• Title/Summary/Keyword: semiconductor equipment

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A Study on Deterministic Utilization of Facilities for Allocation in the Semiconductor Manufacturing (반도체 설비의 효율성 제고를 위한 설비 할당 스케줄링 규칙에 관한 연구)

  • Kim, Jeong Woo
    • Journal of Korean Society of Industrial and Systems Engineering
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    • v.39 no.1
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    • pp.153-161
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    • 2016

  • Semiconductor manufacturing has suffered from the complex process behavior of the technology oriented control in the production line. While the technological processes are in charge of the quality and the yield of the product, the operational management is also critical for the productivity of the manufacturing line. The fabrication line in the semiconductor manufacturing is considered as the most complex part because of various kinds of the equipment, re-entrant process routing and various product devices. The efficiency and the productivity of the fabrication line may give a significant impact on the subsequent processes such as the probe line, the assembly line and final test line. In the management of the re-entrant process such as semiconductor fabrication, it is important to keep balanced fabrication line. The Performance measures in the fabrication line are throughput, cycle time, inventory, shortage, etc. In the fabrication, throughput and cycle time are the conflicting performance measures. It is very difficult to achieve two conflicting goal simultaneously in the manufacturing line. The capacity of equipment is important factor in the production planning and scheduling. The production planning consideration of capacity can make the scheduling more realistic. In this paper, an input and scheduling rule are to achieve the balanced operation in semiconductor fabrication line through equipment capacity and workload are proposed and evaluated. New backward projection and scheduling rule consideration of facility capacity are suggested. Scheduling wafers on the appropriate facilities are controlled by available capacity, which are determined by the workload in terms of the meet the production target.

  • https://doi.org/10.11627/jkise.2016.39.1.153 인용 PDF KSCI

Study on the Optical Analysis Equipment Control System for Electronic Parts Inspection (전자 부품 검사용 광학분석 장비 제어시스템에 대한 연구)

  • Lee, Jun Ha
    • Journal of the Semiconductor & Display Technology
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    • v.14 no.4
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    • pp.67-71
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    • 2015

  • Product of technology developed in this study is an external interface for controlling the equipment of pendant key remote control system circuit board, and it is used in the electronic component test equipment system. Main control system module is in the role as a device for controlling the various control devices that make up the integrated system for microscopic examination at the request of the host computer engineers to control the inspection equipment. The pentane-key interface module to its role as a device for controlling the various control devices that make up the integrated system for microscopic examination at the request of the host computer for the engineer to control the inspection equipment. Development of the control system can be expected in the configuration of a system for efficient and accurate inspection of high-precision parts.

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Characteristics of Electrostatic Attenuation in Semiconductor (반도체 소자의 정전기 완화특성)

  • 김두현;김상렬
    • Journal of the Korean Society of Safety
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    • v.14 no.3
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    • pp.69-77
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    • 1999

  • As the use of automatic handling equipment for sensitive semiconductor devices is rapidly increased, manufacturers of electronic components and equipment need to be more alert to the problem of electrostatic discharges(ESD). Semiconductor devices such as IC, LSI, VLSI become a high density pattern of being more fragile by ESD phenomena. One of the most common causes of electrostatic damage is the direct transfer of electrostatic charge from the human body or a charged material to the electrostatic discharge sensitive devices. Accordingly, characteristics of electrostatic attenuation in domestic semiconductor devices is investigated to evaluate the ESD phenomina in the semiconductors in this paper. The required data are obtained by Static Honestmeter. Also The results in this paper can be used for the prevention of semiconductor failure by ESD.

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