• Journal of the Semiconductor & Display Technology
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• v.10 no.4
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• pp.53-59
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• 2011

Recently there have been considerable attentions on nanoimprint lithography (NIL) by the display device and semiconductor industry due to its potential abilities that enable cost-effective and high-throughput nanofabrication. Although one of the current major research trends of NIL is large-area patterning, the technical difficulties to keep the uniformity of the residual layer become severer as the imprinting area increases more and more. In this paper we focused on the deformation of the $2^{nd}$ generation TFT-LCD sized ($370{\times}470mm^2$) large-area soft mold in the UV imprinting process. A mold was fabricated with PDMS(Poly-dimethyl Siloxane) layered glass back plate(t0.5). Besides, the mold includes large surrounding wall type protrusions of 1.9 mm width and the via-hole(7 ${\mu}m$ diameter) patterend area. The large surrounding wall type protrusions cause the proximity effect which severely degrades the uniformity of residual layer in the via-hole patterend area. Therefore the deformation of the mold was calculated by finite element analysis to assess the effect of large surrounding wall type protrusions and the flexiblity of the mold. The deformation of soft mold was verified by the measurements qualitatively.

• KSII Transactions on Internet and Information Systems (TIIS)
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• v.9 no.10
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• pp.4015-4033
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• 2015

The future mobile networks consist of hyper-dense heterogeneous and small cell networks of same or different radio access technologies (RAT). Integrating mobile networks of different RATs to provide seamless and smooth mobility service will be the target of future mobile converged network. Generally, handover from high-speed networks to low-speed networks faces many challenges from application perspective, such as abrupt bandwidth variation, packet loss, round trip time variation, connection disruption, and transmission blackout. Existing inter-RAT handover solutions cannot solve all the problems at the same time. Based on the high-layer convergence sublayer design, a new receiver-aided soft inter-RAT handover is proposed. This soft handover scheme takes advantage of multihoming ability of multi-mode mobile station (MS) to smooth handover procedure. In addition, handover procedure is seamless and applicable to frequent handover scenarios. The simulation results conducted in UMTS-WiMAX converged network scenario show that: in case of TCP traffics for handover from WiMAX to UMTS, not only handover latency and packet loss are eliminated completely, but also abrupt bandwidth/wireless RTT variation is smoothed. These delightful features make this soft handover scheme be a reasonable candidate of mobility management for future mobile converged networks.

• Proceedings of the Korean Geotechical Society Conference
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• 2005.03a
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• pp.956-965
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• 2005

In this paper, the effect on the forced replacement depth of the revetment in soft soil with inter sand layer is analyzed by model test. In the result, the forced replacement occur in 60 second from filling the embankment material. The shape of the forced replacement depth is like to punching shape. Then, in case of thin inter sand layer and near the embankment, the forced replacement depth of inter sand layer case is more than only clayed soil case.

• Journal of the Korean Society of Food Science and Nutrition
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• v.30 no.5
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• pp.877-881
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• 2001

A domestic wheat variety (Geurumil flour) was evaluated for the properties of white layer cake, and compared to a commercial soft wheat flour. Geurumil flour contained more protein, ash, and lipid contents than commercial soft wheat flour. Very little difference in cake batter pH was observed between soft wheat flour and Geurumil flour, and the addition of emulsifiers tended to decrease the pH of Geurumil cake batter The specific gravity of the cake batter was lower in Geurumil flour than in soft wheat flour, and decreased effectively by the addition of emulsifiers due to batter aeration. Specific loaf volume was influenced by the addition of emulsifiers and demonstrated the highest values at the level of 1 ~ 2%. Addition of Ester-400 (monoglyceride) showed better cake properties in terms of volume, symmetry and uniformity index than sucrose-fatty acid ester did, and thus appeared to be more effective in improving baking performance. The changes in firmness of cakes during storage at $25^{\circ}C$ were observed, and Ester-400 showed some Positive effects on retarding cake staling.

