• 대한전자공학회:학술대회논문집
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• 대한전자공학회 2000년도 하계종합학술대회 논문집(2)
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• pp.40-43
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• 2000

The electrons and holes trapped in the tunneling oxide and interface-states generated in the Si/SiO$_2$ interface during program/erase (P/E) operations are known to cause reliability problems which can deteriorate the cell performance and cause the V$_{th}$ window close. This deterioration is caused by the accumulation of electrons and holes trapped in the oxide near the drain and source side after each P/E cycle. we propose three new erase schemes to improve the cell's endurance characteristics: (1)adding a Reverse soft program cycle after the source erase operation, (2)adding a detrapping cycle after the source erase operation, (3)adding a convergence cycle after the source erase operation. (3) is the most effective performance among the three erase schemes have been implemented and shown to significantly reduce the V$_{th}$ window close problem. And we are able to design the reliable periperal circuit of flash memory by using the (3).(3).

• 전기학회논문지
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• 제59권12호
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• pp.2273-2277
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• 2010

In this paper a 2.4GHz CMOS colpitts type microwave oscillator was designed and fabricated using H-spice and Cadence Spetre. There are 140MHz difference between the oscillation frequency and the resonance frequency of a tank circuit of the designed oscillator. The difference is seemed to be due to the parasitic component of the transistor. The inductors used in this design are the spiral inductors proposed in other papers. Cascode current source was used as a bias circuit of a oscillator and the output transistor of the current source is used as the oscillation transistor. A common drain buffer amplifier was used at the output of the oscillator. The measured oscillation frequency and output power of the oscillator are 2.173GHz and -5.53dBm.

• 한국전자파학회논문지
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• 제10권5호
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• pp.663-671
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• 1999

본 연구에서는 GaAs MESFET의 게이트-소오스 캐패시턴스($C_{gs}$)와 드레인-소오스 전류($I_{ds}$)의 비션형성에 의한 이득감소(Gain Compression) 및 위상왜곡(Phase Distortion)특성을 알아보고, 이를 최소화 할 수 있 는 소오스 및 부하 임피던스의 조건에 대해 조사하였다. 먼저 Volterra - Series 분석을 통하여, $C_{gs}(V_{gs})$와 $I_{ds}(V_{gs})$의 비선형특성을 조사하고, 각각의 비선형성분이 상호 소멸되는 소오스 및 부하 임피던스의 조건에서, 전체소자의 비선형성이 최소화 됨을 얄아보았다. 그리고 소오스 및 부하측정(Source, Load Pull)을 통하여 출 력전력값에 따라 최적의 선형성이 나오는 입출력 임피던스값을 찾고, Volterra-Series에서 구한 이론적인 결과와 비교 및 분석을 행하였다.

• Journal of information and communication convergence engineering
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• 제9권6호
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• pp.738-742
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• 2011

This paper has studied drain induced barrier lowering(DIBL) for Double Gate MOSFET(DGMOSFET) using analytical potential model. Two dimensional analytical potential model has been presented for symmetrical DGMOSFETs with process parameters. DIBL is very important short channel effects(SCEs) for nano structures since drain voltage has influenced on source potential distribution due to reduction of channel length. DIBL has to be small with decrease of channel length, but it increases with decrease of channel length due to SCEs. This potential model is used to obtain the change of DIBL for DGMOSFET correlated to channel doping profiles. Also device parameters including channel length, channel thickness, gate oxide thickness and doping intensity have been used to analyze DIBL.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2005년도 춘계학술대회 논문집
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• pp.1459-1462
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• 2005

The paper deals with the structural vibration and noise characteristics of pipe structures. In general, A structure bone noise has a great effect on the drain noise of toilets, and depends on the natural frequency of the related structures. In order to measure and to find the relationships between structural vibration and noise of the pipe structures, some experiments have been performed. Through the experiments, impact acceleration signal in time domain and magnitude of transfer function in the frequency domain have been investigated for three kinds of pipes. Transmission loss of pipes depending on the frequency ranges was also found by using small speakers as a sound source.

• 대한전기학회논문지
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• 제36권6호
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• pp.424-429
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• 1987

It has been observed that the reduction rate of the inversion layer carrier mobility due to the increase of the longitudinal electric field(drain to source direction) decreases as the transverse electric field increases. The effects of this physicar phenomenon to the I-V characteristics of the short channel NMOSFET are studied. It is shown that these effects increase the drain Current in the saturatio region, which agrees with the genarally observed decrepancy between the experimental I-V charateristics and the I-V modeling which dose not include this physical phenomenon. Also it is shown that this effect becomes more important when the device channel length decreases and the device operates in the high electric field range.

• JSTS:Journal of Semiconductor Technology and Science
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• 제4권1호
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• pp.12-17
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• 2004

The body-tied FinFETs (bulk FinFETs) implemented on bulk Si substrate were characterized through 3-dimensional device simulation. By controlling the doping profile along the vertical fin body, the bulk FinFETs can be scaled down to sub-30 nm. Device characteristics with the body shape were also shown. At a contact resistivity of $1{\times}10^{-7}\;{\Omega}\;cm^2$, the device with side metal contact of fin source/drain showed higher drain current by about two. The C-V results were also shown for the first time.

• JSTS:Journal of Semiconductor Technology and Science
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• 제4권1호
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• pp.18-26
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• 2004

Back-gated silicon-on-insulator MOSFET -a threshold-voltage adjustable device-employs a constant back-gate potential to terminate source-drain electric fields and to provide carrier confinement in the channel. This suppresses shortchannel effects of nano-scale and of high drain biases, while allowing a means to threshold voltage control. We report here a theoretical analysis of this geometry to identify its natural length scales, and correlate the theoretical results with experimental device measurements. We also analyze experimental electrical characteristics for misaligned back-gate geometries to evaluate the influence on transport behavior from the device electrostatics due to the structure and position of the back-gate. The backgate structure also operates as a floating-gate nonvolatile memory (NVRAM) when the back-gate is floating. We summarize experimental and theoretical results that show the nano-scale scaling advantages of this structure over the traditional front floating-gate NVRAM.

• 한국진공학회지
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• 제1권1호
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• pp.212-222
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• 1992

To use polycrystalline Si Thin Film Transistor (poly-Si TFT) in high density SRAM instead of High Load Resistor (HLR), TFT is needed to show good electrical characteristics such as large carrier mobility, low leakage current, high driver current and low subthreshold swing. To satisfy these electrical characteristics, the trap state density must be reduced in the channel poly. Technological issues pertinent to the channel poly fabrication process are investigated and discussed. They are solid phase growth (SPG), Si-ion implantation, laser annealing and hydrogenation. The electrical properties of several CVD oxides used as the gate oxide of TFT are compared. The dependence of the electrical characteristics of TFT on source-drain ion-implantation dose, drain offset length and dopant lateral diffusion are also described.

• 한국정보디스플레이학회:학술대회논문집
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• 한국정보디스플레이학회 2000년도 제1회 학술대회 논문집
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• pp.157-158
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• 2000

In this study, to get the larger drain current of the device under the same operation condition as the conventional gate dielectric SiNx thin film transistor devices, we introduced new gate dielectric $Ta_2O_5$ thin film which has high dielectric constant $({\sim}25)$ and good electrical reliabilities. For the application for the TFT device, we fabricated the $Ta_2O_5$ gate dielectric TFT on the low-temperature-transformed polycrystalline silicon thin film using the self-aligned implantation processing technology for source/drain and gate doping. The $Ta_2O_5$ gate dielectric TFT showed better electrical performance than SiNx gate dielectric TFT because of the higher dielectric constant.