• Journal of the Microelectronics and Packaging Society
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• v.11 no.4 s.33
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• pp.1-5
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• 2004

A multi-layer flexible substrate is composed of copper(Cu)/polyimide that are known as good electrical conductivity, and low dielectric constant, respectively. In this study. conductor line of $5{\mu}m$-pitch was successfully fabricated without non-uniform pattern shape by electroplating copper and coating polyimide on patterned stainless steel. For multi-layer flexible substrate, via holes were drilled by UV laser and filled with electroplating copper and tin. And then, the PI layer with vias and conductor lines was stripped from stainless steel substrate. The PI layers were laminated at once with careful alignment between layers. Solid state reaction between tin and copper during lamination formed the intermetallic compounds of $Cu_6Sn_5$($\eta$-phase) and $Cu_3Sn$($\epsilon$-Phase) and achieved a complete inter-connection by vertically positioning the plugged via holes on via pad. The via formation process has several advantages; such as better electrical property and lower cost than V type via and paste via.

• Journal of the Microelectronics and Packaging Society
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• v.28 no.3
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• pp.9-15
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• 2021

Miniaturization of semiconductor devices has recently faced a physical limitation. To overcome this, 3D packaging in which semiconductor devices are vertically stacked has been actively developed. 3D packaging requires three unit processes of TSV, wafer grinding, and bonding, and among these, copper bonding is becoming very important for high performance and fine-pitch in 3D packaging. In this study, the effects of Ti nanolayer on the antioxidation of copper surface and low-temperature Cu bonding was investigated. The diffusion rate of Ti into Cu is faster than Cu into Ti in the temperature ranging from room temperature to 200℃, which shows that the titanium nanolayer can be effective for low-temperature copper bonding. The 12nm-thick titanium layer was uniformly deposited on the copper surface, and the surface roughness (R_q) was lowered from 4.1 nm to 3.2 nm. Cu bonding using Ti nanolayer was carried out at 200℃ for 1 hour, and then annealing at the same temperature and time. The average shear strength measured after bonding was 13.2 MPa.

• Proceedings of the Korean Vacuum Society Conference
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• 2014.02a
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• pp.273.1-273.1
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• 2014

Graphene, a two dimensional plane structure of $sp^2$ bonding, has been promised for a new material in many scientific fields such as physics, chemistry, and so on due to the unique properties. Chemical vapor deposition (CVD) method using transitional metals as a catalyst can synthesize large scale graphene with high quality and transfer on other substrates. However, it is difficult to control the number of graphene layers. Therefore, it is important to manipulate the number of graphene layers. In this work, homogeneous solid solution of Cu and Ni was used to control the number of graphene layers. Each films with different thickness ratio of Cu and Ni were deposited on $SiO_2/Si$ substrate. After annealing, it was confirmed that the thickness ratio accords with the composition ratio by X-ray diffraction (XRD). The synthesized graphene from CVD was analyzed via raman spectroscopy, UV-vis spectroscopy, and 4-point probe to evaluate the properties. Therefore, the number of graphene layers at the same growth condition was controlled, and the correlation between mole fraction of Ni and the number of graphene layers was investigated.

• Journal of the Korean Society for Nondestructive Testing
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• v.16 no.4
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• pp.241-250
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• 1997

The velocity dispersion of surface acoustical wave(SAW) of Si layer/mesh Au/Si substrate was measured by the frequency analysis technique of backward radiation at liquid/solid interface. The difference of backward radiation patterns depending on used transducers (2, 5, 10MHz) confirmed that the backward radiation phenomenon was caused by the energy radiation from SAW generated in surface region. An ultrasonic goniometer was constructed to measure continuously the angular dependence of backscattered intensity. The angular dependences of backward radiation(5MHz) were measured for Ni layer/Al substrate specimens that were bonded by epoxy involving different content of Cu powder. It was known that the width and pattern of backward radiation had informations such as the velocity dispersion, bonding quality and structure of surface region.

• Proceedings of the Korean Vacuum Society Conference
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• 2010.08a
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• pp.85-85
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• 2010

Graphene, the building block of graphite, is one of the most promising materials due to their fascinating electronic transport properties. The pseudo-two-dimensional sp2 bonding in graphene layers yields one of the most effective solid lubricants. In this poster, we present the correlation between electrical and nanomechanical properties of graphene layer grown on Cu/Ni substrate with CVD (Chemical Vapor Deposition) method. The electrical (current and conductance) and nanomechanical (adhesion and friction) properties have been investigated by the combined apparatus of friction force microscopy/conductive probe atomic force microscopy (AFM). The experiment was carried out in a RHK AFM operating in ultrahigh vacuum using cantilevers with a conductive TiN coating. The current was measured as a function of the applied load between the AFM tip and the graphene layer. The contact area has been obtained with the continuum mechanical models. We will discuss the influence of mechanical deformation on the electrical transport mechanism on graphene layers.

