• Journal of Welding and Joining
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• v.17 no.6
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• pp.78-83
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• 1999

Solder joint is the weakest part which connects in mechanically and electronically between package body and PCB(Printed Circuit Board). Recently, the reliability of solder joint become the most critical issue in surface mounted technology. The solder joint interconnection between plastic package and PCB is susceptible to shear stress during thermal storage due to the mismatch in coefficient of thermal expansion between plastic package and PCB. A general computational approach to determine the effect of solder joint shape on the fatigue life presented. The thermal fatigue life was estimated from the engelmaier equation which was obtained from the temperature cycling loading($-65^{\circ}C$ to $150^{\circ}C$). As result of the simulation, TSOP structure has the shortest thermal fatigue life and the same structure Copper lead has 2.5 times as much fatigue life as Alloy 42 lead. In BGA structure, fatigue life time extended 80 times when underfill material exists.

• Journal of the Korean Ceramic Society
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• v.36 no.4
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• pp.366-371
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• 1999

The effect of VC addition on the microstructural evolution of Fe-TiC cermet has been investigated. The microstructures of the Fe-TiC varied with the amount of VC addition. The addition of 1wt% VC enhanced the instability of liquid-solid interface ; the dissolving interface showed round shape instead of facetted one which was ascribed to the increase of lattice mismatch between TiC and solid-solution carbide. in the speci-men with 10wt% VC the new set of solid-solution carbide grains of uniform and small size was formed in-side coarse TiC particles by diffusion induced recrystallizatin (DIR). With increasing the heat-treatment time fine recrystallized grains were dispersed homogeneously in the matrix and resulted in the increase in fracture strength.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.34 no.1
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• pp.19-26
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• 2010

In this paper, limit load analyses and fracture mechanics analyses were conducted via finite element analyses for the welded pipe with circumferential crack at the center of the weldment. Systematic changes for strength mismatch ratio, width of weldment, crack shape and thickness ratio of the pipe were considered to provide strength mismatch limit load. And J-integral calculations based on reference stress method were conducted for two materials, stainless steel and ferritic steel. Reference stress defined by provided strength mis-match limit load gives much more accurate J-integral.

• Journal of the Korea Institute of Information and Communication Engineering
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• v.10 no.4
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• pp.680-686
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• 2006

Document images captured by scanners have only skewing distortion. But camera captured document images have not only skew but also vignetting effect and geometric distortion. Vignetting effect, which makes the border areas to be darker than the center of the image, make it difficult to separate characters from the document images. But this effect has being decreased, as the lens manufacturing skill is developed. Geometric distortion, occurred by the mismatch of angle and center position between the document image and the camera, make the shape of characters to be distorted, so that the character recognition is more difficult than the case of using scanner. In this paper, we propose a method that can increase the performance of character recognition by correcting the geometric distortion of document images using a linear approximation which changes the quadrilateral region to the rectangle one. The proposed method also determine the quadrilateral transform region automatically, using the alignment of character lines and the skewed angles of characters located in the edges of each character line. Proposed method, therefore, can correct the geometric distortion without getting positional information from camera.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2009.06a
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• pp.9-9
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• 2009

1 wt % Ga-dope ZnO (ZnO:Ga) thin films with n-type semiconducting behavior were grown on c-sapphire substrates by radio frequency magnetron sputtering at various growth temperatures. The room temperature grown ZnO:Ga film showed the faint preferred orientation behavior along the c-axis with small domain size and high density of stacking faults, despite limited surface diffusion of the deposited atoms. The increase in the growth temperature in the range between $300\sim550^{\circ}C$ led to the granular shape of epitaxial ZnO:Ga films due to not enough thermal energy and large lattice mismatch. The growth temperature above $550^{\circ}C$ induced the quite flat surface and the simultaneous improvement of electrical carrier concentration and carrier mobility, $6.3\;\times\;10^{18}/cm^3$ and $27\;cm^2/Vs$, respectively. In addition, the increase in the grain size and the decrease in the dislocation density were observed in the high temperature grown films. The low-temperature photoluminescence of the ZnO:Ga films grown below $450^{\circ}C$ showed the redshift of deep-level emission, which was due to the transition from $Zn_j$ to $O_i$ level.

