Applied Chemistry for Engineering (공업화학)

The Korean Society of Industrial and Engineering Chemistry (한국공업화학회)
권호 표지

The Characteristics of Viscosity Behavior of EMC for Semi-conductor Encapsulant -The Prediction of Viscosity by Mooney Equation-

반도체 봉지제용 EMC의 점도거동 특성 연구 -Mooney식을 이용한 점도예측-

  • Kim, In Beom (Department of Chemical Engineering, Dongguk University) ;
  • Bae, Doo Han (Department of Chemical Engineering, Dongguk University) ;
  • Lee, Myung Cheon (Department of Chemical Engineering, Dongguk University) ;
  • Lee, Euy Soo (Department of Chemical Engineering, Dongguk University) ;
  • Yun, Hyo Chang (Central Research Institute, Korea Chemical Co.) ;
  • Lim, Jong Chan (Central Research Institute, Korea Chemical Co.)
  • Received : 1999.08.11
  • Accepted : 1999.09.11
  • Published : 1999.10.10
Download PDF
⟨ Previous Next ⟩

Abstract

Because epoxy molding compound(EMC) for semi-conductor encapsulants contains high concentrations of fillers, its flow behaviors are affected much by the concentrations and properties of those fillers. This paper reports the effects of a filler concentration, shape, size, and size distributions on the viscosity behavior of EMC(epoxy/silica). In addition, the prediction of viscosity behavior was performed using the Mooney equation. The maximum packing volume in the Mooney equation was calculated by Ouchiyama's packing model and Taguchi's optimization method, while the shpae factor was determined by fitting the experimental data. The results showed that the Mooney equation predicted the viscosity behavior of EMC very well.

반도체 봉지재에 쓰이는 EMC(Epoxy Molding Compound)는 고농도의 충전제를 함유하고 있는데, 이 충전제의 양과 성질에 따라 유동 특성이 크게 달라진다. 본 연구에서는 충전제의 농도, 입자모양, 크기에 따른 EMC(에폭시/실리카)의 점도변화 특성을 조사하였고, 이를 Mooney 식을 사용하여 예측하여 보았다. Mooney 식에 포함되어 있는 최대 충전율과 형상인자 중 최대 충전율은 Ouchiyama의 충전 모델과 Taguchi의 방법을 이용하여 구하였고, 형상인자는 실험자료를 이용하여 구하였다. 구해진 Mooney 식은 EMC의 점도 거동을 잘 예측하였다.

Keywords

References

  1. J. Reinf. Plast. Compos. v.12 L. S. Turng;V. W. Wang
  2. Plastic Encapsulated Microelectronics; materials, processes, quality reliability, and application M. G. Pecht;L. T. Nguyen;E. B. Hakim
  3. Microelectronics Packaging Handbook-semiconductor packaging(2nd ed.) R. R. Tummula;E. J. Rymaszewski;A. G. Klopfenstein
  4. Polym. Eng. and Sci. v.22 D. M. Bigg
  5. Proceedings 12th Intermational Congress on Rheology J. Kaschta;H. Munstedt
  6. J. Rheol. v.39 J. B. Jansma;S. Qutubuddin
  7. Rheology of Polymeric Systems-principles and applications P. Carreau;D. De Kee;R. Chhabra
  8. J. Rheol v.42 A. A. Zaman;B. M. Moudgil
  9. Analytical Polymer Rheology C. L. Rohn
  10. Applied Experimental Scheme Method S. H. Park
  11. Ing. Eng. Chem. Fundam v.23 N. Ouchiyama;T. Tanaka
  12. Taguchi Techniques for Quality Engineering P. J. Ross
  13. Multicomponent Polymer Systems I. S. Miles;S. Rostami