• Transactions of the Korean Society of Mechanical Engineers A
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• v.22 no.4
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• pp.905-915
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• 1998

Static tensile tests using adhesive-bonded single-lap joints of aluminum alloy were conducted to investigate the effect of geometric factor, overlap length, adherend thickness, adhesive thickness and material composition of adherend/adhesive on the strength of adhesive joint. The average applied shear stress at joint fracture decreased with increasing lap length. However increasing the adherend thickness resulted in a higher joint strength. Higher yield strength of adherend and lower elastic modulus of adhesive is advantageous to the adhesive joint. Newly proposed modified joint factor could be well evaluated the influence of lap length, adherend thickness and adhesive thickness on the bond strength for adhesive joints.

• Progress in Superconductivity and Cryogenics
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• v.9 no.4
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• pp.11-15
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• 2007

In practical applications of HTS tapes for electric devices such as coils and power cables, the jointing of HTS tapes is inevitable even though long length tapes have recently been achieved. The critical current, $I_c$, degradation behaviors with tensile and bending deformations were investigated in commercially available YBCO coated conductor tapes. When the V-I relationship was measured at the jointed section of the lap-jointed YBCO CC tapes, the resistance at the joint decreased with increasing joint length. The critical load for 95% $I_c$ retention were determined for the IBAD and RABiTS YBCO tapes and they were 175 and 355N, respectively. Fracture occurred at the unjointed part which represents strong copper lamination and solder jointing. The electro-mechanical properties of lap-jointed CC tapes depended on the properties of single tapes. The V-I behavior under bending strain was similar with the tensile case.

• Tribology and Lubricants
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• v.35 no.6
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• pp.323-329
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• 2019

Sapphire is currently used as a substrate material for blue light-emitting diodes (LEDs). The market for sapphire substrates has expanded rapidly as the use of LEDs has extended into various industries. However, sapphire is classified as one of the most difficult materials to machine due to its hardness and brittleness. Recently, a lap-grinding process has been developed to combine the lapping and diamond mechanical polishing (DMP) steps in a single process. This paper studies, the effect of wafer surface roughness on the chemical mechanical polishing (CMP) process by pressure and abrasive concentration in the lap-grinding process of a sapphire wafer. In this experiment, the surface roughness of a sapphire wafer is measured after lap-grinding by varying the pressure and abrasive concentration of the slurry. CMP is carried out under pressure conditions of 4.27 psi, a plate rotation speed of 103 rpm, head rotation speed of 97 rpm, and slurry flow rate of 170 ml/min. The abrasive concentration of the CMP slurry was 20wt, implying that the higher the surface roughness after lapgrinding, the higher the material removal rate (MRR) in the CMP. This is likely due to the real contact area and actual contact pressure between the rough wafer and polishing pad during the CMP. In addition, wafers with low surface roughness after lap-grinding show lower surface roughness values in CMP processes than wafers with high surface roughness values; therefore, further research is needed to obtain sufficient surface roughness before performing CMP processes.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2008.06a
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• pp.285-286
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• 2008

In practical applications of HTS tapes for electric devices such as coils and power cables, the jointing of HTS tapes is needed. In magnet applications superconducting joints are needed to achieve very low resistance at the joint, but for power device applications, a slightly higher joint resistance may be acceptable. In this study, an economical joint with good mechanical and electrical integrity could be achieved for Bi-2223 tapes which can be applicable to electric power applications. A lap joint method has been used. The joint resistance and strength of the jointed Bi2223 tapes have been evaluated. Electro-mechanical properties of the joint sample under tension have been examined and compared with the case of the single tapes.

