• Proceedings of the Materials Research Society of Korea Conference
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• 2003.03a
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• pp.200-200
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• 2003

고체산화물 연료전지(SOFC)에서 사용되는 연결재의 주 기능은 각 단위 셀의 연료극과 다음 셀의 공기극을 전기적으로 연결하여, 공기와 사용연료의 분리역할을 하기 위하여 사용된다. SOFC용 연결재는 다른 구성요소 소재보다, 높은 전자 전도성, 낮은 이온전도성, 우수한 기계 적강도가 요구되며, SOFC는 고온에서 작동되기 때문에, 상온에서 작동온도까지 다른 요소 소재들과 유사한 열팽창계수와 물리, 화학적으로 안정성이 요구된다. 현재 연결재 제조기술은 EVD, CVD, plasma spraying, tape casting 등 다양하게 연구되고 있으며, 본 연구는 세라믹 연결재 증착방법 중 저렴한 비용으로 대량 생산이 용이한 습식법(dip coaling)을 적용하여, 연료극 지지체식 flat-tube형 고체산화물 연료전지의 지지체를 위해 세라믹 연결재를 제조하고, 그 특성을 연구하였다. 세라믹 연결재로써 선정한 합성조성은 LaCr $O_3$에 Ca이 치환 고용된 L $a_{0.6}$C $a_{0.41}$Cr $O_3$으로 pechini법으로 합성하였다. 합성된 조성은 100$0^{\circ}C$에서 5시간 하소후 가속 Ball Milling하여 0.5$\mu\textrm{m}$의 평균입자크기를 얻을 수 있었다. XRD 상분석결과 perovskite상 (L $a_{1-x}$ Ca/x/Cr $O_3$)과 CaCr $O_4$를 얻을 수 있었다. slurry를 제조하여 막의 밀착성을 증진시키기 위해 sand blasting시킨 flat tube지지체에 진공펌프를 이용하여 소재내부와 외부의 압력차로 dip coating한 후, 140$0^{\circ}C$로 소결 하였다. coating 결과 박리현상은 없었으나, 표면과 단면의 SEM분석결과 다소 porous한 박막층이 형성되었으며, Ca이온이 지지체로 permeation되는 현상이 발생하였다. 이와 같은 결과로부터 보다 치밀한 박막생성을 위해, slurry 제조조건을 변화시켰으며, Ca이온의 migration을 막기 위해 barrier layer를 이용하였다 완전 소결된 지지체는 가스투과도와 전기전도도측정을 통하여 특성을 평가하였다.였다.다.

• Journal of Powder Materials
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• v.19 no.6
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• pp.446-450
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• 2012

In order to fabricate the porous Mo with controlled pore characteristics, unique processing by using $MoO_3$ powder as the source and camphene as the sublimable material is introduced. Camphene-based 15 vol% $MoO_3$ slurries, prepared by milling at $50^{\circ}C$ with a small amount of dispersant, were frozen at $-25^{\circ}C$. Pores were generated subsequently by sublimation of the camphene during drying in air for 48 h. The green body was hydrogen-reduced at $750^{\circ}C$, and sintered at $1000-1100^{\circ}C$ for 1 h. After heat treatment in hydrogen atmosphere, $MoO_3$ powders were completely converted to metallic W without any reaction phases. The sintered samples showed large pores with the size of about $150{\mu}m$ which were aligned parallel to the camphene growth direction. Also, the internal wall of large pores and near bottom part of specimen had relatively small pores due to the difference in the camphene growth rate during freezing process. The size of small pores was decreased with increase in sintering temperature, while that of large pores was unchanged. The results are strongly suggested that the porous metal with required pore characteristics can be successfully fabricated by freeze-drying process using metal oxide powders.

• Journal of the Korean Society for Precision Engineering
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• v.19 no.10
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• pp.156-162
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• 2002

There are many factors affecting the results of CMP (Chemical Mechanical Polishing). Among them, the temperature is related to the removal rate and WIWNU (Within Wafer Non-Uniformity). In other words, the removal rate is proportional to the temperature and the variation of temperature distribution on a pad affects the non-uniformity within a wafer. In the former case, the active chemistry improves the rate of chemical reaction and the removal rate becomes better. But, there are not many advanced studies. In the latter case, a kinematical analysis between work-piece and pad can be obtained. And such result analysed from the mechanical aspect can be directly related to the temperature distribution on a pad affecting WIWNU. Meanwhile, the temperature change affects the quantities of both slurry and pad. The change of a pH value of the slurry chemistry due to a temperature variation affects the surface state of an abrasive particle and hence the agglomeration of abrasives happens above the certain temperature. And the pH alteration also affects the zeta potential of a pad surface and therefore the electrical force between pad and abrasive changes. Such results could affect the removal rate and etc. Moreover, the temperature changes the 1st and 2nd elastic moduli of a pad which are closely related to the removal rate and the WIWNU.

