• 제목/요약/키워드: secondary ion mass spectroscopy

검색결과 145건 처리시간 0.027초

습식 화학 공정에 의한 태양전지로부터 고순도 실리콘 회수 및 이를 이용한 태양전지 재제조 (Photovoltaic Performance of Crystalline Silicon Recovered from Solar Cell Using Various Chemical Concentrations in a Multi-Stage Process)

  • 노민호;이준규;안영수;여정구;이진석;강기환;조철희
    • 한국재료학회지
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    • 제29권11호
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    • pp.697-702
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    • 2019
  • In this study, using a wet chemical process, we evaluate the effectiveness of different solution concentrations in removing layers from a solar cell, which is necessary for recovery of high-purity silicon. A 4-step wet etching process is applied to a 6-inch back surface field(BSF) solar cell. The metal electrode is removed in the first and second steps of the process, and the anti-reflection coating(ARC) is removed in the third step. In the fourth step, high purity silicon is recovered by simultaneously removing the emitter and the BSF layer from the solar cell. It is confirmed by inductively coupled plasma mass spectroscopy(ICP-MS) and secondary ion mass spectroscopy(SIMS) analyses that the effectiveness of layer removal increases with increasing chemical concentrations. The purity of silicon recovered through the process, using the optimal concentration for each process, is analyzed using inductively coupled plasma atomic emission spectroscopy(ICP-AES). In addition, the silicon wafer is recovered through optimum etching conditions for silicon recovery, and the solar cell is remanufactured using this recovered silicon wafer. The efficiency of the remanufactured solar cell is very similar to that of a commercial wafer-based solar cell, and sufficient for use in the PV industry.

Neutron Radiography를 이용한 고탄소흑연강에서 붕소 분석 (Boron Analysis in High Carbon Graphitized Steel using Neutron Autoradiography)

  • 우기도;양창호;박희찬;이창희;심철무;장진성;김현경
    • 한국재료학회지
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    • 제11권12호
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    • pp.1074-1079
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    • 2001
  • To study the distribution of boron and the boron effect for nucleation of graphite in high carbon steel, neutron induced autoradiography method is used. High carbon steel is easy to make the graphitization by addition of boron. It is easy to analysis of boron distribution using neutron radiography with neutron fluence of $1.9$\times${\times}10^{13}/cm^2$in the boron added high carbon steel. By the neutron induced autoradiography technique, it was found that the distribution of boron depended on boron content, graphitiging temperature and time. And by the analysis of secondary ion mass spectroscopy (SIMS) and electron probe micro analysis (EPMA), boron or boride were acted at nucleation site of graphite in high carbon steel.

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Analysis of Schottky Barrier Height in Small Contacts Using a Thermionic-Field Emission Model

  • Jang, Moon-Gyu;Lee, Jung-Hwan
    • ETRI Journal
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    • 제24권6호
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    • pp.455-461
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    • 2002
  • This paper reports on estimating the Schottky barrier height of small contacts using a thermionic-field emission model. Our results indicate that the logarithmic plot of the current as a function of bias voltage across the Schottky diode gives a linear relationship, while the plot as a function of the total applied voltage across a metal-silicon contact gives a parabolic relationship. The Schottky barrier height is extracted from the slope of the linear line resulting from the logarithmic plot of current versus bias voltage across the Schottky diode. The result reveals that the barrier height decreases from 0.6 eV to 0.49 eV when the thickness of the barrier metal is increased from 500 ${\AA}$ to 900 ${\AA}$. The extracted impurity concentration at the contact interface changes slightly with different Ti thicknesses with its maximum value at about $2.9{\times}10^{20}\;cm^{-3}$, which agrees well with the results from secondary ion mass spectroscopy (SIMS) measurements.

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$CF_4$/Ar 플라즈마에 의한 BST 박막 식각 특성 (Etching Characteristics BST Thin Film in $CF_4$/Ar Plasma)

  • 김동표;김창일;서용진;이병기;장의구
    • 한국전기전자재료학회:학술대회논문집
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    • 한국전기전자재료학회 2001년도 하계학술대회 논문집
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    • pp.866-869
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    • 2001
  • In this study, (Ba,Sr)TiO$_3$(BST) thin films were etched with a magnetically enhanced inductively coupled plasma(MEICP). Etching characteristics of BST thin films including etch rate and selectivity were evaluated as a function of the etching parameters such as gas mixing ratio, rf power, dc bias voltage and chamber pressure. The maximum etch rate of the BST films was 1700 $\AA$/min at Ar(90)/CF$_4$(10), 600 W/350 V and 5 mTorr. The selectivity of BST to PR was 0.6, 0.7, respectively. To analyze the composition of surface residue remaining after the etching, samples etched with different CF$_4$/Ar gas mixing ratio were investigated with X-ray photoelectron spectroscopy (XPS) and secondary ion mass spectrometry (SIMS). From the results of XPS and SIMS, there are chemical reaction between Ba, Sr, Ti and C, F radicals during the etching and remained on the surface.

