• Korean Journal of Materials Research
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• v.9 no.4
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• pp.349-354
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• 1999

The temperature dependences of the Hall coefficient, carrier mobility, electrical resistivity, Seebeck coefficient, thermal conductivity, and figure-of-merit of the undoped and $CdI_2$-doped 90% $Bi_2Te_3-10% Bi_2Se_3$, single crystals, grown by the Bridgman method, have been characterized at temperatures ranging from 77K to 600K. The saturated carrier concentration and degenerate temperature of the undoped 90% $Bi_2Te_3-10% Bi_2Se_3$ single crystal are $5.85\times10_{18}cm^{-3}$ and 127K, respectively. The scattering parameter of the 90% $Bi_2Te_3-10% Bi_2Se_3$ single crystal is determined to b -0.23, and the electron mobility to hole mobility ratio ($\mu_e/\mu_h)$ is 1.45. The bandgap energy at 0K of the 90% <$Bi_2Te_3-10% Bi_2Se_3$ single crystal is 0.200 eV. Adding $CdI_2$as a donor dopant, a maximum figure-of-merit of $3.2\times10^{-3}/K$$CdI_2$-doped specimen.

• Journal of the Korean Crystal Growth and Crystal Technology
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• v.23 no.3
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• pp.135-141
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• 2013

Mechanical alloying was carried out to produce $CrSi_2$ thermoelectric compound using a mixture of elemental $Cr_{33}Si_{67}$ powders. An optimal milling and heat treatment conditions to obtain the single phase of $CrSi_2$ compound with fine microstructure were investigated by X-ray diffraction and differential scanning calorimetry measurement. $CrSi_2$ intermetallic compound with a grain size of 70 nm could be obtained by MA of $Cr_{33}Si_{67}$ powders for 70 hours and subsequently annealed at $650^{\circ}C$. Consolidation of the MA powders was performed in a spark plasma sintering (SPS) machine using graphite dies at $600{\sim}1000^{\circ}C$ under 60 MPa. The shrinkage of MA samples during SPS consolidation process increased gradually with increasing temperature up to $1000^{\circ}C$ and relatively significant at about $600^{\circ}C$. We tend to believe that these behaviors are deeply related to form a $CrSi_2$ compound during heating process, as can be realized from the DSC measurement. Electrical conductivity and Seebeck coefficient of sintered bodies were measured up to $900^{\circ}C$. Seebeck coefficient and power factor of $Cr_{33}Si_{67}$ compact prepared by MA and SPS at $1000^{\circ}C$ showed the maximum value of $125{\mu}V/K$ at $400^{\circ}C$ and $4.3{\times}10^{-4}W/mK^2$ at $350^{\circ}C$, respectively.

• Journal of the Microelectronics and Packaging Society
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• v.18 no.4
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• pp.33-38
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• 2011

The p-type $(Bi_{0.2}Sb_{0.8})_2Te_3$ powers were fabricated by mechanical alloying and hot-pressed at temperatures of $350{\sim}550^{\circ}C$. Themoelectric properties of the hot-pressed $(Bi_{0.2}Sb_{0.8})_2Te_3$ were characterized as a function of the hot-pressing temperature. With increasing the hot-pressing temperature from $350^{\circ}C$ to $550^{\circ}C$, the Seebeck coefficient and the electrical resistivity decreased from 237 ${\mu}V/K$ to 210 ${\mu}V/K$ and 2.25 $m{\Omega}-cm$ to 1.34 $m{\Omega}-cm$, respectively. The power factor of the hot-pressed $(Bi_{0.2}Sb_{0.8})_2Te_3$ became larger from $24.95{\times}10^{-4}W/m-K^2$ to $32.85{\times}10^{-4}W/m-K^2$ with increasing the hot-pressing temperature from $350^{\circ}C$ to $550^{\circ}C$. Among the specimens hot-pressed at $350{\sim}550^{\circ}C$, the $(Bi_{0.2}Sb_{0.8})_2Te_3$ hot-pressed at $500^{\circ}C$ exhibited the maximum dimensionless figure-of-merit of 1.09 at $25^{\circ}C$ and 1.2 at $75^{\circ}C$.

