, embedded spiral inductors are investigated into the PCB substrate for low cost RF SOP applications. The spiral inductors designed with geometrical variations were simulated, fabricated, measured, and characterized by using 3D EM simulator, 8 layered PCB standard process and HP 8510B network analyzer (or verifying their applicability. The fabricated embedded spiral inductor has inductance of 9.4 nH at 800MHz, maximum quality factor of 64.8 at 1.09GHz and self resonant frequency of 3.93GHz, respectively. As the measured inductances and quality factors are well matched with simulated ones. PCB embedded spiral inductors are promising for advanced electronic systems with various functionality, low cost, small size and volume.

• Proceedings of the KIEE Conference
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• 2004.07c
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• pp.2105-2107
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• 2004

In this study, Spiral inductors on the $SiO_2$/Si(100) substrate were fabricated by the magnetron sputtering method. Cu thin film with the thickness of 2 ${\mu}m$ was deposited on the substrate. Also we fabricated square inductors through the wet chemical etching technique. The inductors are completely specified by the turn width and the spacing between spirals. Both the width and spacing between spirals were varied from 10 to 60 ${\mu}m$ and from 20 to 70 ${\mu}m$, respectively. Inductance and Q factor dependent on the RF frequency were investigated to analyze performance of inductor arrays. Also, We recommend that the reasonable Q-factors, spec's turns and thickness of the coil for inductors cab be set to be ideal condition.

• Journal of Advanced Marine Engineering and Technology
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• v.31 no.6
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• pp.777-783
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• 2007

In this work, a highly integrated downconverter MMIC employing HBT(heterojunction bipolar transistor) was developed for application to one chip tranceiver solution of Ku-band commercial wireless communication system. The downconverter MMIC (monolithic microwave integrated circuit) includes mixer filter. amplifier and input/output matching circuit. Especially, spiral inductor structures employing SiN film were used for a suppression of LO and its second harmonic leakage signals. Concretely, they were properly designed so that the self-resonance frequency was accurately tuned to LO and its second harmonic frequency, and they were integrated on the downconverter MMIC.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.48 no.7
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• pp.17-22
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• 2011

To propose effective signaling scheme for inductive coupling link, inductive coupling channel and signaling schemes are analyzed. For fair comparison of various signaling schemes, a signal quality factor ($Q_{signal}$) is introduced and the NRZ signal scheme shows better signal quality factor than BPM signaling schemes. For simulation, the transmitter for inductive coupling link is designed with 0.13 ${\mu}m$ CMOS process and the inductor is modeled as spiral inductor in chip.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.17 no.2
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• pp.162-170
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• 2004

A 900MHz CMOS RF power amplifier with digitally controllable output power has been proposed and designed with 0.6${\mu}{\textrm}{m}$ standard CMOS technology. The designed power amplifier was composed of digitally controllable switch mode pre-amplifiers with an integrated 4nH spiral inductor load and class-C output stage. Especially, to compensate the 1ow Q of integrated spiral inductor, cascode amplifier with a Q-enhancement circuit is used. It has been shown that the proposed power control technique allows the output power to change from almost 3dBm to 13.5dBm. And it has a maximum PAE(Power Added Efficiency) of almost 55％ at 900MHz operating frequency and 3V power supply voltage.

• Proceedings of the KIEE Conference
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• 2000.07c
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• pp.1776-1778
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• 2000

The demands placed on portable wireless communication equipment include low cost, low supply voltage, low power, dissipation, low noise, high frequency of operation, and low distortion. These design requirements cannot be met satisfactorily in many cases without the use of RF inductors. However, implementing the inductor on-chip has been regarded as an impractical task because of excessive substrate capacitance and substantial resistive losses due to metallization and the conductive silicon substrate. Hence, there is a great incentive to design, optimize, and model spiral inductors on Si substrate. So, we analyzed a chip inductors using electromagnetic analysis and established a set of design rules for rectangular spiral inductors.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 1999.11a
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• pp.183-186
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• 1999

A 900 71Hz RF band-pass amplifier for wireless communication systems is designed and fabricated. HSPICE simulation results show that the amplifier can achieve a tunable center frequency between 880 MHz and 920 MHz. The gain of designed amplifier is 19 dB at Q=88, and the power dissipation is about 61 mW under 3 V power supply by using the spiral inductor with negative-7m circuit and center frequency tunning circuit. The designed band-pass amplifier is implemented by using 0.6 um 2-poly-3-metal standard CMOS process.

• The Transactions of The Korean Institute of Electrical Engineers
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• v.56 no.8
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• pp.1471-1475
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• 2007

In this paper, a novel embedded ultra wideband (UWB) band-pass filter is presented on a FR-4 package substrate including high Dk resin coated copper (${\varepsilon}_r=30$) film. The proposed UWB filter is comprised of a parallel resonator with meander-type uniform impedance resonator (UIR) and two series resonators with high Q circular stacked spiral inductor and metal-insulator-metal (MIM) capacitor. In order to obtain excellent attenuation characteristics by generating attenuation poles in lower and upper stop bands, a single MIM capacitor is added to each resonator. The fabricated FR-4 embedded UWB filter has insertion loss of -1.0dB and return loss of -11dB, respectively. It has also extremely wide bandwidth (over 50%) and small size ($3.7{\times}4{\times}0.77\;mm^3$) which is compatible with LTCC devices.