• Geomechanics and Engineering
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• v.3 no.2
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• pp.117-130
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• 2011

The methods of design available for geocell-supported embankments are very few. Two of the earlier methods are considered in this paper and a third method is proposed and compared with them. In the first method called slip line method, plastic bearing failure of the soil was assumed and the additional resistance due to geocell layer is calculated using a non-symmetric slip line field in the soft foundation soil. In the second method based on slope stability analysis, general-purpose slope stability program was used to design the geocell mattress of required strength for embankment. In the third method proposed in this paper, geocell reinforcement is designed based on the plane strain finite element analysis of embankments. The geocell layer is modelled as an equivalent composite layer with modified strength and stiffness values. The strength and dimensions of geocell layer is estimated for the required bearing capacity or permissible deformations. These three design methods are compared through a design example. It is observed that the design method based on finite element simulations is most comprehensive because it addresses the issue of permissible deformations and also gives complete stress, deformation and strain behaviour of the embankment under given loading conditions.

• Journal of the Korean Geotechnical Society
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• v.28 no.8
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• pp.89-99
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• 2012

The expansion of a road on soft ground could induce an additional settlement to the existing road because of the consolidation characteristics of the soft soil layer subjected to additional load by an adjacent banking. In such case, the existing road could be faced with various problems during the stages of the construction and maintenance, such as deterioration of not only the surface smoothness yielding the decrease in automobile performance safety but also the structural stability of the embankment. These kinds of problems are expected to occur more freguently especially for the deep ground level with a fairly thick soft soil layer. Therefore, they should be examined and studied adequately during the design stage. As a reference case study, this paper deals with the project named Namhae Expressway of 2nd Branch with the soft soil layer with the thickness upto about 50m. After a lengthy review of the original design, an improved design is proposed.

• Journal of the Earthquake Engineering Society of Korea
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• v.3 no.1
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• pp.113-122
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• 1999

The importance of the vertical response of a structure was well recognized after the Hyogoken-Nanbu earthquake of Japan. However, most of the seismic design codes does not specified the site sail profiles, and the sail and foundations conditions were mostly neglected in the vertical seismic analyses of a structure. In this paper, the effects of foundation size, sail layer depth under the foundation, foundation embedment and pile foundation on the vertical seismic response spectra for both surface and embedded mat foundation were studied to investigate the effects of the soft soil layer on the vertical response of a structure excited with the vertical components of Taft and El Centro earthquakes, considering the sail profile types of $S_A,S_C,S_E$ in UBC-97, the medium and large size foundations, the soil layer depth under the foundation of 30 and 60m, the foundation embedment of 0 and 15m, and the precast reinforced concrete bearing piles installed in the soft soil deposit. According to the study results, the foundation size has a little effect on the vertical seismic response, However, the soil layer depth under the foundation of 60m has to be considered for the vertical seismic analysis of a structure as for the horizontal one. The embedded pile foundations as well as the surface ones built on the soft soil layer amplified the vertical seismic response of a structure very much.

• Journal of the Microelectronics and Packaging Society
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• v.22 no.3
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• pp.51-56
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• 2015

It has been used various pad finish materials to enhance the reliability of solder joint and recently Electroless Ni Electroless Pd Immersion Gold (the following : ENEPIG) pad has been used more than others. This study is about reliability according to being used in commercial Electrolytic Ni pad and ENEPIG pad, and was observed behavior of various Cu contents. After reflow, the inter-metallic compound (IMC) between solder and pad is composed of $Cu_6Sn_5$ (Ni substituted) by using EDS, and in case of ENEPIG, between IMC and Ni layer was observed the dark layer ($Ni_3P$ layer). Additional, it could be controlled the thickness of dark layer according to Cu contents. Investigated the different fracture mode between electrolytic Ni and ENEPIG pad after drop shock test, in case of soft Ni, accelerated stress propagated along the interface between $1^{st}$ IMC and $2^{nd}$ IMC, and in case of ENEPIG pad, accelerated stress propagated along the weaken surface such as dark layer. The unstable interface exists through IMC, pad material and solder bulk by the lattice mismatch, so that the thermal and physical stress due to the continuous exterior impact is transferred to the IMC interface. Therefore, it is strongly requested to control solder morphology, IMC shape and thickness to improve the solder reliability.

