• Title/Summary/Keyword: secondary ion mass spectroscopy

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Structural and component characterization of the B4C neutron conversion layer deposited by magnetron sputtering

  • Jingtao Zhu;Yang Liu;Jianrong Zhou;Zehua Yang;Hangyu Zhu;Xiaojuan Zhou;Jinhao Tan;Mingqi Cui;Zhijia Sun
    • Nuclear Engineering and Technology
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    • v.55 no.9
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    • pp.3121-3125
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    • 2023
  • Neutron conversion detectors that use 10B-enriched boron carbide are feasible alternatives to 3He-based detectors. We prepared boron carbide films at micron-scale thickness using direct-current magnetron sputtering. The structural characteristics of natural B4C films, including density, roughness, crystallization, and purity, were analyzed using grazing incidence X-ray reflectivity, X-ray diffraction, X-ray photoelectron spectroscopy, time-of-flight secondary ion mass spectrometry, and scanning electron microscopy. A beam profile test was conducted to verify the practicality of the 10B-enriched B4C neutron conversion layer. A clear profile indicated the high quality of the neutron conversion of the boron carbide layer.

Study on Electrical Activation of As Ion Implanted Si(100) (As 이온이 주입된 단결정 실리콘(100)의 전기적 활성화 연구)

  • 이동건;문영희;손정식;손정식;김동렬;배인호;김말문;한병국;정광화
    • Journal of the Korean Vacuum Society
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    • v.4 no.1
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    • pp.104-108
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    • 1995
  • Hall 효과 측정을 이용하여 As+이 주입된 다결정 실리콘의 열처리 조건에 따른 활성화 과정을 연구하였다. 주입된 이온의 농도 분포는 SIMS(Secondary Ion Mass Spectroscopy)와 SUPREMIV 모의 실험으로 조사하였다. 열처리 온도가 증가함에 따라 활성층의 전자 면 농도 증가가 뚜렷이 나타났으며, Hall 이동도의 온도 의존성 측정으로 주입된 도우즈에 따라 이온 주입층의 활성화에 필요한 열처리 온도가 달라져야함을 알 수 있었다. 그리고, 접합 손실전류의 감소는 $800^{\circ}C$(30분)의 열처리에서 현저하게 나타났다.

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Etching Mechanism of $YMnO_3$ Thin Films in High Density $CF_4$/Ar Plasma ($CF_4$/Ar 가스 플라즈마를 이용한 $YMnO_3$ 박막의 식각 반응연구)

  • 김동표;김창일;이철인
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.14 no.12
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    • pp.959-964
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    • 2001
  • We investigated the etching characteristics of YMnO$_3$ thin films in high-density plasma etching system. In this study, YMnO$_3$ thin films were etched with CF$_4$/Ar gas chemistries in inductively coupled plasma(ICP). Etch rates of YMnO$_3$ increased up to 20% CF$_4$ in CF$_4$/(CF$_4$+Ar), but decreased with furthermore increasing CF$_4$ in CF$_4$/(CF$_4$+Ar). In optical emission spectroscopy (OES) analysis, F radical and Ar* ions in plasma at various gas chemistries decreased with increasing CF$_4$ content. Chemical states of YMnO$_3$ films exposed in plasma were investigated with x-ray photoelectron spectroscopy (XPS) and secondary ion mass spectrometry (SIMS). There is a chemical reaction between metal (Y, Mn) and F and metal-fluorides were removed effectively by Ar ion sputtering. YF$_{x}$, MnF$_{x}$ such as YF, YF$_2$, YF$_3$ and MnF$_3$ were detected using SIMS analysis. The etch slope is about 65$^{\circ}$ and cleasn surface. surface of the etched YMnO$_3$ thin films was investigated with X-ray photoelectron spectroscopy (XPS) and secondary ion mass spectrometry (SIMS). The etch profile was also investigated by scanning electron microscopy (SEM).EM).