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rf 마그네트론 스퍼터링으로 증착한 Mg-doped Zinc Tin Oxide막의 특성에 미치는 산소의 영향 (Effects of Oxygen on the Properties of Mg-doped Zinc Tin Oxide Films Prepared by rf Magnetron Sputtering)

  • 박기철;마대영
    • 한국전기전자재료학회논문지
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    • 제26권5호
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    • pp.373-379
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    • 2013
  • Mg-doped zinc tin oxide (ZTO:Mg) thin films were prepared on glasses by rf magnetron sputtering. $O_2$ was introduced into the chamber during the sputtering. The optical properties of the films as a function of oxygen flow rate were studied. The crystal structure, elementary properties, and depth profiles of the films were investigated by X-ray diffraction (XRD), x-ray photoelectron spectroscopy (XPS), and secondary ion mass spectrometry (SIMS), respectively. Bottom-gate transparent thin film transistors were fabricated on $N^+$ Si wafers, and the variation of mobility, threshold voltage etc. with the oxygen flow rate were observed.

Mono-layer Compositional Analysis of Surface of Mineral Grains by Time-of-Flight Secondary-Ion Mass Spectrometry (TOF-SIMS).

  • 김주영;;공봉성
    • 한국광물학회:학술대회논문집
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    • 한국광물학회.한국암석학회 2005년도 공동학술발표회 논문집
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    • pp.50-57
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    • 2005
  • Although the bulk composition of materials is one of the major considerations in extractive metallurgy and environmental science, surface composition and topography (edges and dislocations are preferred sites for physicochemical reactions) control surface reactivity, and consequently play a major role in determining metallurgical phenomena and pollution by heavy metals and organics. An understanding of interaction mechanisms of different chemical species with the mineral surface in an aqueous media is very important in natural environment and metallurgical processing. X-ray photoelectron spectroscopy (XPS) has been used as an ex-situ analytical technique, but the material to be analyzed can be any size from $100{\mu}m$ up to about 1 cm. It can also measure mixed solids powders, but it is impossible to ascertain the original source of resulting x-ray signals where they were emitted from, since it radiates and scans the macro sample surface area.

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Compositional SIMS Depth Profiling of CIGS film

  • 김경중;황혜현;장종식;정용덕
    • 한국진공학회:학술대회논문집
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    • 한국진공학회 2011년도 제40회 동계학술대회 초록집
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    • pp.367-367
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    • 2011
  • CIGS solar cell with copper, indium, gallium and selenium is a second generation solar cells for the lowering of the manufacturing cost. The relative ratio of the four elements is one of the most important measurement issues because the photovoltaic property of CIGS solar cell depends on the crystalline structure of the CIGS layer. However, there is no useful analysis method for the composition of the CIGS layer. Recently, AES depth profiling analysis of CIGS films has been studied with a reference material certified by inductively coupled plasma optical emission spectroscopy. However, there are some problems in AES depth profiling analysis of CIGS films. In this study, the in-depth profiling analysis was investigated by secondary ion mass spectrometry (SIMS) depth profiling analysis. We will present the compositional depth profiling of CIGS films by SIMS and its applications for the development of CIGS solar cells with high efficiency.

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완화형 강유전체$Pb(Mg_{1/3}Nb_{2/3})O_{3}-PbTiO_3$ 단결정의 광 집적소자 응용을 위한 도파로 제작 (Waveguides Fabrication for Optical Integrated Devices Application on Relaxor-ferroelectric $Pb(Mg_{1/3}Nb_{2/3})O_{3}-PbTiO_3$Single Crystal)

  • 양우석;이상구;구경환;허현;윤대호;이한영
    • 한국전기전자재료학회:학술대회논문집
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    • 한국전기전자재료학회 2002년도 추계학술대회 논문집 Vol.15
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    • pp.546-547
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    • 2002
  • Ni thin film on the PMN-PT crystal wafer were deposited by using E-beam evaporator technique. Deposited film was patterned by UV-lithography and etching and was in-diffused at 300~600C. Diffusion profile of Ni ions in PMN-PT was measured by secondary ion mass spectroscopy (SIMS).

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구리 확산에 대한 Pt/Ti 및 Ni/Ti 확산 방지막 특성에 관한 연구 (A Study on the Diffusion Barrier Properties of Pt/Ti and Ni/Ti for Cu Metallization)

  • 장성근
    • 한국전기전자재료학회논문지
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    • 제16권2호
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    • pp.97-101
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    • 2003
  • New Pt/Ti and hi/Ti double-metal structures have been investigated for the application of a diffusion barrier between Cu and Si in deep submicron integrated circuits. Pt/Ti and Ni/Ti were deposited using E-beam evaporator at room temperature. The performance of Pt/Ti and Ni/Ti structures as diffusion barrier against Cu diffusion was examined by charge pumping method, gate leakage current, junction leakage current, and SIMS(secondary ion mass spectroscopy). These evaluation indicated that Pt/Ti(200${\AA}$/100${\AA}$) film is a good barrier against Cu diffusion up to 450$^{\circ}C$.

Ramping up 조건에 따른 four-step RTP공정의 효과 (Effects of a four-step rapid thermal annealing process on the condition of ramping up)

  • 이현기;김남훈;이우선;김상용;장의구
    • 대한전기학회:학술대회논문집
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    • 대한전기학회 2006년도 제37회 하계학술대회 논문집 C
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    • pp.1424-1425
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    • 2006
  • A four-step rapid thermal annealing (RTA) process is proposed in order to improve the throughput and stabilize the process, compared to the six-step RTA process. Effects of annealing on the properties of a structure mode of CMOS process in both cases were investigated. The implanted dopant(As, $BF_2$ and Ti/TiN) movement in silicon during different rapid thermal annealing conditions was studied using secondary ion mass spectroscopy (SIMS) technique. These results show that the four-step RTA process significantly improves time effect and throughput (15%) by the condition of ramping up compared to the six-step RTA process.

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