• 제목/요약/키워드: size and shape optimization

검색결과 189건 처리시간 0.027초

Moldflow를 이용한 인라인스케이트 프레임의 사출성형공정에 관한 연구 (A Study on the Injection Molding Process of Inline Skate Frame Using Moldflow)

  • 이형우;박철우
    • Journal of Advanced Marine Engineering and Technology
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    • 제34권2호
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    • pp.289-295
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    • 2010
  • 플락스틱 재료를 사용한 가공법 중에서 가장 보편적인 가공법이 사출성형이다. 플라스틱 재료의 활용도는 지속적으로 증가하고 있으며, 신소재 등의 개발로 그 적용범위 또한 확대되고 있다. 사출성형에서 수축현상은 수지의 종류, 즉 결정성 수지인지 비결정성 수지인지에 따라 크게 다르게 나타나며 사출성형시의 운전조건에 따라서도 다르다. 본 연구에서는 Al합금으로 제작되고 있는 인라인 스케이트의 프레임을 플라스틱 재료로 대체하기 위한 최적화 공정에 관한 것이다. 금형설계 전 해석을 통하여 성형공정이 최소화되는 런너와 게이트의 치수와 형상을 결정하겠다. 런너와 게이트의 치수 변화에 따른 제품의 사출성형성을 알아보겠다. 본 연구의 시뮬레이션에서는 사출성형해석용 소프트웨어인 Moldflow를 이용해서 해석을 수행하였다.

건설 엔지니어링 생산성 향상을 위한 Application Program Interface(API) 활용방안에 대한 연구 (A Study of the Using Application Program Interface (API) for Improving Productivity in Construction Engineering)

  • 박기백;정영호;함남혁;김재준
    • 한국BIM학회 논문집
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    • 제3권3호
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    • pp.29-38
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    • 2013
  • Domestic construction industry is larger in size, and its shape is more complex. As a result, collaboration and information management tasks are difficult to manage in a way that conventional 2D-based exchange of information. BIM technology was introduced as a solution for this. But BIM only provides a very limited set of features such as Constructability review, clash detection in reality. and duplication of work and a lot of iterations occurs in BIM process. Thus, it takes quite a lot time to work. We studied how to improve the work efficiency by connecting API to business processes. Using the API in the integration process by automating repetitive tasks, reduce a significant amount of work time Using API (Automation, Optimization, Interoperability, Analysis) can solve the task problem that does not solved by the basic features, If we make good use of the combined API will be improved productivity.

ECR-MOCVD에 의해 연성 고분자 기판에 제조된 구리막의 균일도에 전극의 형태가 미치는 영향 (Effects of electrode configurations on uniformity of copper films on flexible polymer substrate prepared by ECR-MOCVD)

  • 전법주;이중기
    • 한국군사과학기술학회지
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    • 제7권1호
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    • pp.34-46
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    • 2004
  • Copper films were prepared by using ECR-MOCVD(Electron Cyclotron Resonance Metal Organic Chemical Vapor Deposition) coupled with a DC bias system. The DC bias is connected to the electrode which placed 1∼3cm above the polymer substrate. The pulse electrical field around the electrode attracts the positive charged copper ions generated from the dissociation of copper precursor, $Cu(hfac)_2$, under ECR plasma. Condensation of supersaturated copper ions in the space between the electrode and substrate, makes it possible to deposit copper film on the polymer substrate even at room temperature. In this study, optimization of the electrode configuration was carried out in order to obtain the uniform films. The uniformity of the deposited films were closely related to the parameters of electrode geometry such as electrode shape, thickness, grid size and the spacing between electrodes. The most uniform copper film was observed with the electrode that enabled uniform electrical field distribution across the whole dimension of electrode.

레오로지 소재의 압축 실험 시 고상입자 거동 예측을 위한 결정립 동역학 해석 (Analysis of grain size controlled rheology material dynamics for prediction of solid particle behavior during compression experiment)

  • 김현일;김우영;강충길
    • 한국정밀공학회:학술대회논문집
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    • 한국정밀공학회 2005년도 추계학술대회 논문집
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    • pp.649-652
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    • 2005
  • It is reported that semi-solid forming process takes many advantages over the conventional forming process, such as long die lift, good mechanical properties and energy saves. Rheology material has a thixotropic, pseudo-plastic and shear-thinning characteristic. Therefore, general plastic or fluid dynamic analysis is not suitable for the behavior of rheology material. So it is difficult for a numerical simulation of the rheology process to be performed because complicated processes such as the filling to include the state of the free surface and solidification in the phase transformation must be considered. Moreover, it is important to predict the deformation behavior for optimization of net shape forging process with semi-solid materials and to control liquid segregation for mechanical properties of materials. In this study, so, molecular dynamics simulation was performed for the control of liquid segregation in compression experiment as a part of study on analysis of rheology forming process.

