• Journal of Sensor Science and Technology
• /
• v.13 no.4
• /
• pp.287-291
• /
• 2004

A capacitive type humidity sensor has been fabricated using a polyimide film without hydrophobic elements and its characteristics has been evaluated for hermeticity measurement of micro packages. For a highly sensitive humidity sensor, a polyimide film without hydrophobic elements has been synthesized and used instead of using a commercial one in which 7 group elements such as fluorine or chlorine are included. Sensitivity, stability and hysteresis has been performed to characterize the fabricated sensors. The sensitivity defined as normalized percent capacitance change was 0.3751%RH and hysteresis was 0.77% in the range of 10%RH to 90%RH. Maximum deviation from the average capacitance measured for 120 minutes at 50%RH was 0.25%. The proposed humidity sensor can be used for hermeticity measurement of micro packages.

• Composites Research
• /
• v.25 no.6
• /
• pp.211-216
• /
• 2012

FBG sensor peaks could be split due to polarization by shear strain, when the fiber optic sensors embedded or attached to the structure. For the fiber optic sensor packages, sensor grating has to be protected from shear strains. Also, pretension has to be applied to the sensor because compressive strain must be measured. Without pretension of sensor, the sensor does not show any change of signal until it is stretched. In order to mesure compressive and tensile strains, two fixing point and prestressed sensor need. In the fixing point, just holding the optical fiber cause slip between core and cladding in the fiber. A Fixation method of prestressed FBG sensors fixed with partially stripped fibers was developed. The sensor package has the prestress controllable fixtures at the fixing points. Prestress to the sensor imposed by controlling the two fixed points with bolts and nuts make it easy to measure compressive strain as well as tensile strain. The fiber optic sensor packages applied to the actual structure and the structural monitoring system using the package can be applied to safety through surveillance.

• 제어로봇시스템학회:학술대회논문집
• /
• 1989.10a
• /
• pp.244-249
• /
• 1989

For the robot manipulator in performing precision tasks, it is indispensable that the robot utilize the various sensors for intelligence. In this paper, the hybrid position/force control method is implemented with a force/torque sensor, two personal computers, and a PUMA 560 manipulator. Two application S/W packages for edge following and peg-in-hole tasks are developed by the proposed force control algorithm. The related experimental results are then presented and discussed,

• Journal of the Microelectronics and Packaging Society
• /
• v.14 no.4
• /
• pp.63-69
• /
• 2007

We investigated interconnection processes using Cu vias for MEMS sensor packages. Ag paste layer was formed on a glass substrate and used as a seed layer for electrodeposition of Cu vias after bonding a Si substrate with through-via holes. With applying electrodeposition current densities of $20mA/cm^2\;and\;30mA/cm^2$ at direct current mode to the Ag paste seed-layer, Cu vias of $200{\mu}m$ diameter and $350{\mu}m$ depth were formed successfully without electrodeposition defects. Interconnection processes for MEMS sensor packages could be accomplished with Ti/Cu/Ti line formation, Au pad electrodeposition, Sn solder electrodeposition and reflow process on the Si substrate where Cu vias were formed by Cu electrodeposition into through-via holes.

• Journal of the Semiconductor & Display Technology
• /
• v.15 no.4
• /
• pp.1-9
• /
• 2016

The warpage on mobile phone camera packages occurs due to the CTE(Coefficient of Thermal Expansion) mismatch between a thin silicon die and a substrate. The warpage in the optical instruments such as camera module has an effect on the field curvature, which is one of the factors degrading the optical performance and the product yield. In this paper, we studied the effect of die bonding epoxy on the package and optical performance of mobile phone camera packages. We calculated the warpages of camera module packages by using a finite element analysis, and their shapes were in good agreement showing parabolic curvature. We also measured the warpages and through-focus MTF of camera module specimens with experiments. The warpage was improved on an epoxy with low elastic modulus at both finite element analysis and experiment results, and the MTF performance increased accordingly. The results show that die bonding epoxy affects the warpage generated on the image sensor during the packaging process, and this warpage eventually affects the optical performance associated with the field curvature.

• JSTS:Journal of Semiconductor Technology and Science
• /
• v.4 no.2
• /
• pp.128-132
• /
• 2004

This paper presents the design, fabrication sequence and measurement results of a highly sensitive capacitive-type humidity sensor using a polyimide film without hydrophobic elements. The structure of the humidity sensor is MIM (metalinsulator-metal). For a high sensitivity, a modified aromatic polyimides as a moisture absorbing layer has been synthesized instead of using general polyimides containing hydrophobic elements. The polyimide film was obtained by synthesizing and thermally polymerizing polyamic acid composed of m-pyromellitic dianhydride, phenelenediamine and dimethylacetamide. Characteristics of fabricated sensors which include sensitivity, hysteresis and stability have been measured. The measurement result shows the percent normalized capacitance change of 0.37/%RH over a range from 10 to 90%RH, hysteresis of 0.77% over the same %RH range and maximum drift of 0.25% at 50%RH. The result shows that the developed humidity sensor can be applied to evaluate a hermeticity of various sensors and actuator systems as well as micro packages.

