• Transactions on Electrical and Electronic Materials
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• v.3 no.4
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• pp.5-9
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• 2002

Chemical mechanical polishing (CMP) has become the preferred planarization method for multilevel interconnect technology due to its ability to achieve a high degree of feature level planarity. Especially, to achieve the higher density and greater performance, shallow trench isolation (STI)-CMP process has been attracted attention for multilevel interconnection as an essential isolation technology. Also, it was possible to apply the direct STI-CMP process without reverse moat etch step using high selectivity slurry (HSS). In this work, we determined the process margin with optimized process conditions to apply HSS STI-CMP process. Then, we evaluated the reliability and reproducibility of STI-CMP process through the optimal process conditions. The wafer-to-wafer thickness variation and day-by-day reproducibility of STI-CMP process after repeatable tests were investigated. Our experimental results show, quite acceptable and reproducible CMP results with a wafer-to-wafer thickness variation within 400$\AA$.

• KCI Concrete Journal
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• v.13 no.2
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• pp.42-48
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• 2001

The bend resistance of coated reinforcing bar is greatly influenced by both the adhesion strength between bar and coating materials, and the followed transformation of coating material as bars bend. Especially, tearing state or partial microscopic cracks are predicted on the inside and outside of bending angle, because tensile strength and elongation of polymer film are very different according to types of polymer dispersions in bar coating, and these damaged parts are rapidly corroded by penetration of corrosive factors. In this study, polymer cement slurry coated reinforcing bars with various polymer dispersions are prepared by following combined conditions, polymer-cement ratio of 50% and 100%, coating thickness of 250$\mu$m and 450$\mu$m, coating number, curing age of 3, 7, 14 and 28days. Then the specimens are tested for working life and bend resistance at bending angles $90^{\circ}$, $135^{\circ}$and $180^{\circ}$ to observe the microscopic damage effect as the bars bend. Also, epoxy-coated reinforcing bars for control experiment were used with 250$\mu$m of coating thickness. The tensile strength for polymer films is performed. From the test results, the working life of the polymer cement slurry is within 90 seconds. Among four types of polymer dispersion, polymer cement slurry coated reinforcing bar using St/BA-1 emulsion has the excellent bend resistance, which is remarkably improved than that of epoxy-coated reinforcing bar. And the bend resistance is more related to elongation than tensile strength of polymer film. Polymer cement slurry with a polymer-cement ratio of 100%, a coating thickness of $450\mu$m and one coating using St/BA emulsion is selected as a most suitable coating material for coated reinforcing bar.

• Carbon letters
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• v.19
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• pp.72-78
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• 2016

Spinnable pitches and carbon fibers were successfully prepared from petroleum or coal pyrolysis residues. After pyrolysis fuel oil (PFO), slurry oil, and coal tar were simply filtered to eliminate the solid impurities, the characteristics of the raw materials were evaluated by elemental analysis, ¹³C nuclear magnetic resonance spectrometer, matrix-assisted laser desorption/ionization time-of-flight mass spectrometer (MALDI-TOF-MS), and so on. Spinnable pitches were prepared for melt-spinning carbon fiber through a simple distillation under strong nitrogen flow, and further vacuum distillation to obtain a high softening point. Carbon fibers were produced from the above pitches by single-hole melt spinning and additional heat treatment, for oxidization and carbonization. Even though spinnable pitches and carbon fibers were processed under the same conditions, the melt-spinning and properties of the carbon fiber were different depending on the raw materials. A fine carbon fiber could not be prepared from slurry oil, and the different diameter carbon fibers were produced from the PFO and coal tar pitch. These results seem to be closely correlated with the initial characteristics of the raw materials, under this simple processing condition.

• Transactions on Electrical and Electronic Materials
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• v.8 no.1
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• pp.5-10
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• 2007

Using a reference slurry, ammonium dodecyl sulfate (ADS), an anionic and environmentally friendly surfactant, was investigated as an alternative to BTA for its inhibition and lubrication characteristics. Results demonstrated that the inhibition efficiency of ADS was superior to that of BTA. Coefficient of friction (COF) was the lowest when the slurry contained ADS. This suggested that adsorbed ADS on the surface provided lubricating action thereby reducing the wear between the contacting surfaces. Temperature results were consistent with the COF and removal rate data. ADS showed the lowest temperature rise again confirming the softening effect of the adsorbed surfactant layer and less energy dissipation due to friction. Spectral analysis of shear force showed that increasing the pad-wafer sliding velocity at constant wafer pressure shifted the high frequency spectral peaks to lower frequencies while increasing the variance of the frictional force. Addition of ADS reduced the fluctuating component of the shear force and the extent of the pre-existing stick-slip phenomena caused by the kinematics of the process and collision event between pad asperities with the wafer. By contrast, in the case of BTA, there were no such observed benefits but instead undesirable effects were seen at some polishing conditions. This work underscored the importance of real-time force spectroscopy in elucidating the adsorption, lubrication and inhibition of additives in slurries in CMP.