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Optimization of VIGA Process Parameters for Power Characteristics of Fe-Si-Al-P Soft Magnetic Alloy using Machine Learning

  • Sung-Min, Kim;Eun-Ji, Cha;Do-Hun, Kwon;Sung-Uk, Hong;Yeon-Joo, Lee;Seok-Jae, Lee;Kee-Ahn, Lee;Hwi-Jun, Kim
    • 한국분말재료학회지
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    • 제29권6호
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    • pp.459-467
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    • 2022
  • Soft magnetic powder materials are used throughout industries such as motors and power converters. When manufacturing Fe-based soft magnetic composites, the size and shape of the soft magnetic powder and the microstructure in the powder are closely related to the magnetic properties. In this study, Fe-Si-Al-P alloy powders were manufactured using various manufacturing process parameter sets, and the process parameters of the vacuum induction melt gas atomization process were set as melt temperature, atomization gas pressure, and gas flow rate. Process variable data that records are converted into 6 types of data for each powder recovery section. Process variable data that recorded minute changes were converted into 6 types of data and used as input variables. As output variables, a total of 6 types were designated by measuring the particle size, flowability, apparent density, and sphericity of the manufactured powders according to the process variable conditions. The sensitivity of the input and output variables was analyzed through the Pearson correlation coefficient, and a total of 6 powder characteristics were analyzed by artificial neural network model. The prediction results were compared with the results through linear regression analysis and response surface methodology, respectively.

DTA를 통한 LAS계 투명 결정화 유리의 결정화 조건 최적화 (Optimization of Crystallization Condition for Transparent LAS Glass-ceramic Via Differential Thermal Analysis)

  • 문윤곤;임태영;이미재;김진호;전대우;황종희
    • 한국전기전자재료학회논문지
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    • 제29권2호
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    • pp.101-105
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    • 2016
  • The basic characteristics of glass are highly fragile and brittle consequences the ultimate purpose of glass manufacturing is to make a transparent glass with complex shape. In order to solve this problem, mechanical properties of glass can be increased by crystallization of its amorphous glass. However, glass-ceramics has become opaque through crystallization process due to the distracted interface of glass by precipitated particles. This study has been investigated thermal processing conditions of LAS transparent glass-ceramic by using DTA (differential thermal analysis), in order to control size of precipitated particle and then fabricate transparent glass-ceramic. DTA indicated that crystallization peak area was declined with increased nucleation temperature. Subsequently, we have been established optimum temperature for crystallization depending on the nucleation temperature. The transmission and thermal expansion were measured after crystallization, and the size of precipitated particle was identified in range of 20~100 nm by FE-SEM. In addition, by setting the optimized crystallization condition, with high transmission and low thermal expansion glass was synthesized through this experiment.

개선된 유전자 알고리즘을 이용한 평면 철골트러스의 형상계획 및 단면 이산화 최적설계 (Shape Scheme and Size Discrete Optimum Design of Plane Steel Trusses Using Improved Genetic Algorithm)

  • 김수원;여백유;박춘욱;강문명
    • 한국공간구조학회논문집
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    • 제4권2호
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    • pp.89-97
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    • 2004
  • 최적설계기법을 사용한 경제적인 설계의 필요성은 오래 전부터 요구되어 왔으나, 종전의 설계가 설계자의 경험에 의한 시행착오적인 반복설계를 통하여 이루어져 왔기 때문에 구조물의 형상이 복잡한 경우에는 계산상의 어려움과 반복계산을 되풀이해야 하는 번거로움으로 진정한 최적설계는 기대하기 어려웠다. 최적설계법이 구조물의 설계에 매우 유용하다는 사실이 증명되고 있긴 하지만, 아직도 최적설계의 의미를 제대로 이해하지 못하고 있는 실정이며, 더구나 설계실무자는 어디까지나 사용자이기 때문에 수리적 계획수법에 친숙할 필요까지는 없지만 최소한 이런 기법의 가능성과 중요성을 이해할 필요는 있는데 대부분 그러하지 못하고 있는 실정이다. 일반적으로 트러스 구조물 설계 시 주어진 부재의 응력에 따라 단면적을 산출하여 그 단면적에 역학적으로 가장 합리적인 단면을 선정하여 경제적인 설계단면을 구한다. 그러나 트러스의 형상, 트러스 높이에 따른 경제성의 문제는 보통 설계자의 경험과 직관에 의하여 결정되고, 특별한 검토가 이루어지지 않고 설계가 수행되는데, 실제 트러스 구조물에서 트러스의 형상과 높이가 전체 건설공사비에 크게 영향을 미친다. 그러므로, 트러스 구조물의 최적설계에서 트러스 형상, 라이즈 비(rise ratio : 높이/스팬) 및 격간 수(number of panel)를 고려하는 것이 필요하다. 트러스 형상과 스팬에 따른 최적형상과 최적높이 및 격간 수에 대해 설계자의 초기 구조계획 시 주관적 선택의 어려움을 해결하고, 실제의 지붕형 트러스 구조에 설계하중을 작용시켜 응력해석에서부터 부재 단면설계까지의 자동화된 최적설계 알고리즘을 개발할 필요가 있다. 따라서 본 연구는 플랫 트러스의 형상, 격간 수, 격간의 간격 및 부재단면 등에 대하여 이산적인 변수의 처리와 넓은 설계 공간의 탐색능력과 더불어 문제의 비선형성과 관계없이 전체 최적해를 찾아낼 수 있는 유전자 알고리즘을 이용한다. 또한, 강 구조 한계상태설계기준(대한건축학회, 1998)을 기준으로 하여 자동으로 플랫 트러스의 구조계획과 단면이산화 최적설계를 동시에 수행할 수 있는 최적화 알고리즘을 제시하는 것을 목적으로 한다.

