• Journal of East Asia Management
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• 제3권2호
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• pp.43-64
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• 2022

Exploring innovations for latecomers to catch up has been a popular concern in industry and academia. Over the last decade, more and more East Asian latecomer firms have moved beyond imitation and are delivering innovative products and services to the market. However, the semiconductor latecomers from China have limited success in catching up with more mature semiconductor firms. Our study examines how semiconductor latecomers to break through the latecomer's dilemma by innovation and achieve catch-up. We use a single-case approach for the Semiconductor Manufacturing International Corporation (SMIC) vertical development process to analysis its innovation path of catching up. The study's results showed that SMIC relied on the government's policy and funding support, and based on the strategic endurance of entrepreneurs, it persisted in technology R&D investment and independent innovation for 20 years. SMIC finally smashed the dilemma of latecomers and successfully achieved catch-up. With these findings, we believe that the path of catching up innovation for semiconductor latecomers should be equipped with independent innovation of technology, strategic leadership of entrepreneurs and support of government policies. As these factors are combined, latecomer firms' position is expected to rise and catch-up will become visible. Our study contributes to some enlightenment on the innovation path for latecomers in China and global semiconductors to achieve their catch-up.

• 대한산업공학회지
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• 제41권6호
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• pp.579-587
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• 2015

Semiconductor manufacturing industry is a high density integration industry because it generates a vest number of data that takes about 300~400 processes that is supervised by numerous production parameters. It is asked of engineers to understand the correlation between different stages of the manufacturing process which is crucial in reducing production costs. With complex manufacturing processes, and defect processing time being the main cause. In the past, it was possible to grasp the corelation among manufacturing process stages through the engineer's domain knowledge. However, It is impossible to understand the corelation among manufacturing processes nowadays due to high density integration in current semiconductor manufacturing. in this paper we propose a canonical correlation analysis (CCA) using both wafer test voltage variables and fail bit counts variables. using the method we suggested, we can increase the semiconductor yield which is the result of the package test.

• 한국산학기술학회논문지
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• 제13권8호
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• pp.3319-3325
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• 2012

본 논문은 반도체 포토장비의 이산 이벤트 시뮬레이터인 TrackSim의 개발에 관한 것이다. TrackSim은 포토 장비의 시뮬레이션 엔진과 사용하기 쉬운 사용자 환경을 포함하는 시뮬레이터로, 다양한 프로세스 모듈의 구성 및 운영 방법을 효율적으로 평가, 검증, 스케쥴링할 수 있는 3차원 시뮬레이션 환경을 제공한다. TrackSim은 반도체 산업에서 많이 사용되는 이산 사건 시뮬레이션 소프트웨어인 AutoMod를 기반으로 개발되어 시뮬레이션 신뢰성이 보장되며, AutoMod로 개발된 반도체 제조라인 시뮬레이션 모델 속에 함께 연동하여 사용이 가능하다는 특징이 있다.

• 방사선산업학회지
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• 제2권3호
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• pp.141-148
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• 2008

Beta rays emitted from tritium in titanium tritide film were simulated with cathode rays of a scanning electron microscope to investigate the effect of beta rays from tritium on semiconductor devices. The cathode ray currents, which vary with the change of applied energy and beam spot size, were measured with Faraday cup. The current from the semiconductor device irradiated with cathode rays at various conditions was measured. The cathode ray current increased with the increase of spot size to a maximum then decreased when the spot sized increased further. The magnitude of current produced in the semiconductor device is proportional to the magnitude of cathode ray current. The magnitude of cathode ray current at each energy level was matched to the intensity of beta ray to simulate the tritium beta ray spectrum. Then the semiconductor characteristics were analyzed with I-V curves.

• Industrial Engineering and Management Systems
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• 제12권4호
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• pp.306-316
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• 2013

The semiconductor industry has grown rapidly, and subsequently production planning problems have raised many important research issues. The reentrant flow-shop (RFS) scheduling problem with time windows constraint for harddisk devices (HDD) manufacturing is one such problem of the expanded semiconductor industry. The RFS scheduling problem with the objective of minimizing the makespan of jobs is considered. Meeting this objective is directly related to maximizing the system throughput which is the most important of HDD industry requirements. Moreover, most manufacturing systems have to handle the quality of semiconductor material. The time windows constraint in the manufacturing system must then be considered. In this paper, we propose a hybrid genetic algorithm (HGA) for improving chromosomes/offspring by checking and repairing time window constraint and improving offspring by left-shift routines as a local search algorithm to solve effectively the RFS scheduling problem with time windows constraint. Numerical experiments on several problems show that the proposed HGA approach has higher search capability to improve quality of solutions.

