• 산업공학
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• 제21권2호
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• pp.151-160
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• 2008

Defect size distribution is a probability density function for the defects that occur on wafers or glasses during semiconductor/LCD fabrication. It is one of the most important information to estimate manufacturing yield using well-known statistical estimation methods. The defects are detected by automatic optical inspection (AOI) facilities. However, the data that is provided from AOI is not accurate due to resolution of AOI and its defect detection mechanism. It causes distortion of defect size distribution and results in wrong estimation of the manufacturing yield. In this paper, I suggest a size conversion method and a maximum likelihood estimator to overcome the vague defect size information of AOI. The methods are verified by the Monte Carlo simulation that is constructed as similar as real situation.

• 산업공학
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• 제9권3호
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• pp.225-235
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• 1996

The SECS Ⅰ and Ⅱ Protocol has been widely used for the TFT LCD and semiconductor industry. This paper shows how the SECS protocol is implemented for data communications between the Host (CAM) and the TFT LCD equipments. In addition, this study introduces a way to apply the SECS protocol to the manufacturing systems control. It provides better throughput in terms of production and faster control of the automated TFT LCD manufacturing system by way of shortcut and distribution of control and data communications. The SECS protocol is successfully used for the control of the real TFT LCD manufacturing system.

• 반도체디스플레이기술학회지
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• 제19권3호
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• pp.68-72
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• 2020

A new method for array testing of TFT-CD panel with the integrated gate driver circuits is presented. As larger size/high resolution TFT-LCD with the peripheral driver circuits has emerged, one of the important problems for manufacturing is array testing on the panel. This paper describes the technology of detecting defective arrays and optimizing the array testing process. For the effective characterization of pixel array, the pixel storage capability is simulated and measured with voltage imaging system. This technology permits full functional testing during the manufacturing process, enabling fabrication of large TFT-LCD panels with the integrated driver circuits.

• 한국안전학회지
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• 제25권1호
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• pp.27-31
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• 2010

It is a well known fact that the LCD and Semiconductor Devices are a central part of IT industry which is important in the present and the future. But the biggest problem of Semiconductor and LCD manufacturing is maintaining a cleaning room environment. For this reason, the soft X-ray type Ionizer was used as the electrostatic reducer device, which protects damage of the product against electrostatic discharge in the manufacturing process. Therefore it is a essential important factor during Semiconductor and LCD production process. But the soft X-ray has a intrinsic problem with harmful to human being in case of soft X-ray exposure. That's reason we have the research to solve above problem and made an apparatus that it was covered with shielding structure to protect X-ray radiation to outside. And besides, it has a possibility to eliminate the charged electrostatic in the narrow space through the slot for Ion emissions with dual soft X-ray sources on the both side. It is also not make the particles from itself when it has been operated.

• 반도체디스플레이기술학회지
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• 제9권3호
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• pp.59-63
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• 2010

This paper proposes computer visual inspection algorithms for various LCD defects which are found in a manufacturing process. Modular vision processing steps are required in order to detect different types of LCD defects. Those key modules include RGB filtering for pixel defects, gray-scale morphological processing and Hough transform for line defects, and adaptive threshold for spot defects. The proposed algorithms can give users detailed information on the type of defects in the LCD panel, the size of defect, and its location. The machine vision inspection system is implemented using C language in an embedded Linux system for a high-speed real-time image processing. Experiment results show that the proposed algorithms are quite successful.

• 산업공학
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• 제17권spc호
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• pp.131-140
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• 2004

The purpose of this paper is to develop and show the efficiency of the URL(Unload Request Logic) and LRL(Load Request Logic) of the dispatcher in the Fab(Fabrication) Manufacturing Execution System. These logics are the core procedures which control the material(wafer and glass substrate) flow efficiently in the semiconductor and LCD fab considering inter-bay as well as intra-bay material flow. We use the present and future status information of the system by look-ahead and the information about the future transportation schedule of Automated Guided Vehicles. The simulation results show that the URL and LRL presented in this paper reduce the average lead time, average and maximum WIP level, and the average available AGV waiting time.

• 한국기계가공학회지
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• 제12권5호
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• pp.163-169
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• 2013

The objective of this study is to replace labor intensive forging processes by an automated system. For achieving it, an exclusive mechanism that consists of a positioner, an arm, and a hanger is configured to handle hot forging objects. Also, a structural analysis is applied to the horizontal motion unit, which is the most highly loaded, in order to verify its validity. In addition, its possibility is also verified through identifying the performance of the proposed system before applying it to sites. As a result, the major characteristic items, such as positioning accuracy, material diameter, object traveling weight, product failure rate, and forging process rate, in this system are perfectly verified for applying it to manufacturing sites.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2006년도 제30회 학술논문발표회 초록집
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• pp.101-101
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• 2006

• 대한산업공학회지
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• 제29권1호
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• pp.1-13
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• 2003

In this paper, LAC(Look-ahead AGV Controller) has been developed for efficient routing of parts in semiconductor and LCD production systems. Several procedures have been developed as sub-modules. LACP(Look-ahead AGV Control Procedure) which controls AGVs using the information on the current and future status of the systems is the main element of the LAC. To support LACP, DSP(Destination Selection Procedure) which determines a destination of a part and AGV call time, SSP(Source Selection Procedure)which selects a part coming next to a buffer when the buffer becomes available. and RTM(Response Time Model) which estimates empty travel time of AGVs and waiting time for an available AGV have been developed. A simulation experiment shows that LAC reduces part's flow time, AGV utilization, average and maximum inventory level of a central buffer, empty travel time of an AGV, and waiting time for an available AGV.

• 대한산업공학회지
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• 제26권3호
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• pp.238-248
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• 2000

Facilities are getting more automated and informative in modern manufacturing systems, especially in semiconductor and LCD plants. These systems keep a great deal of such information on its current and near-future status as the arrival time and job completion time of their parts. This paper presents an efficient policy for AGV and part routing using information on the future status of the system where AGVs are playing a central role for material handling. Efficient control of AGVs is very important because AGV systems often become the bottleneck and limit the total production capacity of a very expensive plant. The cell controller records the future events chronologically in Next Event Schedule, and uses this list to determine to which place the AGVs and parts to be sent.