• Journal of Powder Materials
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• v.12 no.3
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• pp.192-200
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• 2005

Ultrafine copper powder was prepared from $CuO-H_2O$ slurry with hydrazine, a reductant, under $70^{\circ}C$. The influence of various reaction parameters such as temperature, reaction time, molar ratio of $N_2H_4$, PvP and NaOH to Cu in aqueous solution had been studied on the morphology and powder phase of Cu powders obtained. The production ratio of Cu from CuO was increased with the ratio of $N_2H_4/Cu$ and the temperature. When the ratio of $N_2H_4/Cu$ was higher than 2.5 and the temperature was higher than $60^{\circ}C$, CuO was completely reduced into Cu within 40 min. The crystalline size of Cu obtained became fine as the temperature increase, whereas the aggregation degree of particles was increased with the reaction time. The morphology of Cu powder depended on that of the precursor of CuO and processing conditions. The average particle size was about $0.5{\mu}m$.

• Journal of the Korean Ceramic Society
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• v.47 no.2
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• pp.151-156
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• 2010

Porous mullite/alumina composites have been fabricated by a freeze casting technique using TBA-based coal fly ash/alumina slurry. After sintering, unidirectional macropore channels aligned regularly along the TBA ice growth direction were developed; simultaneously, small sized micropores fromed in the outer walls of the pore channels. The physical and mechanical properties (e.g. porosity and compressive strength) of the sintered porous composites were roughly dependant of processing conditions, due to the complexity of the factors affecting them. However, with increasing solid loading and sintering temperature, the compressive strength generally increased and the porosity decreased. After sintering $1500^{\circ}C$ for 2 h, the porous specimen (porosity: 52.1%) showed a maximum compressive strength of 70.0 MPa.

• Textile Coloration and Finishing
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• v.29 no.3
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• pp.131-138
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• 2017

Most of high performance fabrics for the car racing protective clothing have been developed to have thermal resistance, flame retardant property, impact resistance and anti-frictional properties to protect the racer from the crucial accident. In this study, the meta-aramid fabric, which has inherent flame retardant, was coated with nanoparticles of SiC to enhance the impact resistance and anti-friction properties. Uniform coating of the nanoparticles onto the fabrics was obtained by using tape casting method. As the experimental parameters, size and content of the SiC nanoparticle were varied with the coating conditions of the fabric surface. The effects of the nanoparticle coating on the properties of meta-aramid fabric were examined with various instrumental analyses such as SEM, tensile strength and abrasion test.

• Transactions on Electrical and Electronic Materials
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• v.7 no.4
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• pp.167-172
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• 2006

Submicron colloidal silica coated with ceria were prepared by mixing of silica and nano ceria particles and modified by hydrothermal reaction. The polishing efficiency of the ceria coated silica slurry was tested over oxide film on silicon wafer. By changing the polishing pressure in the range of $140{\sim}420g/cm^2$ with the ceria coated silica slurries in $100{\sim}300nm$, rates, WIWNU and friction force were measured. The removal rate was in the order of 200, 100, and 300 nm size silica coated with ceria. It was known that the smaller particle size gives the higher removal rate with higher contact area in Cu slurry. In the case of oxide film, the indentation volume as well as contact area gives effect on the removal rate depending on the size of abrasives. The indentation volume increase with the size of abrasive particles, which results to higher removal rate. The highest removal rate in 200 nm silica core coated with ceria is discussed as proper combination of indentation and contact area effect.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2006.11a
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• pp.57-58
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• 2006

In MIM (metal insulator metal) capacitor, Ru (ruthenium) has been suggested as new bottom electrode due to its excellent electrical performance, a low leakage of current and compatibility to the high dielectric constant materials. In this case of Ru bottom electrode, CMP (chemical mechanical planarization) process was needed m order to planarize and isolate the bottom electrode. In this study, the effect of chemical A on polishing and etching behavior was investigated as functions of chemical A concentration, abrasive particle and pressure. Chemical A was used as oxidant and etchant. The thickness of passivation layer on the treated Ru surface increased with the increase of chemical A concentration. The etch rate and removal rate of Ru were increased by the addition of chemical A. The removal rate was highest m slurry of pH 9 with the addition of 0.1 M chemical A and 2 wt% alumina at 4 psi. The maximum removal rate is about 80 nm/min.

• Transactions on Electrical and Electronic Materials
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• v.6 no.1
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• pp.29-32
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• 2005

Chemical mechanical polishing is an essential process in the production of copper-based chips. On this work, the stability of hydrogen peroxide ($H_{2}O_{2}$) as an oxidizer of copper CMP slurry has been investigated. $H_{2}O_{2}$ is known as the most common oxidizer in copper CMP slurry. But $H_{2}O_{2}$ is so unstable that its stabilization is needed using as an oxidizer. As adding KOH as a pH buffering agent, stability of $H_{2}O_{2}$ decreased. However, $H_{2}O_{2}$ stability in slurry went up with putting in small amount of BTA as a film forming agent. There was no difference of $H_{2}O_{2}$ stability between pH buffering agents KOH and TMAH at similar pH value. Addition of $H_{2}O_{2}$ in slurry in advance of bead milling led to better stability than adding after bead milling. Adding phosphoric acid resulted in the higher stability. Using alumina C as an abrasive was good at stabilizing for $H_{2}O_{2}$.