• Journal of the Korean institute of surface engineering
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• v.50 no.5
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• pp.352-359
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• 2017

The growth of nanocrystalline diamond films on a p-type poly silicon substrate was studied using microwave plasma chemical vapor deposition method. A 6 mm thick poly silicon plate was mirror polished and scratched in an ultrasonic bath containing slurries made of 30 cc ethanol and 1 gram of diamond powders having different sizes between 5 and 200 nm. Upon diamond deposition, the specimen scratched in a slurry with the smallest size of diamond powder exhibited the highest diamond particle density and, in turn, fastest diamond film growth rate. Diamond deposition was carried out applying different DC bias voltages (0, -50, -100, -150, -200 V) to the substrate. In the early stage of diamond deposition up to 2 h, the effect of voltage bias was not prominent probably because the diamond nucleation was retarded by ion bombardment onto the substrate. After 4 h of deposition, the film growth rate increased with the modest bias of -100 V and -150 V. With a bigger bias condition(-200 V), the growth rate decreased possibly due to the excessive ion bombardment on the substrate. The film grown under -150V bias exhibited the lowest contact angle and the highest surface roughness, which implied the most hydrophilic surface among the prepared samples. The film growth rate increased with the apparent activation energy of 21.04 kJ/mol as the deposition temperature increased in the range of $300{\sim}600^{\circ}C$.

• Korean Journal of Materials Research
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• v.31 no.9
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• pp.532-538
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• 2021

In this study, a spray dryer is used to make granules of Y₂O₃ and YF₃, and then Y₅O₄F₇ is synthesized following heat treatment of them under Ar gas atmosphere at 600 ℃. Single and binary monomer mixtures are compared and analyzed to optimize photocurable monomer system for DLP 3D printing. The mixture of HEA and TMPTA at 8:2 ratio exhibits the highest photocuring properties and low viscosity with shear thinning behavior. The optimized photocurable monomer and synthesized Y₅O₄F₇ are therefore mixed and applied to printing process at variable solid contents (60, 70, 80, & 85 wt.%) and light exposure times. Under optimal light exposure conditions (initial exposure time: 1.2 s, basic exposure time: 5 s), YOF composites at 60, 70 & 80 wt.% solid contents are successfully printed. As a result of measuring the size of the printed samples compared to the dimensions of the designed bar type specimen, the deviation is found to increase as the YOF solid content increases. This shows that it is necessary to maximize the photocuring activity of the monomer system and to optimize the exposure time when printing using a high-solids ceramic slurry.

• Korean Journal of Materials Research
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• v.34 no.1
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• pp.27-33
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• 2024

Al₂O₃ has excellent sintering properties and is important in semiconductor manufacturing processes that require high-temperature resistance and chemical inertness in a plasma environment. In this study, a comprehensive analysis of the chemical characteristics, physical properties, crystal structure, and dispersion stability of three commercially available Al₂O₃ powders was conducted. The aim was to provide a technological foundation for selecting and utilizing appropriate Al₂O₃ powders in practical applications. All powders exhibited α-Al₂O₃ as the main phase, with the presence of beta-phase Na₂O-11Al₂O₃ as the secondary phase. The highest Na⁺ ion leaching was observed in the aqueous slurry state due to the presence of the secondary phase. Although the average particle size difference among the three powders was not significant, distinct differences in particle size distribution were observed. ALG-1SH showed a broad particle size distribution, P162 exhibited a bimodal distribution, and AES-11 displayed a uniform unimodal distribution. High-concentration Al₂O₃ slurries showed differences in viscosity due to ion release when no dispersant was added, affecting the electrical double-layer thickness. Polycarboxylate was found to effectively enhance the dispersion stability of all three powders. In the dispersion stability analysis, ALG-1SH exhibited the slowest sedimentation tendency, as evidenced by the low TSI value, while P162 showed faster precipitation, influenced by the particle size distribution.

