• Title/Summary/Keyword: shear strength of surface films

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The Effect of Fluid Shear Stress on Endothelial Cell Adhesiveness to Modified Polyurethane Surfaces

  • Gilson Khang;Lee, Sang-Jin;Lee, Young-Moo;Lee, Jin-Ho;Lee, Hai-Bang q
    • Macromolecular Research
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    • v.8 no.4
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    • pp.179-185
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    • 2000
  • Generally vascular grafts with a relatively large inner diameter (> 5 mm) have been successfully employed for replacement in the human body. However, the use of small diameter grafts is limited, because these grafts rapidly occlude due to the thrombosis. The ideal blood-contacting surface of a prosthesis would be an endothelial cell (EC) lining, because the confluent monolayer of healthy ECs that culture natural blood vessels represents the ideal nonthrombogenic surface. For vascular graft application, the stable EC adhesion on surface under How conditions is very important. In this study, the adhesive strength of ECs attached on polymer surfaces coated with collagen type IV (Col IV), fibronectin (Fn), laminin (Ln), and treated with corona was investigated onto polyurethane (PU) films. The EC-attached PU surfaces were mounted on parallel-plate flow chambers in a How system prepared for cell adhesiveness test. Three different shear stresses (100, 150, and 200 dyne/㎠) were applied to the How chambers and each shear stress was maintained for 120 min to investigate the effect of shear stress and surface treatment condition on the EC adhesion strength. It was observed that the EC adhesion strength on the surface-modified PU films was in the order of Ln≡Fn > Col IV > corona 》 control. More than 70% of the adhered cells were remained on surface-modified PU surface after applying the shear stress,200 dyne/㎠ for 2 hrs, whereas the cells were completely detached on the control PU surface within 10 min after applying the same shear stress. It seems that the type of adsorbed proteins and hydrophilicitv onto the PU surfaces play very important roles for cell adhesion strength.

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Effects of Nonprecious Metallic Oxide on the Chemical Bonding Between Dental Alloy and Porcelain (비귀금속 산화물이 치과용 합금과 도재의 화학적 결합에 미치는 영향)

  • Kim, Kwang-Nam;Cho, Sung-Am
    • The Journal of Korean Academy of Prosthodontics
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    • v.25 no.1
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    • pp.317-325
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    • 1987
  • A study on the shear bonding strength between dental alloy and porcelain according to various kidns of sputtered metallic thin films was established by Ingtron universal testing machine, and the change of the elemental weight % at the surface of dental alloy was studied by E.D.S. The kind of metallic thin films were Al, Ni, In, Cr. Ti and Sn with $0.3{\mu}m$ thickness. The dental alloys were Verabond made by Aalba Dent. Co. and Degudent H manufactured by Degussa Co. The control groups were Verabond and Degudent H. The obtained results were as follows; 1. The shear bonding strength of Al plated sample was the strongest of all. 2. The shear bonding strength of Ni plated sample was stronger than that of Degudent H, Sn plated samples. 3. The shear bonding strength of Verabond was weaker than that of Al, Ni, In, Cr, plated samples. 4. After degassing, it is more weight % of Ni at the alloy surface of the Ni sputtered specimen than the Sn sputtered sample.

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Study on the Effect of Sputtering Process on the Adhesion Strength of CrN Films Synthesized by a Duplex Surface Treatment Process (복합표면처리된 CrN박막의 밀착력에 미치는 스퍼터링 효과에 관한 연구)

  • Kim M.K.;Kim E.Y.;Kim J.T.;Lee S.Y.
    • Journal of the Korean institute of surface engineering
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    • v.39 no.1
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    • pp.1-8
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    • 2006
  • In this study, effect of sputtering after plasma nitriding and before PVD coating on the microstucture, microhardness, surface roughness and the adhesion strength of CrN thin films were investigated. Experimental results showed that this sputtering process not only removed surface compound layer which formed during a plasma nitriding process but also induced an alteration of the surface of plasma nitrided substrate in terms of microhardness distribution and surface roughness, which in turn affected the adhesion strength of PVD coatings. After sputtering, microhardness distribution showed general decrease and the surface roughness became increased slightly. The critical shear stress measured from the scratch test on the CrN coatings showed an approximately twice increase in the binding strength through the sputtering prior to the coating and this could be attributed to a complete removal of compound layer from the plasma nitrided surface and to an increase in the surface roughness after sputtering.