• Proceedings of the Korean Society For Composite Materials Conference
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• 2005.04a
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• pp.5-8
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• 2005

In this paper, the electromechanical displacements of curved piezoelectric actuators composed of PZT ceramic and laminated composite materials are calculated based on high performance computing technology and the optimal configuration of composite curved actuator is examined. To accurately predict the local pre-stress in the device due to the mismatch in coefficients of thermal expansion, carbon-epoxy and glass-epoxy as well as PZT ceramic are numerically modeled by using hexahedral solid elements. Because the modeling of these thin layers increases the number of degrees of freedom, large-scale structural analyses are performed through the PEGASUS supercomputer, which is installed in our laboratory. In the first stage, the curved shape of the actuator and the internal stress in each layer are obtained by the cured curvature analysis. Subsequently, the displacement due to the piezoelectric force (which is resulted from applied voltage) is also calculated. The performance of composite curved actuator is investigated by comparing the displacements obtained by the variation of thickness and elastic modulus of laminated composite layers. In order to consider the finite deformation in the first analysis stage and include the pre-stress due to curing process in the second stage, nonlinear finite element analyses are carried out.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2005.06a
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• pp.1099-1102
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• 2005

In this paper, a new visual servo method, which uses 5 axis picomotor to compensate the misalignment generated between a SLM and a CCD in a holographic storage device, was proposed and the effectiveness of it was proved by the experiment. In a holographic storage device, the data processing is done by the SLM and the CCD, and the shape of data is 2 dimensional binary patterns. Therefore, the exact image matching between the SLM and the CCD is very important, and the mismatching of it causes the errors in the data reconstruction. First, the brief introduction of a holographic data storage is given, then, BER concept which is errors caused by pixel mismatch between the SLM and the CCD is defined. Second, the geometric relation between 5 axis picomotor and the CCD movement is studied. Finally, the visual servo method using 5 axis picomotor to reduce the BER in a holographic storage device is proposed and experimented. From the experiment, we find that about 3% BER improvement is obtained by the proposed method.

• Journal of the Microelectronics and Packaging Society
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• v.22 no.3
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• pp.51-56
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• 2015

It has been used various pad finish materials to enhance the reliability of solder joint and recently Electroless Ni Electroless Pd Immersion Gold (the following : ENEPIG) pad has been used more than others. This study is about reliability according to being used in commercial Electrolytic Ni pad and ENEPIG pad, and was observed behavior of various Cu contents. After reflow, the inter-metallic compound (IMC) between solder and pad is composed of $Cu_6Sn_5$ (Ni substituted) by using EDS, and in case of ENEPIG, between IMC and Ni layer was observed the dark layer ($Ni_3P$ layer). Additional, it could be controlled the thickness of dark layer according to Cu contents. Investigated the different fracture mode between electrolytic Ni and ENEPIG pad after drop shock test, in case of soft Ni, accelerated stress propagated along the interface between $1^{st}$ IMC and $2^{nd}$ IMC, and in case of ENEPIG pad, accelerated stress propagated along the weaken surface such as dark layer. The unstable interface exists through IMC, pad material and solder bulk by the lattice mismatch, so that the thermal and physical stress due to the continuous exterior impact is transferred to the IMC interface. Therefore, it is strongly requested to control solder morphology, IMC shape and thickness to improve the solder reliability.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2010.06a
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• pp.31-31
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• 2010

