• 한국신재생에너지학회:학술대회논문집
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• 2007.11a
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• pp.232-232
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• 2007

• Resources Recycling
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• v.21 no.4
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• pp.60-68
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• 2012

Silicon wafer for making semiconductor devices and solar cell is used in the semiconductor and solar industry, respectively. Silicon wafer is produced by cutting with silicon ingot and sludge contains silicon occurs from cutting process. Generation of silicon sludge is increasing on developing all industry sectors which have need of semiconductor device. These days it has been widely studied for the recycling technologies of the silicon sludge from view points of economy and efficiency. In this paper, patents and paper on the recycling technologies of the silicon sludge were analyzed. The range of search was limited in the open patents of USA (US), European Union (EU), Japan (JP), Korea (KR) and SCI journals from 1982 to 2011. Patents and journals were collected using key-words searching and filtered by filtering criteria. The trends of the patents and journals was analyzed by the years, countries, companies, and technologies.

• Journal of the Korean Ceramic Society
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• v.44 no.2 s.297
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• pp.98-102
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• 2007

The stability of slurry and removal rate during recycling of colloidal silica slurry was evaluated in silicon wafer polishing. The particle size distribution, pH, and zeta potential were measured to investigate the stability of colloidal silica. Large particles appeared as recycling time increased while average size of slurry did not change. Large particles were identified by EDS(energy dispersive spectrometer) as foreign substances from pad or abraded silicon flakes during polishing. As the recycling time increased, pH of slurry decreased and removal rate of silicon reduced but zeta potential decreased inversely. Hence, it could be mentioned that decrease of removal rate is related to consumption of $OH^-$ ions during recycling. Attention should be given to the control of pH of slurry during polishing.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2006.11a
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• pp.59-60
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• 2006

The slurry stability and removal rate during recycling of slurry in silicon wafer polishing was studied. Average abrasive size of slurry was not changed with recycling time, however, large particles appeared as recycling time increased. Large particles were related foreign substances from pad or abraded silicon flakes during polishing. The removal rate as well as pH of slurry was decreased as recycling time increased. It suggests that the consumption of OH ions during recycling is the main cause of decrease of removal rate. Therefore, it is important to control pH of slurry to obtain optimum removal rate during polishing.

• Resources Recycling
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• v.17 no.4
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• pp.66-76
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• 2008

Silicon wafer is used in making semiconductor device of various forms in the semiconductor industry. Silicon wafer is produced by cutting silicon ingot and sludge containing silicon results from cutting process. The amount of silicon sludge is increasing owing to the usage of semiconductor device in many industry sectors. These days the recycling technologies of the waste silicon sludge has been widely studied from view point of economy and efficiency. In this study, patents on the recycling technologies of the waste silicon sludge were analyzed. The range of search was limited in the open patents of USA, European Union, Japan, and Korea up to september, 2007. Patents were collected using key-words and filtered by filtering criteria. The trend of the patents was analyzed by the years, countries, companies, and technologies.

• Resources Recycling
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• v.31 no.1
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• pp.3-11
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• 2022

Silicon is the most abundant metal element in the Earth's crust. Metallurgical-grade silicon (MG-Si) is an important metal that has wide industrial applications, such as a deoxidizer in the steelmaking industry, alloying elements in the aluminum industry, the preparation of organosilanes, and the production of electronic-grade silicon, which is used in the electronics industry as well as solar cells. MG-Si is produced industrially by the reduction smelting of silicon dioxide with carbon in the form of coal, coke, or wood chips in electric arc furnaces. MG-Si is purified by chemical treatments, such as the Siemens process. Most single-crystal silicon is produced using the Czochralski method. These smelting and refining methods will be helpful for the development of new recycling processes using secondary silicon resources.

• Journal of Korea Society of Industrial Information Systems
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• v.17 no.1
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• pp.1-9
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• 2012

This paper explained about the sludge recycling system which retrieved the silicon and abrasive from solar cell wafer slicing. The basic process of the recycling system was multiple centrifuge and secondary processes of ultra sonic agitation, addition of alcohol-water solution and heating sludge was added for raising separation efficiency. The recycling rate was about 96% and 94% for 2N, 4N silicon respectively. The SiC abrasive recycling rate was about 80%. To retrieve the high purity of 4N silicon, the heat process in vacuum furnace was added to remove remaining impurity components.

• Proceedings of the IEEK Conference
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• 2001.10a
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• pp.719-724
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• 2001

The objective of this investigation was to separate silicon and silica for recycling by the liquid-liquid separation technique. In the preparation of silicon (Si) single crystal, a small amount of silicon is fixed on the surface of silica (quartz, $SiO_2$) crucible. The used crucible is crushed for recycling both silicon and silica in a high purity from the mixed powder. Zeta-potential of silicon and silica are almost the same at pH higher than 3. Their separation by simple flotation is ruled out. However, their hydrophobic characteristics are different in several different organic solvent from the measurement of contact angle. Therefore, the liquid-liquid extraction is employed to separate silicon and silica. The result indicates that the organic solvent mixed with dodecyl ammonium acetate could extracted the silicon powder at high purity (97-100%) with high recovery from the silica powder in the water phase.

• Resources Recycling
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• v.31 no.5
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• pp.52-58
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• 2022

Silicon carbide powder was prepared from carbon black and silicon recovered from waste solar panels. In the solar power generation market, the number of crystalline silicon modules exceeds 90%. As the expiration date of a photovoltaic module arrives, the development of technology for recovering and utilizing silicon is very important from an environmental and economic point of view. In this study, silicon was recovered as silicon carbide from waste solar panels: 99.99% silicon powder was recovered through purification from a 95.74% purity waste silicon wafer. To examine the synthesis characteristics of SiC powder, purified 99.99% silicon powder and carbon powder were mixed and heat-treated (1,300, 1,400 and 1,500 ℃) in an Ar atmosphere. The characteristics of silicon and silicon carbide powders were analyzed using particle size distribution analyzer, XRD, SEM, ICP, FT-IR, and Raman analysis.

• Resources Recycling
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• v.26 no.4
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• pp.19-25
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• 2017

The ways of producing metal silicon include a carbon reduction method, a plasma reduction method, and a thermite reaction method. The carbon reduction process produces metal silicon by metallurgical refining. The carbon reduction method is produced by adding a raw material mixed with quartz and coke to an electric arc furnace which is for carbon reduction. The cost of high energy costs and environmental protection facilities is an issue when producing metal silicon using electric arc furnaces. For this reason, there is no metal silicon production facility in Korea yet. Therefore, the optimal manufacturing conditions by the carbon reduction method are being studied through the experimental facilities by the companies and research institutes. The present study investigated the change of metal silicon purity according to the purity of silicon when extracting metal silicon using the thermit reaction, which has a relatively lower manufacturing cost than the carbon reduction method.