• Journal of the Korean Ceramic Society
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• v.47 no.2
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• pp.157-162
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• 2010

Effect of starting SiC particle size on nitridation rate and flexural strength of $Si_3N_4$-bonded-SiC (SNBSC) ceramics was investigated by using SiC particles of different size (${\sim}200\;{\mu}m$, ${\sim}100\;{\mu}m$ and ${\sim}45\;{\mu}m$). The specimen prepared from smaller SiC particles resulted in higher nitridation rate after nitridation at $1450^{\circ}C$, owing to the lower packing density in green body. The flexural strength showed maxima after 1-h nitridation for all specimens and then decreased with prolonged nitridation because of local densification-induced pore coarsening. The specimen prepared from smaller SiC particles showed better flexural strength because of smaller pore size and partly higher nitridation rate in the specimen. A maximal flexural strength of 29 MPa was obtained in the specimen with a density of $2.04\;g{\cdot}cm^3$, which was prepared from $45\;{\mu}m$-SiC particles.

• Proceedings of the Korean Institute of Building Construction Conference
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• 2015.11a
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• pp.41-42
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• 2015

The concrete aggregate generates carbon dioxide in production but its demanding is gradually increased in accordance with the depletion of natural resources. Therefore we evaluated compatibility and basic physical properties of Silicon manganese slag generated in iron production as an applicable concrete aggregate. In our test, the silicon maganese slag shows 2.8g/㎥ of density in 10mm of maximum particle size similar to a natural aggregate, and its absorption rate was 0.3% similar to the electric furnace slag. Unit volume weight and ratio of absolute volume was respectively 2,001㎏/㎥ and 51%. Strength properties of Silicon manganese slag will be evaluated with further studies and experiments.

• Proceedings of the Korean Powder Metallurgy Institute Conference
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• 2006.09a
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• pp.426-427
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• 2006

Mono-sized silicon particles were effectively fabricated by a novel way named pulsated orifice ejection method (POEM). The particles are with very narrow particles size distribution and very small standard deviation of mean particle size. There are two different types spherical silicon particles were found. One consists of many grains mainly in random boundaries. The other consists of two or three grains with only twin orientation relationships, even single crystal in cross-section was also found within this type of spherical silicon particles.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2003.06a
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• pp.1832-1835
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• 2003

This paper suggests the selective ultra precision polishing techniques for micro die and mold parts using magnetic-assisted machining. Fabrication of magnetic abrasive particle and their polishing performance are key technology at ultra precision polishing process of micro parts. Conventional magnetic abrasives have disadvantages. which are missing of abrasive particle and inequality between magnetic particle and abrasive particle. So, bonded magnetic abrasive particles are fabricated by several method. For example, plasma melting and direct bonding. Ferrite and carbonyl iron powder are used as magnetic particle where silicon carbide and Al$_2$O$_3$ are abrasive particle. Developed particles are analyzed using measurement device such as SEM. Possibility of magnetic abrasive and polishing performance of this magnetic abrasive particles also have been investigated. After polishing, surface roughness of workpiece is reduced from 2.927 $\mu\textrm{m}$ Rmax to 0.453 $\mu\textrm{m}$ Rmax.

• Resources Recycling
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• v.31 no.5
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• pp.52-58
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• 2022

Silicon carbide powder was prepared from carbon black and silicon recovered from waste solar panels. In the solar power generation market, the number of crystalline silicon modules exceeds 90%. As the expiration date of a photovoltaic module arrives, the development of technology for recovering and utilizing silicon is very important from an environmental and economic point of view. In this study, silicon was recovered as silicon carbide from waste solar panels: 99.99% silicon powder was recovered through purification from a 95.74% purity waste silicon wafer. To examine the synthesis characteristics of SiC powder, purified 99.99% silicon powder and carbon powder were mixed and heat-treated (1,300, 1,400 and 1,500 ℃) in an Ar atmosphere. The characteristics of silicon and silicon carbide powders were analyzed using particle size distribution analyzer, XRD, SEM, ICP, FT-IR, and Raman analysis.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.20 no.10
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• pp.19-26
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• 2021