The growth of the high-quality GaN epilayers is of significant technological importance because of their commercializedoptoelectronic applications as high-brightness light-emitting diodes (LEDs) and laser diodes (LDs) in the visible and ultraviolet spectral range. The GaN-based heterostructural epilayers have the polar c-axis of the hexagonal structure perpendicular to the interfaces of the active layers. The Ga and N atoms in the c-GaN are alternatively stacked along the polar [0001] crystallographic direction, which leads to spontaneous polarization. In addition, in the InGaN/GaN MQWs, the stress applied along the same axis contributes topiezoelectric polarization, and thus the total polarization is determined as the sum of spontaneous and piezoelectric polarizations. The total polarization in the c-GaN heterolayers, which can generate internal fields and spatial separation of the electron and hole wave functions and consequently a decrease of efficiency and peak shift. One of the possible solutions to eliminate these undesirable effects is to grow GaN-based epilayers in nonpolar orientations. The polarization effects in the GaN are eliminated by growing the films along the nonpolar [$11\bar{2}0$] ($\alpha$-GaN) or [$1\bar{1}00$] (m-GaN) orientation. Although the use of the nonpolar epilayers in wurtzite structure clearly removes the polarization matters, however, it induces another problem related to the formation of a high density of planar defects. The large lattice mismatch between sapphiresubstrates and GaN layers leads to a high density of defects (dislocations and stacking faults). The dominant defects observed in the GaN epilayers with wurtzite structure are one-dimensional (1D) dislocations and two-dimensional (2D) stacking faults. In particular, the 1D threading dislocations in the c-GaN are generated from the film/substrate interface due to their large lattice and thermal coefficient mismatch. However, because the c-GaN epilayers were grown along the normal direction to the basal slip planes, the generation of basal stacking faults (BSFs) is localized on the c-plane and the generated BSFs did not propagate into the surface during the growth. Thus, the primary defects in the c-GaN epilayers are 1D threading dislocations. Occasionally, the particular planar defects such as prismatic stacking faults (PSFs) and inversion domain boundaries are observed. However, since the basal slip planes in the $\alpha$-GaN are parallel to the growth direction unlike c-GaN, the BSFs with lower formation energy can be easily formed along the growth direction, where the BSFs propagate straightly into the surface. Consequently, the lattice mismatch between film and substrate in $\alpha$-GaN epilayers is mainly relaxed through the formation of BSFs. These 2D planar defects are placed along only one direction in the cross-sectional view. Thus, the nonpolar $\alpha$-GaN films have different atomic arrangements along the two orthogonal directions ($[0001]_{GaN}$ and $[\bar{1}100]_{GaN}$ axes) on the $\alpha$-plane, which are expected to induce anisotropic biaxial strain. In this study, the anisotropic strain relaxation behaviors in the nonpolar $\alpha$-GaN epilayers grown on ($1\bar{1}02$) r-plane sapphire substrates by metalorganic chemical vapor deposition (MOCVO) were investigated, and the formation mechanism of the abnormal zigzag shape PSFs was discussed using high-resolution transmission electron microscope (HRTEM).

• Advances in aircraft and spacecraft science
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• v.2 no.2
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• pp.125-168
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• 2015

Dynamic aeroelastic behavior of structurally nonlinear Joined Wings is presented. Three configurations, two characterized by a different location of the joint and one presenting a direct connection between the two wings (SensorCraft-like layout) are investigated. The snap-divergence is studied from a dynamic perspective in order to assess the real response of the configuration. The investigations also focus on the flutter occurrence (critical state) and postcritical phenomena. Limit Cycle Oscillations (LCOs) are observed, possibly followed by a loss of periodicity of the solution as speed is further increased. In some cases, it is also possible to ascertain the presence of period doubling (flip-) bifurcations. Differences between flutter (Hopf's bifurcation) speed evaluated with linear and nonlinear analyses are discussed in depth in order to understand if a linear (and thus computationally less intense) representation provides an acceptable estimate of the instability properties. Both frequency- and time-domain approaches are compared. Moreover, aerodynamic solvers based on the potential flow are critically examined. In particular, it is assessed in what measure more sophisticated aerodynamic and interface models impact the aeroelastic predictions. When the use of the tools gives different results, a physical interpretation of the leading mechanism generating the mismatch is provided. In particular, for PrandtlPlane-like configurations the aeroelastic response is very sensitive to the wake's shape. As a consequence, it is suggested that a more sophisticate modeling of the wake positively impacts the reliability of aerodynamic and aeroelastic analysis. For SensorCraft-like configurations some LCOs are characterized by a non-synchronous motion of the inner and outer portion of the lower wing: the wing's tip exhibits a small oscillation during the descending or ascending phase, whereas the mid-span station describes a sinusoidal-like trajectory in the time-domain.