• Journal of the Microelectronics and Packaging Society
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• v.14 no.2 s.43
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• pp.9-15
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• 2007

Thermoelectric properties of the electrodeposited Bi-Te films and photoresist process have been investigated to apply for thermoelectric thin film devices. After plating in Bi-Te solutions of 20 mM concentration, which were prepared by dissolving $Bi_2O_3$ and $TeO_2$ into 1M $HNO_3$, thermoelectric properties of the films were characterized with variation of the Te/(Bi+Te) ratio in a plating solution. With increasing the Te/(Bi+Te) ratio in the plating solution from 0.5 to 0.65, Seebeck coefficient of Bi-Te films changed from $-59{\mu}V/K$ to $-48{\mu}V/K$ and electrical resistivity was lowered from $1m{\Omega}-cm$ to $0.8m{\Omega}-cm$ due to the increase in the electron concentration. Maximum power factor of $3.5{\times}10^{-4}W/K^2-m$ was obtained for the Bi-Te film with the $Bi_2Te_3$ stoichiometric composition. Using multilayer overhang process, the photoresist pattern to form thermoelectric legs of 30 m depth and 100m diameter was successfully fabricated fur micro thermoelectric device applications.

• Journal of the Microelectronics and Packaging Society
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• v.15 no.1
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• pp.1-6
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• 2008

Thermoelectric properties of calcium cobalt layer structure oxide system, $Ca_3Co_2O_6$ and $Ca_3Co_4O_9$ were investigated at the temperature range of 300 to 1000K for the application of thermoelectric generation. In the composition, the Ca site was partially substituted with Bi, Sr, La, K and the Co site was partially substituted with Mn, Fe, Ni, Cu, Zn. The thermoelectric properties of Bi substituted $Ca_3Co_4O_9$. $Ca_{2.7}Bi_{0.3}Co_4O_9$ for electrical conductivity, Seebeck coefficient and power factor were $85.4({\Omega}$cm)^{-l}, $176.2{\mu}V/K$ and $265.2{\mu}W/K^m$, respectively. The unit thermoelectric couple was fabricated with the p-type of $Ca_{2.7}Bi_{0.3}Co_4O_9$ and n-type ($Zn_{0.98}Al_{0.02}$)O thermoelectrics whose figure-of-merit(Z) were $0.87{\times}10^{-4}/K$ and $0.41{\times}10^4/K$, respectively. The generated thermoelectric power was about 30mV at the temperature difference of 120K in the unit thermoelectric couple.

• Journal of the Microelectronics and Packaging Society
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• v.17 no.3
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• pp.51-57
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• 2010

Thermoelectric properties of the p-type $(Bi,Sb)_2Te_3$, hot-pressed with the $(Bi,Sb)_2Te_3$ powders fabricated by melting/grinding method, were characterized with variation of the hot-pressing conditions. Thermoelectric characteristics of the hot-pressed $(Bi,Sb)_2Te_3$ were also analyzed with addition of $ZrO_2$ as nano inclusions. With increasing the hotpressing temperature from $350^{\circ}C$ to $550^{\circ}C$, Seebeck coefficient and electrical resistivity decreased from 275 ${\mu}V$/K to 230 ${\mu}V$/K and 6.68 $m{\Omega}$-cm to 1.86 $m{\Omega}$-cm, respectively. The power factor decreased with addition of $ZrO_2$ nano powders more than 1 vol%, implying that the optimum amount of $ZrO_2$ nano inclusions to get a maximum power factor would be less than 1 vol%.