• Proceedings of the Korean Vacuum Society Conference
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• 2000.02a
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• pp.74-74
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• 2000

낮은 유전상수(k$\leq$3)와 높은 열적안정성(>4$25^{\circ}C$)은 초고집적회로(ULSI)기술에서 RC 지연을 해결하기 위한 금속배선의 중간 절연층으로서의 2개의 가장 중요한 특성이다. 본 연구에서는 cyclohezane을 precursor로 사용하여 plasma enhanced chemical vapor deposition(PECVD)방법으로 유기박막을 성장시켰으며 낮은 유전상수와 높은 열적안정성을 동시에 확보하기 위하여 열적안정성은 좋지 않지만 유전상수가 낮은 박막(soft layer)위에 유전상수는 다소 높지만 열적안정성이 좋은 박막(hard layer)을 얇게 증착하여 hard layer/soft layer의 2층 구조를 형성하여서 구조적, 전기적 특성을 조사하였다. 유기박막은 5$0^{\circ}C$로 유지된 reactor 내부에서 argon(Ar) plasma에 의해 증착되었으며 platinum(Pt)기판과 silicon 기판위에 동시에 증착하였다. Pt 기판위에 증착한 시편으로 유전상수, I-V 등 전기적 특성을 측정하였고, silicon 기판위에 증착한 시편으로 열적안정성과 구조적 특성등을 분석하였다. 증착압력 0.2Torr에서 plasma power를 5W에서90W로 증가할 때 유전상수는 2.36에서 3.39로 증가하였으며 열적안정성은 90W에서 180W로 증가하였을 때 유전상수는 2.42에서 2.79로 증가하엿고 열적안정성은 모두30$0^{\circ}C$이하였다. 단일층 구조에서는 유전상수가 낮은 박막은 열적으로 불안정하고 열적 안정성이 좋은 박막은 유전상수가 다소 높은 문제가 나타났다. 이런 문제를 해결하기 위하여 2 Torr, 120W에서 증착한 유전상수가 2.55이고 열적으로 불안정한 박막을 soft layer로 5150 증착하고 그 위에 0.2Torr, 90W에서 증착한 유전상수가 3.39이고 열적으로 45$0^{\circ}C$까지 안정한 박막을 hard layer로 360 , 720 , 1440 증착하였다. 증착된 2층구조 박막의 유전상수는 각각 2.62, 2.68, 2.79이었으며 열적안정성 측정에서는 40$0^{\circ}C$까지 두께 감소가 보이지 않았다. 그러나 SEM 측정에서 열처리 후 표면이 거칠어지는 현상이 발견되었다.

• Korean Journal of Materials Research
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• v.14 no.11
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• pp.780-785
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• 2004

The degradation mechanism of soft magnetic properties of $Fe-Hf-N/Cr/SiO_2$ thin films reacted with a bonding glass was investigated. When $Fe-Hf-N/Cr/SiO_2$ films were annealed under $600^{\circ}C$ without the bonding glass, the compositions and the soft magnetic properties of Fe-Hf-N layers were not changed. However, after reaction with the bonding glass at $550^{\circ}C$, the soft magnetic properties of the film were degraded. At $600^{\circ}C$, the saturation magnetization of the reacted film decreased to 13.5 kG, and its coercivity increased to 4 Oe, and its effective permeability decreased to 700. It was founded that O diffused from the glass into the Fe-Hf-N layers during the reaction and generated $HfO_2$ phases. It was considered that the soft magnetic properties of the $Fe-Hf-N/Cr/SiO_2$ films reacted with the bonding glass were primarily degraded by the formation of the Fe-Hf-O-N layer of which the Fe content was below 60 $at\%$, and secondarily degraded by the Fe-Hf-O-N layer above 70 $at\%$.