Study on the Effect of Sputtering Process on the Adhesion Strength of CrZrN Films Synthesized by a Duplex Surface Treatment Process (복합표면처리된 CrZrN 박막의 밀착력에 미치는 스퍼터링 효과에 관한 연구)

  • Kim, M.K.;Kim, E.Y.;Lee, S.Y.
    • Journal of the Korean institute of surface engineering
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    • v.39 no.6
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    • pp.268-275
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    • 2006
  • In this study, effect of sputtering on the plasma-nitriding substrate and before PVD coating on the microstucture, microhardness, surface roughness and the adhesion strength of CrZrN thin films were investigated. Experimental results showed that this sputtering process not only removed surface compound layer which formed during a plasma nitriding process but also induced an alteration of the surface of plasma nitrided substrate in terms of microhardness distribution, surface roughness. This in turn affected the adhesion strength of PVD coatings. After sputtering, microhardness distribution showed general decrease and the surface roughness became increased slightly. The critical shear stress measured from the scratch test on the CrZrN coatings showed an approximately 1.4 times increase in the adhesion strength through the sputtering prior to the coating and this could be attributed to a complete removal of compound layer from the plasma nitrided surface and to an increase in the surface roughness after sputtering.

A Study on Formation and Evaluation of he Thin Films for Improvement of Tribology Properties (Tribology특성 향상을 위한 Ag 박막의 형성과 평가에 관한 연구)

  • 이경황;이상기;송복한;정병진;박창남;문경만;이명훈
    • Journal of the Korean institute of surface engineering
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    • v.33 no.5
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    • pp.319-328
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    • 2000
  • Silver is known to have such characteristics as low shear strength, good transfer-film forming tendency, and good corrosion resistance. Silver thin films have been prepared by ion plating of physical vapour deposition (PVD) using both argon gas pressure and bias voltage of processing condition. After the silver films were prepared, the properties in them were examined by gas pressure and bias voltage of substrate. Their morphology and crystal orientation were investigated by scanning electron microscopy (SEM) and X-ray diffractor. The properties of film were, also, studied to relate with morphology, X-ray diffraction pattern, and friction coefficient at vacuum ambient. The friction coefficient was stabilized remarkably on deposited films with increasing argon pressure for deposition. Also, the effect of increasing of the bias voltage for deposition resulted in lower friction coefficient and stability in $1.7$\times$10^{-4}$ torr. On the contrary, behavior of friction coefficient was stabilized on deposited films with decreasing the bias voltage in $1.7$\times$10^{-5}$ torr for deposition.

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MOLECULAR BASIS OF LUBRICATION

  • Hsu, S.M.
    • Proceedings of the Korean Society of Tribologists and Lubrication Engineers Conference
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    • 2002.10b
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    • pp.49-50
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    • 2002
  • Rapid advancements in analytical instrumentations and techniques in the last several decades offer an unprecedented opportunity to analyze the complex chemistry and probe the surfaces for chemical evidence. Recent developments in nanotechnology provide further ability to examine phenomena and mechanisms at the nanometer level. As a result of these advances, our understanding of the complex lubrication system has improved significantly. This paper will attempt to provide a molecular basis of how lubricant and additives function in lubrication.

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The Substitution of Inkjet-printed Gold Nanoparticles for Electroplated Gold Films in Electronic Package

  • Jang, Seon-Hui;Gang, Seong-Gu;Kim, Dong-Hun
    • Proceedings of the Materials Research Society of Korea Conference
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    • 2011.10a
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    • pp.25.1-25.1
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    • 2011
  • Over the past few decades, metallic nanoparticles (NPs) have been of great interest due to their unique mesoscopic properties which distinguish them from those of bulk metals; such as lowered melting points, greater versatility that allows for more ease of processability, and tunable optical and mechanical properties. Due to these unique properties, potential opportunities are seen for applications that incorporate nanomaterials into optical and electronic devices. Specifically, the development of metallic NPs has gained significant interest within the electronics field and technological community as a whole. In this study, gold (Au) pads for surface finish in electronic package were developed by inkjet printing of Au NPs. The microstructures of inkjet-printed Au film were investigated by various thermal treatment conditions. The film showed the grain growth as well as bonding between NPs. The film became denser with pore elimination when NPs were sintered under gas flows of $N_2$-bubbled through formic acid ($FA/N_2$) and $N_2$, which resulted in improvement of electrical conductance. The resistivity of film was 4.79 ${\mu}{\Omega}$-cm, about twice of bulk value. From organic anlayses of FTIR, Raman spectroscopy, and TGA, the amount of organic residue in the film was 0.43% which meant considerable removal of the solvent or organic capping molecules. The solder ball shear test was adopted for solderability and shear strength value was 820 gf (1 gf=9.81 mN) on average. This shear strength is good enough to substitute the inkjet-printed Au nanoparticulate film for electroplating in electronic package.