• Korean Journal of Materials Research
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• v.8 no.11
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• pp.1055-1060
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• 1998

Thermoelectric properties of ($Pb_{1-x}Sn_x$)Te ($0\leq{x}\leq{0.4}$) alloys, fabricated by mechanical alloying and hot pressing, were investigated with variation of the SnTe content. For the hot-pressed PbTe and ($Pb_{0.9}Sn_{0.1}$)Te. transition from p-type to n-type occurred at $200^{\circ}C$ and $300^{\circ}C$, respectively. However, the specimens containing SnTe more than 0.2mole exhibited p-type conduction up to 450'C. In extrinsic conduction region, the Seebeck coefficient and electrical resistivity of the hot-pressed ($Pb_{1-x}Sn_x$)Te decreased with increasing the SnTe content. The temperature at which the hot-pressed (Pbl-,Sn,)Te exhibited a maximum figure-of-merit was shifted to higher temperature with increasing the SnTe content The hot-pressed (Pbo ,Sno dTe exhibited a maximum figure-of-merit of $0.68\times10_{-3}/K$ at $200^{\circ}C$.

• Korean Journal of Materials Research
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• v.7 no.1
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• pp.81-88
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• 1997

Vanadate glasses using $B_2O_3$ as a network former and with CuO additive were mainly investigated in relation to electrical properties. Crystalline phases formed by heat-treatment in each composition were examined and dc electrical conductivity changes of the glasses were analyzed. Crystalline phases were identified as $V_3O_5,\;a-CuV_2O_6\;and\;{\beta}-CuV_2O_6$ by XRD analysis. Crystallization degrees of $V_2O_5$ and ${\beta}-CuV_2O_6$ were little changed with heat-treatment time, but those of ${\alpha}u-CuV_2O_6$ were changed sharply with heat-treatment time. The more crystallization of ${\alpha}u-CuV_2O_6$ occurred, the higher electrical conductivity was observed. Electrical conductivities with $10^{-2}~10^{-4}/{\Omega}/cm$ at room temperature(303K) could be obtained by controlling the glass compositions. The electrical conductivities were increased with increasing of $V_20_5$ content and decreasing of alkality($CuO/B_2O_3$). In this study, electron was proved to be charge carrier by seebeck coefficient measurement. Accordingly, the glasses are believed to be n-type semiconductor. Calculated activation energies for the conduction were in the range 0.098-0.124 eV. Electrical conduction mechanism was small polaron hopping without showing variable range hopping in the temperature range $30~200^{\circ}C$.

• Journal of Sensor Science and Technology
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• v.12 no.3
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• pp.103-111
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• 2003

A chromel-alumel thermoelectric flow sensor using $Si_3N_4/SiO_2/Si_3N_4$ thermal isolation membrane was fabricated. Temperature coefficient of resistance of thin film Pt-heater was about $0.00397/^{\circ}C$, and Seebeck coefficient of chromel-alumel thermocouple was about $36\;{\mu}V/K$. The sensor showed that thermoelectric voltage decreased as thermal conductivity of gas increased, and $N_2$-flow sensitivity increased as heater voltage increased or the distance between heater and thermocouple decreased. When heater voltage was about 2.5 V, $N_2$-flow sensitivity and thermal response time of the sensor were about $1.5\;mV/sccm^{1/2}$ and 0.18 sec., respectively. Linear range in flow sensitivity of the flow sensor was wider than that of Bi-Sb flow sensor.

• Journal of Sensor Science and Technology
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• v.5 no.6
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• pp.51-59
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• 1996

A flow sensor has been fabricated by preparing thin film Pt-heater and Bi-Sb thermocouples array on 150 nm-$Si_{3}N_{4}$/300 nm-$SiO_{2}$/150 nm-$Si_{3}N_{4}$ dielectric diaphragm which has low thermal conductivity and balanced stress with silicon substrate for the purpose of improving the thermal isolation between heater and silicon substrate. Pt-heater showed nonlinear I-V characteristics due to the thermal isolation effect of the diaphragm. Its temperature coefficient of resistance was about $0.00378\;/^{\circ}C$ and Seebeck coefficient of Bi-Sb thermocouple was about $97\;{\mu}V/K$. The sensor showed that thermoelectric voltage decreased as thermal conductivity of gas increased, and flow sensitivity increased as heater voltage increased or as the distance between heater and thermocouple decreased. When heater voltage was about 2.5 V, $N_{2}$-flow sensitivity and thermal response time of the sensor were about $1.27\;mV{\cdot}(sccm)^{-1/2}$ and 0.13 sec., respectively.