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반도체 봉지제용 EMC의 점도거동 특성 연구 -Mooney식을 이용한 점도예측- (The Characteristics of Viscosity Behavior of EMC for Semi-conductor Encapsulant -The Prediction of Viscosity by Mooney Equation-)

  • 김인범;배두한;이명천;이의수;윤효창;임종찬
    • 공업화학
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    • 제10권6호
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    • pp.949-953
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    • 1999
  • 반도체 봉지재에 쓰이는 EMC(Epoxy Molding Compound)는 고농도의 충전제를 함유하고 있는데, 이 충전제의 양과 성질에 따라 유동 특성이 크게 달라진다. 본 연구에서는 충전제의 농도, 입자모양, 크기에 따른 EMC(에폭시/실리카)의 점도변화 특성을 조사하였고, 이를 Mooney 식을 사용하여 예측하여 보았다. Mooney 식에 포함되어 있는 최대 충전율과 형상인자 중 최대 충전율은 Ouchiyama의 충전 모델과 Taguchi의 방법을 이용하여 구하였고, 형상인자는 실험자료를 이용하여 구하였다. 구해진 Mooney 식은 EMC의 점도 거동을 잘 예측하였다.

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사출성형공정에서 데이터의 불균형 해소를 위한 담금질모사 (Simulated Annealing for Overcoming Data Imbalance in Mold Injection Process)

  • 이동주
    • 산업경영시스템학회지
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    • 제45권4호
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    • pp.233-239
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    • 2022
  • The injection molding process is a process in which thermoplastic resin is heated and made into a fluid state, injected under pressure into the cavity of a mold, and then cooled in the mold to produce a product identical to the shape of the cavity of the mold. It is a process that enables mass production and complex shapes, and various factors such as resin temperature, mold temperature, injection speed, and pressure affect product quality. In the data collected at the manufacturing site, there is a lot of data related to good products, but there is little data related to defective products, resulting in serious data imbalance. In order to efficiently solve this data imbalance, undersampling, oversampling, and composite sampling are usally applied. In this study, oversampling techniques such as random oversampling (ROS), minority class oversampling (SMOTE), ADASYN(Adaptive Synthetic Sampling), etc., which amplify data of the minority class by the majority class, and complex sampling using both undersampling and oversampling, are applied. For composite sampling, SMOTE+ENN and SMOTE+Tomek were used. Artificial neural network techniques is used to predict product quality. Especially, MLP and RNN are applied as artificial neural network techniques, and optimization of various parameters for MLP and RNN is required. In this study, we proposed an SA technique that optimizes the choice of the sampling method, the ratio of minority classes for sampling method, the batch size and the number of hidden layer units for parameters of MLP and RNN. The existing sampling methods and the proposed SA method were compared using accuracy, precision, recall, and F1 Score to prove the superiority of the proposed method.

High Performance ESD/Surge Protection Capability of Bidirectional Flip Chip Transient Voltage Suppression Diodes

  • Pharkphoumy, Sakhone;Khurelbaatar, Zagarzusem;Janardhanam, Valliedu;Choi, Chel-Jong;Shim, Kyu-Hwan;Daoheung, Daoheung;Bouangeun, Bouangeun;Choi, Sang-Sik;Cho, Deok-Ho
    • Transactions on Electrical and Electronic Materials
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    • 제17권4호
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    • pp.196-200
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    • 2016
  • We have developed new electrostatic discharge (ESD) protection devices with, bidirectional flip chip transient voltage suppression. The devices differ in their epitaxial (epi) layers, which were grown by reduced pressure chemical vapor deposition (RPCVD). Their ESD properties were characterized using current-voltage (I-V), capacitance-voltage (C-V) measurement, and ESD analysis, including IEC61000-4-2, surge, and transmission line pulse (TLP) methods. Two BD-FCTVS diodes consisting of either a thick (12 μm) or thin (6 μm), n-Si epi layer showed the same reverse voltage of 8 V, very small reverse current level, and symmetric I-V and C-V curves. The damage found near the corner of the metal pads indicates that the size and shape of the radius governs their failure modes. The BD-FCTVS device made with a thin n- epi layer showed better performance than that made with a thick one in terms of enhancement of the features of ESD robustness, reliability, and protection capability. Therefore, this works confirms that the optimization of device parameters in conjunction with the doping concentration and thickness of epi layers be used to achieve high performance ESD properties.