• JSTS:Journal of Semiconductor Technology and Science
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• v.1 no.1
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• pp.15-19
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• 2001

Current leakage is the major failure mode of semiconductor device characteristic failures. Conventionally, failures such as short circuit breaks and gate breakdowns have been analyzed and the detected causes have been reflected in the fabrication process. By using a wafer-level emission-leakage failure analysis method (in-line QC), we analyzed leakage mode failure, which is the major failure detected during the probe inspection process for LSIs, typically DRAMs and CMOS logic LSIs. We have thus developed a new technique that copes with the critical structural failures and random failures that directly affect probe yields.

• Journal of the Korea Society for Simulation
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• v.14 no.1
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• pp.1-8
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• 2005

In the semiconductor manufacturing, yield enhancement is an urgent issue. It is ideal to prevent all the failures. However, when a failure occurs, it is important to quickly specify the cause stage and take countermeasure. Reviewing wafer level and composite lot level yield patterns has always been an effective way of identifying yield inhibitors and driving process improvement. This process is very time consuming and as such generally occurs only when the overall yield of a device has dropped significantly enough to warrant investigation. The automatic method of failure pattern extraction from fail bit map provides reduced time to analysis and facilitates yield enhancement. The automatic method of failure pattern extraction from fail bit map provides reduced time to analysis and facilitates yield enhancement. This paper describes the techniques to automatically classifies a failure pattern using a fail bit map.

• Korean Journal of Metals and Materials
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• v.49 no.9
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• pp.708-714
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• 2011

The premature failure of a servovalve used for six months in a thermal power plant has been analyzed. The servovalve was made of stainless steel, containing 16Cr-0.44Mo, along with other elements. An overload of oil-supply pumping and an abnormal increase in the oil flux were observed during operation. A study revealed that erosion and corrosion could be the main causes of the failure. The visual examination of the servovalve did not show any appreciable damage. However, corrosion and erosion of the servovalve were observed using scanning electron microscopy (SEM). Upon examination of the servovalve, the corrosion was found to have occurred throughout the bushing and spool; however, erosion occurred at only the edge-side. In addition, the condition of the electrohydraulic control system (EHC) oil was investigated with respect to its satisfaction of the management standard.

• Journal of the Semiconductor & Display Technology
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• v.22 no.4
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• pp.113-118
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• 2023

Maintenance of semiconductor equipment processes is crucial for the continuous growth of the semiconductor market. The process must always be upheld in optimal condition to ensure a smooth supply of numerous parts. Additionally, it is imperative to monitor the status of the robots that play a central role in the process. Just as many senses of organs judge a person's body condition, robots also have numerous sensors that play a role, and like human joints, they can detect the condition first in the joints, which are the driving parts of the robot. Therefore, a normal state test bed and an abnormal state test bed using an aging reducer were constructed by simulating the joint, which is the driving part of the robot. Various sensors such as vibration, torque, encoder, and temperature were attached to accurately diagnose the robot's failure, and the test bed was built with an integrated system to collect and control data simultaneously in real-time. After configuring the user screen and building a database based on the collected data, the characteristic values of normal and abnormal data were analyzed, and machine learning was performed using the KNN (K-Nearest Neighbors) machine learning algorithm. This approach yielded an impressive 94% accuracy in failure diagnosis, underscoring the reliability of both the test bed and the data it produced.

• Proceedings of the Korea Society for Simulation Conference
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• 2003.11a
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• pp.147-151
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• 2003

Yield enhancement in semiconductor fabrication is important. Even though DRAM yield loss may be attributed to many problems, the existence of defects on the wafer is one of the main causes. When the defects on the wafer form patterns, it is usually an indication for the identification of equipment problems or process variations. In this paper describes the techniques to automatically classify a failure pattern using a fail bit map.

• Journal of the Semiconductor & Display Technology
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• v.12 no.2
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• pp.39-43
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• 2013

The semiconductor equipments generate necessary data through communication networks for the effective manufacturing processes and automation of semiconductor equipments. For transferring data between semiconductor equipments and sending data to monitor equipments, several standards for communication protocols have been proposed. Communication networks in semiconductor manufacturing systems will transmit a lot of data traffic, which can be vulnerable in data delay and network failure. Therefore, it is required that data traffic need to be distributed. To accomplish this objective, we recommend the use of a redundant and valuable communication path which is constructed by a wireless sensor network. In this paper, the directed diffusion method for wireless sensor networking is suggested for networking semiconductor equipments. It is shown that how the directed diffusion is employed to connect semiconductor equipments. Also, we show how to implement the SECS of semiconductor equipments communication protocols based on the directed diffusion.

• The Transactions of The Korean Institute of Electrical Engineers
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• v.59 no.3
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• pp.575-580
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• 2010

This paper is to design an optimum power conversion device for the system required for development of a low cost 3-phase power inverter. For this purpose, in order to meet with endurance required by the industry, failure mode is standardized to guarantee lifetime of a power semiconductor by monitoring real time power loss and to facilitate failure mode analysis. As normality of heat loss of a power semiconductor is identified remaining in a certain range by comparing heat rise slope between that is calculated by using average current or average loss and that is measured at a heat sink, its feasibility is confirmed by experiment.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.27 no.1
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• pp.61-69
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• 2014

In this paper, we have researched semiconductor optical filters to solve the problem of the high failure rate that are recognize bad of financial account, jam of financial account and the ATM service interruption due to failure of accurate location information among the operation of the ATM (automatic teller machine) systems. A semiconductor optical filters that have high resolution and less diffuse, high transmittance are able to detect the information of financial account surface accurately. Therefore, it is a stable filter that is able to minimize the incidence of disability. In this paper, we drew the determinants by element for implement an excellent semiconductor optical filters. Based on this, we had to be able to implement the semiconductor optical filter that is able to be mounted on the actual ATM system through future studies.

• The Journal of the Korea institute of electronic communication sciences
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• v.16 no.2
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• pp.287-292
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• 2021

In this paper, we propose an efficient CNN application method by analyzing the effect of activation function on the failure diagnosis of the inductive motor stator. Generally, the main purpose of the inductive motor stator failure diagnosis is to prevent the failure by rapidly diagnosing the minute turn short. In the application of activation function, experiments show that the Sigmoid function is 23.23% more useful in accuracy of diagnosis than the ReLu function, although it is shown that ReLu has superiority in overall fixer failure in utilizing the activation function.

• Proceedings of the Korean Reliability Society Conference
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• 2001.06a
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• pp.239-244
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• 2001

Today, Ultrasonic is used as an important non-destructive test tool of semiconductor reliability evaluation and failure analysis. The semiconductor packaging trend goes to develop thin package, this trend makes difficult to inspect to defect in semiconductor package. One of the important problem in all semiconductor is moisture absorption in the atmosphere. This moisture causes crack or delamination to package when the semiconductor package is soldered on PCB. Reliability evaluation of semiconductor's object is investigating the effect of this moisture. For that reason, this study is investigating the effect of this moisture and reliability evaluation of semiconductor after preconditioning test and scanning acoustic microscope.