• Proceedings of the Korean Vacuum Society Conference
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• 2016.02a
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• pp.291.2-291.2
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• 2016

3D semiconductor material of silicon that is used throughout the semiconductor industry currently faces a physical limitation of the development of semiconductor process technology. The research into the next generation of nano-semiconductor materials such as semiconductor properties superior to replace silicon in order to overcome the physical limitations, such as the 2-dimensional graphene material in 2D transition-metal dichalcogenide (TMD) has been researched. In particular, 2D TMD doping without severely damage of crystal structure is required different conventional methods such as ion implantation in 3D semiconductor device. Here, we study a p-type doping technique on tungsten diselenide (WSe2) for p-channel 2D transistors by adjusting the concentration of hydrochloric acid through Raman spectroscopy and electrical/optical measurements. Where the performance parameters of WSe2 - based electronic device can be properly designed or optimized. (on currents increasing and threshold voltage positive shift.) We expect that our p-doping method will make it possible to successfully integrate future layered semiconductor devices.

• Journal of the Korean Society of Safety
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• v.15 no.4
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• pp.62-68
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• 2000

Static electricity in electronics manufacturing plants causes the economic loss, yet it is one of the least understood and least recognized effects haunting the industry today. Today's challenge in semiconductor devices is to achieve greater functional density pattern and to miniaturize electronic systems of being more fragile by electrostatic discharges(ESD) phenomena. As the use of automatic handling equipment for static-sensitive semiconductor components is rapidly increased, most manufacturers need to be more alert to the problem of ESD. One of the most common causes of electrostatic damage is the direct transfer of electrostatic charge from the human body or a charged material to the static-sensitive devices. To evaluate the ESD hazards by charged human body and devices, in this paper, characteristics of electrostatic attenuation in domestic semiconductor devices is investigated and the voltage to cause electronic component failures is investigated by field-induced charged device model(FCDM) tester. The FCDM simulator provides a fast and inexpensive test that faithfully represents ESD hazards in plants. Also the results obtained in this paper can be used for the prevention of semiconductor failure from ESD hazards.

• Proceedings of the KSME Conference
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• 2003.11a
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• pp.1442-1447
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• 2003

Computer is a very powerful machine which is widely using for data processing, DB construction, peripheral device control, image processing etc. Consequently, many researches and developments have progressed for high performance processing unit, and other devices. Especially, the core units such as semiconductor parts are rapidly growing so that high-integration, high-performance, microminiat turization is possible. The packaging in the semiconductor industry is very important technique to de determine the performance of the system that the semiconductor is used. In this paper, the inspection of the inner defects such as delamination, void, crack, etc. in the semiconductor packages is studied. ESPI which is a non-contact, non-destructive, and full-field inspection method is used for the inner defect inspection and its results are compared with that of C-Scan method.

• International Journal of Internet, Broadcasting and Communication
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• v.15 no.2
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• pp.202-209
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• 2023

This study aims to analyze the correlation between semiconductor innovation and market dominance in the mobility electric vehicle industry. To this end, the study presentsstrategiesthat provide low-price competitiveness along with high-value creation in the electric vehicle and semiconductor markets. The first change in the era of high interest rates is to overcome the crisis of survival for value. Furthermore, the study acknowledges the ongoing second wave of change as the digital technology's value continues to rise, and companies experience decreased productivity due to rising ESG labor costs. The study analyzed price competitiveness in the context of the increased adoption of electric vehicles and the integration of semiconductor prices, proving that Tesla and Samsung Semiconductor have developed technology to dominate the market, with appropriate low-cost strategies applied as the value of innovation declines.

• Journal of the Korea Safety Management & Science
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• v.21 no.2
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• pp.25-42
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• 2019

The government announced that it would ask the contractors not only the supplier but also the contractors to take the same responsibilities if they did not observe industrial accident safety measures from 2019. The semiconductor manufacturing process belongs to the representative disaster industry group in which the facility is directly located inside a closed space called clean room. According to previous studies, the semiconductor industry group used checklists for safety management of their suppliers. This study has developed a model for assessing suppliers by constructing a quantitative checklist item through the risk assessment methodology, laws and regulations. The evaluation model of the supplier set up through this study becomes the safety management standard in the semiconductor industry. Furthermore, it is applied to the partner companies in the operation of ISO 14001, 45001, I would like to apply it as a measure of performance management for CSR (Corporate Social Responsibility).

• JOURNAL OF ELECTRICAL WORLD
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• no.8 s.164
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• pp.19-25
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• 1990

• JOURNAL OF ELECTRICAL WORLD
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• no.9 s.105
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• pp.20-25
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• 1985

• Journal of Korea Technology Innovation Society
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• v.15 no.3
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• pp.500-532
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• 2012

This study analyzed the technology innovation strategies of knowledge-based companies in the semiconductor IP industry. The theoretical approaches of this study are to i) the creation, protection and utilization of knowledge and innovation, ii) value creation from innovation, iii) modularity, timing of market entry, and the emergence and competition of standard (dominant design). Based on the theoretical analysis, I presented exploratory research hypotheses. Ultimately, this study examined the proposed hypotheses by conducting case studies on the technology innovation strategy of two leading knowledge-based companies in the semiconductor IP industry: ARM and INTEL. First, knowledge-based companies entering in the early stage of the technology cycle select the vertically-integrated technology strategy because of lower access to complementary knowledge assets, and maintain the vertically-integrated technology strategy despite the environmental change-driven differentiation of industry's value chain. Second, knowledge-based companies entering in the later stage of the technology cycle prefer the contract-based technology strategy because of its increased accessibility to complementary knowledge assets, and choose a different path of innovation strategies depending on whether their asset has the feature of discontinuity or not.

• Journal of Korean Society of Industrial and Systems Engineering
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• v.28 no.2
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• pp.139-145
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• 2005

As today's business environment becomes more globalized and distributed, the importance of collaboration is rapidly increasing. This Paper Presents a systematic approach to collaboration strategy planning. The framework suggests that a Collaborative Process Map needs to be identified first. Then, Collaboration Maturity of an enterprise is evaluated. Based on the Collaborative Process Map and Collaboration Maturity Evaluation, Collaboration Execution Plans are systematically established. A case study shows that the proposed framework can successfully be applied to the strategic collaboration planning of semiconductor industry

• International Commerce and Information Review
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• v.10 no.3
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• pp.369-389
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• 2008

The purpose of this paper is to study on relations between alliance types and firm's characteristics in Korean semiconductor industry to prevent trade disputes. The recognition of firms' business strategies tend to be subjective and there is a limitation to use the guiding principles due to subjectivity. If there are additional guiding principles which view strategic alliances in relation to more objective characteristics associated with firms, such as their size, function, scope, and location, they will be useful tools for executives and managers in their business practices. We analyze strategic alliances how firms; external characteristics become decision factors for selecting appropriate forms of strategic alliances. Previous research works with focus on alliance forms are reviewed, then an analytical framework is described with certain categorization of firms' characteristics and alliance forms.