• Journal of Welding and Joining
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• v.22 no.5
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• pp.32-37
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• 2004

Application of bonding by adhesives can be found in many industries, particularly in advanced technological domains such as aeronautical and space, automobile and electronics industries. Periodic inspection with conventional ultrasonic NDE techniques is capable of indicating the presence and possible location of crack. Continuous ultrasonic attenuation monitoring has potential to supply information. This article discusses the use of pulse-echo ultrasonic testing for the inspection of adhesive bonds between metal sheets. The method is based on the measurement of the reflection coefficient at the metal/adhesive interface. By means of a control experiment it is shown that Quantitative Nondestructive Evaluation in Adhesive Joints are evaluated together with Ultrasonic Testing and Fracture Testing.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2004.10a
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• pp.626-629
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• 2004

Recently, the self-healing technique is being investigated to repair the damaged polymeric composites by the use of microcapsules with the healing agent. This technique can obtains both the damage detection and the damage repair simultaneously over the converntional repairing techniques. In this study, the effects of the catalyst ratio to the healing agent and thermal characteristics to the mixtures of healing agent are investigated through single lap shear tests and DSC. The Healing agents such as DCPD, ENB, and their mixtures are considered and Grubb's catalyst is used as a catalst.

• Structural Engineering and Mechanics
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• v.53 no.5
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• pp.1017-1030
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• 2015

In this study, the finite element method was used to analyze the distribution of the adhesive shear stresses in the single-lap bonded joint of two plates 2024-T3 aluminum with and without defects. The effects of the adhesive properties (shear modulus, the thickness and the length of the adhesive were highlighted. The results prove that the shear stresses are located on the free edges of the adhesively bonding region, and reach maximum values near the defect, because the concentration of high stress occurs near this area.

• Steel and Composite Structures
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• v.34 no.6
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• pp.877-889
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• 2020

This work features the outcomes of an empirical investigation into the characteristics of steel reinforced grout (SRG) composite - concrete interfaces. The parameters varied were loading rate, densities of steel fibres and types of load displacement responses or measurements (slip and machine grips). The following observations and results were derived from standard single-lap shear tests. Interfacial debonding of SRG - concrete joints is a function of both fracture of matrix along the bond interface and slippage of fibre. A change in the loading rate results in a variation in peak load (P_max) and the correlative stress (σ_max), slip and machine grips readings at measured peak load. Further analysis of load responses revealed that the behaviour of load responses is shaped by loading rate, fibre density as well as load response measurement variable. Notably, the out-of-plane displacement at peak load increased with increments in load rates and were independent of specimen fibre densities.

• Transactions of the Korean Society of Automotive Engineers
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• v.8 no.1
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• pp.183-190
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• 2000

The objective of this work is to develop a criterion for predicting the failure strength of the joints bonded by ductile adhesives. To obtain a criterion, first, fracture tests were carried out for T-peel joint and Single-lap joint with widely differing joints geometries. Then using the fracture loads obtained at tests, the finite element analysis were performed, in which the stresses in the adhesive bonds were calculated in great detail. After examining four epoxy adhesives, it is concluded that the fracture of adhesively bonded joint occurs when the maximum of the ratio of the mean to effective stresses exceeds a constant value which can be determined from analysis and test for each adhesive.

• Structural Engineering and Mechanics
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• v.10 no.2
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• pp.125-138
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• 2000

The paper analyzes the problem of torsion in an adhesive non-tubular bonded single-lap joint. The joint considered consists of two thin rectangular section beams bonded together along a side surface. Assuming the materials involved to be governed by linear elastic laws, equilibrium and compatibility equations were used to arrive at an integro-differential relation whose solution makes it possible to determine torsional moment section by section in the bonded joint between the two beams. This is then used to determine the predominant stress and strain field at the beam-adhesive interface (stress field along the direction perpendicular to the interface plane, equivalent to the applied torsional moment and the corresponding strain field) and the joint's elastic strain (absolute and relative rotations of the bonded beam cross sections). All the relations presented were obtained in closed form. Results obtained theoretically are compared with those given by a three dimensional finite element numerical model. Theoretical and numerical analysis agree satisfactorily.