• 한국소음진동공학회:학술대회논문집
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• 한국소음진동공학회 2006년도 추계학술대회논문집
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• pp.792-796
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• 2006

In recent years, the semiconductor industry and the optical industry is developed rapidly. The recent demand has expanded for optical components such as a optical lens, a optical semiconductor and a measuring instrument. Object transport systems are driven typically by the magnetic field and the conveyer belt. Recent industry requires more faster and efficient transport system. However, conventional transport systems are not adequate for transportation of optical elements and semiconductors. Because conveyor belts can damage precision optical elements by the contact force and magnetic systems can destroy the inner structure of semiconductor by the magnetic field. In this paper, the levitation transport system using ultrasonic wave is developed for transporting precision elements without damages. This transport system is using 2-mode ultrasonic wave excitation and flexural beam modes shapes are evaluated. It compared simulation results with experimental results

• 지식경영연구
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• 제10권4호
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• pp.163-183
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• 2009

Numerous studies in the field of buyer-supplier relationship research have focused on the buyer's performance. In contrast, supplier's performance has been paid relatively little attention by researchers, especially the research about the supplier's innovation in the relationship is still in its early stage. In this paper, we examine the relation between the attribute of buyer-supplier relationship and the attribute of supplier's innovation through case research. We define the attribute of buyer-supplier relationship as 'tie strength' (Granovetter, 1973), and the attribute of supplier's innovation as 'exploitation or exploration' (March, 1991). We selected the semiconductor equipment industry of U.S.A, Japan and Korea and firm (JUSUNG Engineering) as cases that examine the relation. We found that a strong tie relationship is positively associated with supplier's exploitation based innovation, and a weak tie relationship is positively related to it's exploration based innovation in this research also. In addition, we could verify reduction of strong tie relationship cause supplier's organizational change.

• 한국산업보건학회지
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• 제26권1호
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• pp.1-10
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• 2016

Objectives: The aim of this study is to review the results of exposure to chemicals and to extremely low frequency(ELF) magnetic fields generated in wafer fabrication operations in the semiconductor industry. Methods: Exposure assessment studies of silicon wafer fab operations in the semiconductor industry were collected through an extensive literature review of articles reported until the end of 2015. The key words used in the literature search were "semiconductor industry", "wafer fab", "silicon wafer", and "clean room," both singly and in combination. Literature reporting on airborne chemicals and extremely low frequency(ELF) magnetic fields were collected and reviewed. Results and Conclusions: Major airborne hazardous agents assessed were several organic solvents and ethylene glycol ethers from Photolithography, arsenic from ion implantation and extremely low frequency magnetic fields from the overall fabrication processes. Most exposures to chemicals reported were found to be far below permissible exposure limits(PEL) (10% < PEL). Most of these results were from operators who handled processes in a well-controlled environment. In conclusion, we found a lack of results on exposure to hazardous agents, including chemicals and radiation, which are insufficient for use in the estimation of past exposure. The results we reviewed should be applied with great caution to associate chronic health effects.

• 한국산업보건학회지
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• 제22권1호
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• pp.9-19
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• 2012

Objectives: The aim of this study is to critically review the exposure surrogates and estimates used to associate health effects in wafer fabrication workers such as spontaneous abortion and cancer, as well as to identify the limitations of retrospective exposure assessment methods Methods: Epidemiologic and exposure-assessment studies of wafer fabrication operations in the semiconductor industry were collected. Retrospective exposure-assessment methods used in cancer risk and mortality and reproductive toxicity were reviewed. Results: Eight epidemiologic papers and two reports compared cancer risk among workers in wafer fabrication facilities in the semiconductor industry with the risk of the general population. Exposure surrogates used in those cancer studies were fabrication(vs. non-fabrication), employment duration, manufacturing eras, job title (operator vs. maintenance worker) and qualitative classifications of agents without assessing specific agent or job-specific exposure. In contrast, specific operation, job title and agents were used to classify the exposure of fabrication workers, contributing to finding a significant association with spontaneous abortion (SAB). Conclusion: Further epidemiologic studies of fabrication workers using more refined exposure assessment methods are warranted in order to examine the associations between fabrication work, environment, and specific agents with cancer risk or mortality as used in SAB epidemiologic studies.

• Journal of Information Processing Systems
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• 제10권3호
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• pp.429-442
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• 2014

In this paper, we investigated the use of seasonal autoregressive integrated moving average (SARIMA) time series models for fault detection in semiconductor etch equipment data. The derivative dynamic time warping algorithm was employed for the synchronization of data. The models were generated using a set of data from healthy runs, and the established models were compared with the experimental runs to find the faulty runs. It has been shown that the SARIMA modeling for this data can detect faults in the etch tool data from the semiconductor industry with an accuracy of 80% and 90% using the parameter-wise error computation and the step-wise error computation, respectively. We found that SARIMA is useful to detect incipient faults in semiconductor fabrication.