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Label-free NanoBio Imaging for New Biology and Medical Science

  • Moon, Dae Won
    • Applied Science and Convergence Technology
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    • v.24 no.6
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    • pp.203-214
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    • 2015
  • We have been developing a new label-free nanobio imaging platform using non-linear optics such as Coherent Anti-Stokes Raman Spectroscopy (CARS) and ion beam techniques based on sputtering and scattering such as Secondary Ion Mass Spectrometry (SIMS) and Medium Energy Ion Scattering Spectroscopy (MEIS), which have been widely used for atomic and molecular level analysis of semiconductors and nanomaterials. To apply techniques developed for semiconductors and nanomaterials for biomedical applications, the convergence of nano-analysis and biology were tried. Our activities on label-free nanobio imaging during the last decade are summarized in this review about non-linear optical 3D imaging, ellipsometric interface imaging, SIMS imaging, and TOF-MEIS nano analysis for cardiovascular tissues, collagen thin films, peptides on microarray, nanoparticles, and cell adhesion studies and finally the present snapshot of nanobio imaging and the future prospect are described.

Characteristics of reoxidation of nitried oxide for gate dielectric of charge trapping NVSM (전하트랩형 NVSM의 게이트 유전막을 위한 질화산화막의 재산화특성에 관한 연구)

  • 이상은;한태현;서광열
    • Journal of the Korean Crystal Growth and Crystal Technology
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    • v.11 no.5
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    • pp.224-230
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    • 2001
  • The characteristics of $NO/N_2O$ annealed reoxidized nitrided oxide being studied as super thin gate oxide and gate dielectric layers of Non-Volatile Semiconductor Memory (NVSM) were investigated by Dynamic Secondary Ion Mass Spectrometry (D-SIMS), Time-of-Flight Secondary Ion Mass Spectrometry (ToF-SIMS), and Auger Electron Spectroscopy (AES). The specimen was annealed by $NO/N_2O$ after initial oxide process and then rcoxidized for nitrogen redistribution in nitrided oxide. Out-diffusion of incorporated nitrogen during the wet oxidation in reoxidation process took place more strongly than that of the dry oxidation. It seems to indicate that hydrogen plays a role in breaking the Si N bonds. As reoxidation proceeds, incorporated nitrogen of $NO/N_2O$ annealed nitrided oxide is obsen-ed to diffuse toward the surface and substrate at the same time. ToF-SIMS results show that SiON species are detected at the initialoxide interface, and Si,NO species near the new $Si_2NO$ interface that formed after reoxidation. These SiON and $Si_2NO$ species most likely to relate to the origin of the state of memory charge traps in reoxidized nitrided oxide, because nitrogen dangling bonds of SiON and silicon dangling bonds of $Si_2NO$ are contained defects associated with memory effect.

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Applications of Ar Gas Cluster Ion Beam Sputtering to Ta2O5 thin films on SiO2/Si (100)

  • Park, Chanae;Chae, HongChol;Kang, Hee Jae
    • Proceedings of the Korean Vacuum Society Conference
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    • 2015.08a
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    • pp.119-119
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    • 2015
  • Ion beam sputtering has been widely used in Secondary Ion Mass Spectrometry (SIMS), X-ray Photoelectron Spectroscopy (XPS), and Auger Electron Spectroscopy (AES) for depth profile or surface cleaning. However, mainly due to severe matrix effects such as surface composition change from its original composition and damage of the surface generated by ion beam bombardment, conventional sputtering skills using mono-atomic primary ions with energy ranging from a few hundred to a thousand volts are not sufficient for the practical surface analysis of next-generation organic/inorganic device materials characterization. Therefore, minimization of the surface matrix effects caused by the ion beam sputtering is one of the key factors in surface analysis. In this work, the electronic structure of a $Ta_2O_5$ thin film on $SiO_2/Si$ (100) after Ar Gas Cluster Ion Beam (GCIB) sputtering was investigated using X-ray photoemission spectroscopy and compared with those obtained via mono-atomic Ar ion beam sputtering. The Ar ion sputtering had a great deal of influence on the electronic structure of the oxide thin film. Ar GCIB sputtering without sample rotation also affected the electronic structure of the oxide thin film. However, Ar GCIB sputtering during sample rotation did not exhibit any significant transition of the electronic structure of the $Ta_2O_5$ thin films. Our results showed that Ar GCIB can be useful for potential applications of oxide materials with sample rotation.