• KSII Transactions on Internet and Information Systems (TIIS)
• /
• v.9 no.9
• /
• pp.3396-3411
• /
• 2015

Sensors used in Wireless Sensor Networks (WSN) have mostly limited capacity which affects the performance of their applications. One of the data-gathering methods is to use mobile sinks to visit these sensors so that they can save their limited battery energies from forwarding data packages to static sinks. The main disadvantage of employing mobile sinks is the delay of data collection due to relative low speed of mobile sinks. Since sensors have very limited memory capacities, whenever a mobile sink is too late to visit a sensor, that sensor's memory would be full, which is called a 'memory overflow', and thus, needs to be purged, which causes loss of collected data. In this work, a method is proposed to generate mobile sink tours, such that the number of overflows and the amount of lost data are minimized. Moreover, the proposed method does not need either the sensor locations or sensor memory status in advance. Hence, the overhead stemmed from the information exchange of these requirements are avoided. The proposed method is compared with a previously published heuristic. The simulation experiment results show the success of the proposed method over the rival heuristic with respect to the considered metrics under various parameters.

• Proceedings of the International Microelectronics And Packaging Society Conference
• /
• 2000.04a
• /
• pp.29-33
• /
• 2000

MEMS, Micro Electro-Mechanical Systems, present one of the greatest advanced packaging challenges of the next decade. Historically hybrid technology, generally thick film, provided sensors and actuators while integrated circuit technologies provided the microelectronics for interpretation and control of the sensor input and actuator output. Brought together in MEMS these technical fields create new opportunities for miniaturization and performance. Integrated circuit processing technologies combined with hybrid design systems yield innovative sensors and actuators for a variety of applications from single crystal silicon wafers. MEMS packages, far more simple in principle than today's electronic packages, provide only physical protection to the devices they house. However, they cannot interfere with the function of the devices and often must actually facilitate the performance of the device. For example, a pressure transducer may need to be open to atmospheric pressure on one side of the detector yet protected from contamination and blockage. Similarly, an optical device requires protection from contamination without optical attenuation or distortion being introduced. Despite impediments such as package standardization and complexity, MEMS markets expect to double by 2003 to more than ＄9 billion, largely driven by micro-fluidic applications in the medical arena. Like the semiconductor industry before it. MEMS present many diverse demands on the advanced packaging engineering community. With focused effort, particularly on standards and packaging process efficiency. MEMS may offer the greatest opportunity for technical advancement as well as profitability in advanced packaging in the first decade of the 21st century! This paper explores MEMS packaging opportunities and reviews specific technical challenges to be met.

• Journal of Korea Society of Digital Industry and Information Management
• /
• v.11 no.1
• /
• pp.69-78
• /
• 2015

Internet of Things(IoT) is electronic devices and household appliances use wireless sensor network in environment of high speed wireless network and LTE mobile service. The combination of the development of Internet and wireless network led to development of new forms of service such as electronic devices and household appliances can connect to the Internet through various sensors and online servers such as a Home Network. Even though Internet of Things is useful, there are problems in Internet of Things. In environment of Internet of Things, information leakage could happens by illegal eavesdropping and spoofing. Also illegal devices of wireless communication interference can cause interfere in Internet of things service, physical damage and denial of service by modulation of data and sensor. In this thesis, it will analyze security threats and security vulnerability in environment of mobile services and smart household appliances, then it will suggest plan. To solve security issues, it is important that IT and RFID sensor related companies realize importance of security environment rather than focus on making profit. It is important to develop the standardized security model that applies to the Internet of Things by security-related packages, standard certification system and strong encrypted authentication.

• Journal of the Computational Structural Engineering Institute of Korea
• /
• v.21 no.6
• /
• pp.607-613
• /
• 2008

A monitoring system for the subway structures using prestrained FBG sensors fixed with partially stripped fibers was developed. The sensor packages had pre-strain controllable fixtures. Tensile and compressive strain of the structure could be measured without slip. The FBG sensor system was applied to the concrete lining structure in Taegu subway. Near the structure, the narrow tunnel construction, for the electric power cables and telecommunication cables, started. We wanted to measure the deformations of the subway structures due to the construction by the FBG sensor. The applied sensors had the gauge length of 1 meter to overcome the inhomogeneity of the concrete material with enough length. In order to fix tightly to the structure, the partially stripped parts of the sensor glued to the package and slip phenomenon between fiber and acrylate jacket was prevented. Prestrain of the sensor was imposed by controlling the two fixed points with bolts and nuts in order to measure compressive strain as well as tensile strain. The behavior of subway lining structure could be monitored very well.