• Proceedings of the KIEE Conference
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• 2006.07c
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• pp.1384-1385
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• 2006

Platinum is a candidate of top and bottom electrode in ferroelectric random access memory and dynamic random access memory. High dielectric materials and ferroelectric materials were generally patterned by plasma etching, however, the low etch rate and low etching profile were repoted. We proposed the damascene process of high dielectric materials and ferroelectric materials for patterning process through the chemical mechanical polishing process. At this time, platinum as a top electrode was used for the stopper for the end-point detection as Igarashi model. Therefore, the control of removal rate in platinum chemical mechanical polishing process was required. In this study, an addition of $H_{2}O_{2}$ oxidizer to alumina slurry could control the removal rate of platinum. The removal rate of platinum rapidly increased with an addition of 10wt% $H_{2}O_{2}$ oxidizer from 24.81nm/min to 113.59nm/min. Within-wafer non-uniformity of platinum after chemical mechanical polishing process was 9.93% with an addition of 5wt% $H_{2}O_{2}$ oxidizer.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2007.06a
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• pp.78-78
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• 2007

In semiconductor devices, Cu has been used for the formation of multilevel metal interconnects by the damascene technique. Also lower dielectric constant materials is needed for the below 65 nm technology node. However, the low-k materials has porous structure and they can be easily damaged by high down pressure during conventional CMP. Also, Cu surface are vulnerable to have surface scratches by abrasive particles in CMP slurry. In order to overcome these technical difficulties in CMP, electro-chemical mechanical planarization (ECMP) has been introduced. ECMP uses abrasive free electrolyte, soft pad and low down-force. Especially, electrolyte is an important process factor in ECMP. The purpose of this study was to characterize KOH and $KNO_3$ based electrolytes on electro-chemical mechanical. planarization. Also, the effect of additives such as an organic acid and oxidizer on ECMP behavior was investigated. The removal rate and static etch rate were measured to evaluate the effect of electro chemical reaction.

• Journal of Korean Society of Environmental Engineers
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• v.36 no.5
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• pp.303-310
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• 2014

This study investigated the reduction of food waste through the slurry phase decomposition in a source of food waste by microorganisms. The reactor used in the experiment was composed of both woodchip with wood material and sponges with polyurethane material as media of attached microorganisms, and food waste was mixed with a constant cycle consisted of a stirring device. During the experimental period of 100 days, the change in weight over the cumulative total amount of food waste added was reduced by 99%. Approximately, 1% of the residual food waste could be inherently recalcitrant materials (cellulose, hemicellulose, lignin, etc.) and thus was thought to be the result of the accumulation. The initial pH in wastewater generated from food waste was low with 3.3 and after 24 hours treatment this pH was increased to 5.8. The concentrations of COD, BOD, SS, salinity, TN and TP were gradually decreased. Food waste decay was proceeded by the seven species microorganisms identified and confirmed in this study, making a slurry phase and thus reducing residual food wastes. In the initial phase, the microbial population was approximately $3.3{\times}10^4$ cell/mL, and after 15 days this population was a constant with $5.1{\times}10^6$ cell/mL which means a certain stabilization for the reduction of food wastes. From these results, it can be considered that organic matter decomposition as well as the weight loss of food wastes by microorganisms is done at the same time.

• Proceedings of the Materials Research Society of Korea Conference
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• 1999.11a
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• pp.183-183
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• 1999

Slurry sol(30at% anatase TiO$_2$)을 이용하여 스핀코팅으로 유리기판에 TiO$_2$박막을 제조하였다. 박막의 두께는 코팅주기의 횟수로 조절하였다. 한 코팅주기는 스핀코팅, 건조, 열처리를 포함한다. 박막의 반응성은 막 위에서의 자외선강도가 0.4mW/$\textrm{cm}^2$인 조건에서 벤젠기체의 광분해 속도를 통해 조사하였다. 박막의 두께가 증가할수록 표면적인 증가로 인해 반응성은 증가하였으며, 4$\mu\textrm{m}$정도이상의 두께에서 반응성은 더 이상 증가되지 않았다. porous한 TiO$_2$박막은 비교적 넓은 유효 표면적을 가지고 있으며, 그것은 두께증가에 따라 반응속도를 결정하는 결과를 낳았다.