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Cutting Characteristics of Plasma Source Son Implanted Tungsten Carbide Tool (플라즈마 이온주입에 의해 표면 개질한 초경공구의 가공특성)

  • Kang, Seong-Ki;Wang, Duck-Hyun;Kim, Won-Il
    • Journal of the Korean Society for Precision Engineering
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    • v.27 no.1
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    • pp.33-40
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    • 2010
  • In this research, the effects for surface Improvement of plasma ion implanted carbide endmill tools were observed by measuring cutting forces and tools wear affecting surface roughness in high speed cutting. From the 2nd ion mass analysis, the oxidation layer was found to be built up by sputtering. The residual gas contamination of oxygen was found to be contained impurities in nitrogen gas. The plasma implanted ion was found to be spreaded, especially the nitrogen was implanted up to 150nm depth as impressed voltage and ion implanting time. It is analyzed as bring surface improvement by spreading deeply forming oxidation on surface. The factors in Analysis of Variance(ANOVA) about mutuality cause reference of cutting force. The cutting force Fx is affected by the interaction of spindle rpm and federate, the cutting force Fy is influenced by spindle rpm and time injected ion, and cutting force Fz is affected by the interaction of impressed voltage and feedrate. Also, it was found that the cutting forces of implanted tools become lower and the surface roughness is improved by the effect of nitrogen according to the implantation.

A study on Ultrashallow PN junction formation by boron implantation in Silicon (실리콘에 Boron 이온 주입에 의한 Ultrashallow PN접합 형성에 관한 연구)

  • 김동수;정원채
    • Proceedings of the IEEK Conference
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    • 2000.06b
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    • pp.56-59
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    • 2000
  • In this paper, we have made a comparison between secondary ion mass spectroscopy(SIMS) data by the 5kcV-15keV boron implantation and computer simulation results. In order to make electrical activation of implanted carriers, thermal annealing are carried out by RTP method for 30s at 1000$^{\circ}C$ Two dimensional doping concentration distribution from different mask dimensions under inert gas annealing, dry-, and wet-oxidation condition were calculated and simulated with microtec simulator.

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A Study on the Memory Trap Analysis and Programming Characteristics of Reoxidized Nitrided Oxide (재산화 질화산화막의 기억트랩 분석과 프로그래밍 특성)

  • 남동우;안호명;한태현;이상은;서광열
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.15 no.7
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    • pp.576-582
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    • 2002
  • Nonvolatile semiconductor memory devices with reoxidized nitrided oxide(RONO) gate dielectrics were fabricated, and nitrogen distribution and bonding species which contribute to memory characteristics were analyzed. Also, memory characteristics of devices depending on the anneal temperatures were investigated. The devices were fabricated by retrograde twin well CMOS processes with $0.35\mu m$ design rule. The processes could be simple by in-situ process in growing dielectric. The nitrogen distribution and bonding states of gate dielectrics were investigated by Dynamic Secondary Ion Mass Spectrometry(D-SIMS), Time-of-Flight Secondary Ion Mass Spectrometry(ToF-SIMS), and X-ray Photoelectron Spectroscopy(XPS). As the nitridation temperature increased, nitrogen concentration increased linearly, and more time was required to form the same reoxidized layer thickness. ToF-SIMS results showed that SiON species were detected at the initial oxide interface which had formed after NO annealing and $Si_2NO$ species within the reoxidized layer formed after reoxidation. As the anneal temperatures increased, the device showed worse retention and degradation properties. It could be said that nitrogen concentration near initial interface is limited to a certain quantity, so the excess nitrogen is redistributed within reoxidized layer and contribute to electron trap generation.

Database for Surface Analysis

  • Yoshitake, Michiko;Yoshihara, Kazuhiro
    • Proceedings of the Korean Vacuum Society Conference
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    • 1996.02a
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    • pp.161-161
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    • 1996
  • Recently, the role of the surface analysis on the development of advanced materials has become larger and larger as the surface compositions of these materials is the key of their performances. Especially three techniques, Auger electron spectroscopy, X- ray photoelectron spectroscopy and secondary ion mass spectroscopy are widely used in technology fields. However, because of the relatively short history of these techniques(thirty years or so), there has been no accumulation of data commonly available, physical parameters for analysis have not been established and there has been no standard data. With these background, the VAMAS projects which aims to standardize the manner in the field of these techniques has started in 1982 at Versailles Summit. Along the projects, we have conducted the international collaborating study on the sharing of spectral data. In 1994, the Science and Technology Agency of Japan began the project on computer network, on which our fruits from the study on spectral data sharing is boarded.(omitted)mitted)

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