• Journal of Powder Materials
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• v.31 no.1
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• pp.37-42
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• 2024

Friction stir spot welding (FSSW) is a solid-state joining process and a rapidly growing dissimilar material welding technology for joining metallic alloys in the automotive industry. Welding tool shape and process conditions must be appropriately controlled to obtain high bonding characteristics. In this study, FSSW is performed on dissimilar materials AA5052-H32 aluminum alloy sheet and SPRC440 steel sheet, and the influence of the shape of joining tool and tool insertion depth during joining is investigated. A new intermetallic compound is produced at the aluminum and steel sheets joint. When the insertion depth of the tool is insufficient, the intermetallic compound between the two sheets did not form uniformly. As the insertion depth increased, the intermetallic compound layer become uniform and continuous. The joint specimen shows higher values of tensile shear load as the diameter and insertion depth of the tool increase. This shows that the uniform formation of the intermetallic compound strengthens the bonding force between the joining specimens and increases the tensile shear load.

• International Journal of Highway Engineering
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• v.10 no.1
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• pp.11-18
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• 2008

The behavior of pavement and waterproofing layer on the steel bridge deck system under traffic loading was analyzed using a finite element method in this paper. In the finite element analysis, the othotropic steel bridge deck is represented by equivalent plate using solid element instead of shell element and the interface is assumed perfect bonding state. The effects of several parameters such as thickness of deck, Young's modulus of deck, thickness of pavement, different braking loading, and temperature on the stresses and strain in the interface are investigated for bridge deck pavement. The shear stress of waterproof layer increases with decrease of bridge deck thickness and stiffness. The change of shear stress is negligible when the bridge deck thictaess is greater than 150mm and stiffness is greater than $2{\times}10^{5}MPa$. As the pavement thickness and temperature decrease, the shear stress in the waterproof layer tends to be increased. The tensile strain at the bottom asphalt layer decreases as the temperature and thickness increase.

• Tribology and Lubricants
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• v.39 no.1
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• pp.13-20
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• 2023

Large drill bits may face high hardness ore and high working pressure when working. To optimize the use effect of large drill bits and prolong the use time, it is necessary to add a layer of pressure-resistant, wear-resistant, and low-friction coating on the surface of the drill bit. In this study, CoCrNiAlTi high-entropy alloy coatings and CoCrNiAlTi (70 wt%)-TiC (30 wt%) composite coatings are successfully prepared on Q235 steel by plasma spraying. The CoCrNiAlTi (70 wt%)-TiC (30 wt%) coating consists of FCC solid solution and a small amount of TiC phase. The effect of TiC on the composition phase, microhardness, and elastic modulus of HEA coating is studied by X-ray diffractometer (XRD) and microhardness tester. The effect of TiC on the friction and wear properties of HEA coatings is investigated using a wear tester. By improving the process parameters, the metallurgical bonding between the coating and the substrate is well combined, and a coating without pores and cracks is obtained. The experimental results confirm that the microhardness, elastic modulus, and wear resistance of CoCrNiAlTi-TiC composite coating are better, and the friction coefficient is lower.

• Structural Engineering and Mechanics
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• v.61 no.3
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• pp.407-417
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• 2017

RC shear walls are considered one of the main lateral resisting members in buildings. In recent years, FRP has been widely utilized in order to strengthen and retrofit concrete structures. A number of experimental studies used CFRP sheets as an external bracing system for retrofitting of RC shear walls. It has been found that the common mode of failure is the debonding of the CFRP-concrete adhesive material. In this study, behavior of RC shear wall was investigated with three different micro models. The analysis included 2D model using plane stress element, 3D model using shell element and 3D model using solid element. To allow for the debonding mode of failure, the adhesive layer was modeled using cohesive surface-to-surface interaction model at 3D analysis model and node-to-node interaction method using Cartesian elastic-plastic connector element at 2D analysis model. The FE model results are validated comparing the experimental results in the literature. It is shown that the proposed FE model can predict the modes of failure due to debonding of CFRP and behavior of CFRP strengthened RC shear wall reasonably well. Additionally, using 2D plane stress model, many parameters on the behavior of the cohesive surfaces are investigated such as fracture energy, interfacial shear stress, partial bonding, proposed CFRP anchor location and using different bracing of CFRP strips. Using two anchors near end of each diagonal CFRP strips delay the end debonding and increase the ductility for RC shear walls.

• Proceedings of the Korean Vacuum Society Conference
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• 2012.02a
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• pp.135-136
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• 2012

Carbon atoms near the surface of W(110) induce reconstructions such as $R(15{\times}12)$ -C/W(110) which consists of two characteristic parts, one square shaped and bright protrusion and two smaller ones. In the atomic resolution STM image, the bigger protrusion shows the periodicities of clean W(110), indicating that it is almost carbon poor region. The smaller protrusion contains hexagonal carbide surface layer of ${\alpha}$-W2C on W(110). Employing this carburized W(110) as templates, we grow Co and Fe clusters of less than ten atoms. Due to the selectivity of bonding sites, growth of larger cluster is highly unfavorable for Co and the size of clusters is very uniform. Since Co atoms prefer to sit on the bigger protrusion rather than smaller one, Co cluster can be arranged one-dimensionally in $R(15{\times}12)$-C/W(110) with quite uniform size distribution. However, Fe clusters sit on both sites without favored site, but still with uniform size distribution. On the other hand, Fe clusters can be grown with quasi one-dimensional order in $R(15{\times}3)$-C/W(110), which consists of only smaller protrusions. We investigate the magnetic properties of the ordered nano-sized clusters. Experiments using XMCD reveals little magnetic moment of Co cluster on $R(15{\times}12)$-C/W(110). This observation is consistent with the predictions of our first principles calculations that small Co clusters can be nonmagnetic or antiferromagnetic with low mean magnetic moment per atom.