In fine-particle injection processing, hard fine particles, such as silicon carbide or aluminum oxide, are injected - using high-pressure air, and a small amount of material is removed by applying an impact to the workpiece by spraying at high speeds. In this study, a two-axis stage device capable of sequence control was developed to spray various shapes, such as circles and squares, on the surface during the micro-particle jetting process to understand the surface-shape micro-particle-processing characteristics. In the experimental device, two stepper motors were used for the linear movement of the two degree-of-freedom mechanism. The signal output from the microcontroller is - converted into a signal with a current sufficient to drive the stepper motor. The stepper motor rotates precisely in synchronization with the pulse-signal input from the outside, eliminating the need for a separate rotation-angle sensor. The major factors of the processing conditions are fine particles (silicon carbide, aluminum oxide), injection pressure, nozzle diameter, feed rate, and number of injection cycles. They were identified using the ANOVA technique on the design of the experimental method. Based on this, the surface roughness of the spraying surface, surface depth of the spraying surface, and radius of the corner of the spraying surface were measured, and depending on the characteristics, the required spraying conditions were studied.

• Transactions of the Korean Society of Machine Tool Engineers
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• v.12 no.5
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• pp.59-66
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• 2003

This study suggests the new ultraprecision finishing techniques for micro die and mold parts using magnetic field-assisted polishing. Conventional magnetic abrasives have several disadvantages, which are missing of abrasive particle and inequal mixture between magnetic particle and abrasive particle. Therefore, bonded magnetic abrasive particles are fabricated by several method. For example, plasma melting and direct bonding. Carbonyl iron powder is used as magnetic particle there silicon carbide and alumina are abrasive particles. Developed magnetic abrasives are analyzed using SEM. Feasibility of magnetic abrasive and polishing performance of this magnetic abrasive particles also have been investigated. After polishing, surface roughness of workpiece is reduced from 85.4 ㎚ Ra to 9 ㎚ RA.

• Analytical Science and Technology
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• v.22 no.3
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• pp.247-253
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• 2009

Porous silicon films are electrochemically etched from crystalline silicon wafers in an aqueous solution of hydrofluoric acid(HF). Careful control of etching conditions (current density, etch time, HF concentration) provides films with precise, reproducible physical parameters (morphology, porosity and thickness). The etched pattern could be varied due to (1) current density controls pore size (2) etching time determines depth and (3) complex layered structures can be made using different current profiles (square wave, triangle, sinusoidal etc.). The optical interference spectrum from Fabry-Perot layer has been used for forensic applications, where changes in the optical reflectivity spectrum confirm the identity. We will explore a method of identifying the specific pattern code and can be used for identities of individual code with porous silicon based encoded nanosized smart particles.

• Journal of the Korean Vacuum Society
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• v.10 no.3
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• pp.361-367
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• 2001

Recently, Chemical Mechanical Polishing(CMP) has become a leading planarization technique as a method for silicon wafer planarization that can meet the more stringent lithographic requirement of planarity for the future submicron device manufacturing. The SOI(Silicon On Insulator) wafer has received considerable attention as bulk-alternative wafer to improve the performance of semiconductor devices. In this paper, the objective of study is to investigate Material Removal Rate(MRR) and surface micro-roughness effects of slurry and pad in the CMP process. When particle size of slurry is increased, Material Removal rate increase. Surface micro-roughness is greater influenced by pad than by particle size of slurry. As a result of AM measurement, surface micro-roughness was improved from 27 $\AA$ Rms to 0.64 $\AA$Rms.

• Carbon letters
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• v.15 no.3
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• pp.180-186
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• 2014

This study highlights a novel method and mechanism for the rapid and effective milling of carbon fibers (CFs) in silicon carbide (SiC) powder, and also the dispersion of CFs in SiC powder. The composite powders were prepared by chopping and exfoliation of CFs, and ball milling of CFs and SiC powder in isopropyl alcohol. A wide range of CFs loading, from 10 to 50 vol%, was studied. The milling of CFs and SiC powder was checked by measuring the average particle size of the composite powders. The dispersivity of CFs in SiC powder was checked through scanning electron microscope. The results show that the usage of exfoliated CF tows resulted in a rapid and effective milling of CFs and SiC powder. The results further show an excellent dispersion of CFs in SiC powder for all CFs loading without any dispersing agent.