• Journal of the Korean Society of Industry Convergence
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• v.4 no.3
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• pp.329-337
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• 2001

This simulator is developed for the analysis of a MOSFET based on Thermally Coupled Energy Transport Model(TCETM). The simulator has the ability to calculate not only stationary characteristics but also non - stationary characteristics of a MOSFET. It solves basic semiconductor devices equations including Possion equation, current continuity equations for electrons and holes, energy balance equation for electrons and heat flow equation, using finite difference method. The conventional semiconductor device simulation technique, based on the Drift-Diffusion Model (DDM), neglects the thermal and other energy-related properties of a miniaturized device. I, therefore, developed a simulator based on the Thermally Coupled Energy Transport Model (TCETM) which treats not only steady-state but also transient phenomena of such a small-size MOSFET. In particular, the present paper investigates the breakdown characteristics in transient conditions. As a result, we found that the breakdown voltage has been largely underestimated by the DDM in transient conditions.

• Journal of the Semiconductor & Display Technology
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• v.7 no.2
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• pp.55-58
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• 2008

The objective of the research is to design, manufacture and test a Mass Flow Controller(MFC) capable of measuring compressible fluid flows based on a "bucket and stop-watch"method. The basic principle is the measurement of time, where the time taken to fill and empty a bucket of known volume is measured. This method of flow measurement is a new concept when compared to a commercilized current mass flow controller. For the flow meter to be able to compete with established designs it not only must be comparable in cost and robustness, it must be very accurate and reliable as well. This device should be able to handle fluid flows in the range of 0.1ml/min to 10ml/min within an accuracy of ${\pm}$1%. A possible application for a device such as this is in electronics industry where arsenic gas is used in the production of silicon chips.

• Safety and Health at Work
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• v.9 no.3
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• pp.249-256
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• 2018

This article aims to provide a systematic review of the exposure assessment methods used to assign wafer fabrication (fab) workers in epidemiologic cohort studies of mortality from all causes and various cancers. Epidemiologic and exposure-assessment studies of silicon wafer fab operations in the semiconductor industry were collected through an extensive literature review of articles reported until 2017. The studies found various outcomes possibly linked to fab operations, but a clear association with the chemicals in the process was not found, possibly because of exposure assessment methodology. No study used a tiered assessment approach to identify similar exposure groups that incorporated manufacturing era, facility, fab environment, operation, job and level of exposure to individual hazardous agents. Further epidemiologic studies of fab workers are warranted with more refined exposure assessment methods incorporating both operation and job title and hazardous agents to examine the associations with cancer risk or mortality.

• Journal of Korean Society of Occupational and Environmental Hygiene
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• v.22 no.1
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• pp.20-25
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• 2012

Objectives: Hazard identification is the most important step in occupational health monitoring at the workplace. This paper reviewed the several related stuffs to the hazard identification in the semiconductor industry. Methods: I checked the MSDS system, chemical toxic informations, trade secrets and by-products by experience and the literature used in semiconductor industry. Results: I found and experienced as follows; (1) There are a few inventory and history of chemicals used in workplace. Toxic information of chemicals to be available is very limited. (2) There are many trade secrets in MSDS for chemical mixtures. It is difficult to identify the accurate information from MSDS. (3) By-products is necessary to identify that they will produce in workplace. Conclusions: It is necessary to regulate the obligations of employers which check the inventory and history of chemicals used in workplace. It is necessary to amend the trade secrets in MSDS system.

• Journal of the Korean Society of Industry Convergence
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• v.24 no.4_1
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• pp.411-419
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• 2021

In this study, IGBT_Total_Loss and DIODE_Total_Loss were used to analyze the slope of the junction temperature for each section for temperature and duty variables in order to simply calculate the junction temperature of the power semiconductor (IGBT). As a result of the calculation, IGBT_Max_Junction_Temp and DIODE_Max_Junction_Temp form a proportional relationship with temperature for each duty. This simulation data shows that the power loss of a power semiconductor is calculated in a complex manner according to the current dependence index, voltage dependence index, and temperature coefficient. By applying the slope for each condition and section, the junction temperature of the power semiconductor can be calculated simply.

• 한국정보디스플레이학회:학술대회논문집
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• 2007.08b
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• pp.1245-1248
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• 2007

We propose new approaches to thin film transistor fabrication that use carbon nanotubes and semiconductor nanowires as active elements. These nanomaterials which are essentially studied in the context of the post CMOS era will certainly impact the active matrix display industry in the near future.

• Proceedings of the Korea Society for Simulation Conference
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• 2002.11a
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• pp.115-121
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• 2002

The growth of semiconductor industry attracted to researchers like design, facility technique and making small size chip areas. But nowadays, cause of technology extension and oversupply and price down, yield improvement is the most important point on growth. This paper describes the computer mode]ing technique as the solutions to analyze the problem, to formalize the semiconductor manufacturing process and to build advanced manufacturing environments. The computer models are built referring an existing 8' wafer production line in Korea.

• Journal of the Semiconductor & Display Technology
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• v.2 no.4
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• pp.13-17
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• 2003

An adaptor is designed for chamber impedance measurement of plasma process. Copper rod, fixed board and compensation circuit are the major components of the adaptor. An adaptor can be to measure chamber impedance on time unless stopping a process and Data to measure can do the database. We can use it to a criteria data for a failure diagnosis. So developed adaptor could be used for diagnosis the plasma process chamber in semiconductor industry.

• Proceedings of the Korean Society Of Semiconductor Equipment Technology
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• 2003.12a
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• pp.169-176
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• 2003

Telematic and new programming technologies support the increasing demand of education and training leading to the delivery of computer based learining systems open to distance and continuing education. Using LabVIEW, we designed and implemented an interactive learning environment for practice on electronics measurement methodologies. The environment provides remote access to real and simulated instrumentation and guided experiments on basic circuits. The environment is applied to the education and training on electronics for engineers in the field of semiconductor industry.

• Journal of the Microelectronics and Packaging Society
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• v.23 no.1
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• pp.1-10
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• 2016

Nowadays, the importance of role of the international standardization keeps increasing substantially. We have already known that international standards have a huge impact on many companies, industries and nations. So far, it has been thought that standardizations are needed after the new products come into the market and are mass-produced in order to encourage the use of the products, systems and services. Standardization will make the products more safe, efficient, and environmentally friendly for the users. However, in these days, a paradigm of the standardization has been changed. International standard becomes a tool for dominating global market and is the most important ingredients of the competitiveness and economic progress of the nation and enterprises. Many countries like Japan, Germany and U.S. use the standardization as an effective method to dominate the market and monopolized the new technologies. Therefore, worldwide competition for the standardization of the new technology become fierce. Korea is leading the technology in semiconductor field. However, activities of international standardization are not sufficient. In order to boost the standardization activities in Korea from industry, academia, and research institute, this paper briefly introduce the international standard organization and some critical issues for next-generation semiconductor memory such as flexible semiconductor, automobile semiconductor and wearable devices.