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Adhesion Performance of Plywoods Prepared with Different Layering Methods of Thermoplastic Resin Films (열가소성수지 필름의 적층방법에 따른 합판의 접착성능)

  • Kang, Eunchang;Lee, Sang-Min;Park, Jong-Young
    • Journal of the Korean Wood Science and Technology
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    • v.45 no.5
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    • pp.559-571
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    • 2017
  • This study was conducted to determine the adhesive performances of plywoods affected by layering direction and the amounts of thermoplastic films. The face and back layers of veneer were hardwood species (Mixed light hardwood) and core layer veneer was radiata pine (Pinus radiata D. Don). Thermoplastic film used as adhesive were polypropylene (PP) film and polyethylene (PE) film. Thermal analysis and tensile strength were investigated on each films. As a result, the melting temperature of PP and PE films were $163.4^{\circ}C$ and $109.7^{\circ}C$, respectively, and the crystallization temperature were $98.9^{\circ}C$ and $93.6^{\circ}C$, respectively. Tensile strength and elongation of each films appeared higher on the width direction than length direction. Considering the characteristics of the thermoplastic films, the test for the amount of film used was carried out by layering film to the target thickness on veneer. The effecting of layering direction of film on plywood manufacturing was conducted by laminating in the length and width directions of the film according to the grain direction of veneer. Tensile-shear strength of plywood in wet condition was satisfied with the quality standard (0.7 MPa) of KS F 3101 when the film was used over 0.05 mm of PP film and over 0.10 mm of PE film. Tensile-shear strength of plywood after cyclic boiling exceeded the KS standard when PP film was used 0.20 mm thickness. Furthermore, higher bonding strength was observed on a plywood made with width direction of film according to grain direction of veneer than that of length direction of film. Based on microscopic analysis of the surface and bonding line of plywood, interlocking between veneers by penetration of a thermoplastic film into inner and cracks were observed.

Evaluation of Adhesive Strength for Nano-Structured Thin Film by Scanning Acoustic Microscope (초음파 현미경을 이용한 나노 박막의 접합 강도 평가)

  • Park, Tae-Sung;Kwak, Dong-Ryul;Park, Ik-Keun;Miyasaka, Chiaki
    • Journal of the Korean Society for Nondestructive Testing
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    • v.32 no.4
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    • pp.393-400
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    • 2012
  • In recent years, nano-structured thin film systems are often applied in industries such as MEMS/NEMS device, optical coating, semiconductor or like this. Thin films are used for many and varied purpose to provide resistance to abrasion, erosion, corrosion, or high temperature oxidation and also to provide special magnetic or dielectric properties. Quite a number of articles to evaluate the characterization of thin film structure such as film density, film grain size, film elastic properties, and film/substrate interface condition were reported. Among them, the evaluation of film adhesive to substrate has been of great interest. In this study, we fabricated the polymeric thin film system with different adhesive conditions to evaluate the adhesive condition of the thin film. The nano-structured thin film system was fabricated by spin coating method. And then V(z) curve technique was applied to evaluate adhesive condition of the interface by measuring the surface acoustic wave(SAW) velocity by scanning acoustic microscope(SAM). Furthermore, a nano-scratch technique was applied to the systems to obtain correlations between the velocity of the SAW propagating within the system including the interface and the shear adhesive force. The results show a good correlation between the SAW velocities measured by acoustic spectroscope and the critical load measured by the nano-scratch test. Consequently, V(z) curve method showed potentials for characterizing the adhesive conditions at the interface by acoustic microscope.