• Proceedings of the IEEK Conference
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• 2000.06b
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• pp.32-35
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• 2000

Oxide-nitride-oxide(ONO) structures were formed by sequential radio frequency reactive magnetron sputtering method. The chemical composition and structure of these films were studied by using of secondary ion mass spectroscopy(SIMS) and Auger electron spectroscopy(AES) SIMS and AES experiments show the existence of nitridation at the SiO$_2$/Si substrate. The electrical characteristics of ONO films were evaluated by I-V and high frequency C-V measurements When the ONO films were annealed at 90$0^{\circ}C$ for 30 sec in $N_2$ ambient, the breakdown voltage increased and flat-band voltage decreased under high electric field.

• Korean Journal of Materials Research
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• v.29 no.2
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• pp.97-105
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• 2019

In the current steel structures of high-rise buildings, high heat input welding techniques are used to improve productivity in the construction industry. Under the high heat input welding, however, the microstructures of the weld metal (WM) and heat-affected zone (HAZ) coarsen, resulting in the deterioration of impact toughness. This study focuses mainly on the effects of fine TiN precipitates dispersed in steel plates and B addition in welding materials on grain refinement of the HAZ microstructure under submerged arc welding (SAW) with a high heat input of 200 kJ/cm. The study reveals that, different from that in conventional steel, the ${\gamma}$ grain coarsening is notably retarded in the coarse grain HAZ (CGHAZ) of a newly developed steel with TiN precipitates below 70 nm in size even under the high heat input welding, and the refinement of HAZ microstructure is confirmed to have improved impact toughness. Furthermore, energy dispersive spectroscopy (EDS) and secondary-ion mass spectrometry (SIMS) analyses demonstrate that B is was identified at the interface of TiN in CGHAZ. It is likely that B atoms in the WM are diffused to CGHAZ and are segregated at the outer part of undissolved TiN, which contributes partly to a further grain refinement, and consequently, improved mechanical properties are achieved.

• Journal of the Korean Vacuum Society
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• v.2 no.2
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• pp.181-187
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• 1993

We have studied the anodic oxidation of silicon in the anisotropic etchant of EPW(Ethylenediamine, Pyrocatechol and Water) solution using the cyclic polarization technique. The samples have been characterized by means of X-ray photoelectron spectroscopy(XPS) and secondary ion mass spectrometry (SIMS). The results of cyclic polarization experiments show that the anodic oxides formed on p- and n-type silicon wafers break down at the same potential while breakdown does not occur up to open circuit potential in the case of $p^+$-Si. Strong etch-resistance of $p^+$-XPS. SIMS depth profiles suggest that the critical concentration of boron for etch-stop to occur appears to be much higher than what is widely believed.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2007.06a
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• pp.111-111
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• 2007

Further scaling the semiconductor devices down to low dozens of nanometer needs the extremely shallow depth in junction and the intentional counter-doping in the silicon gate. Conventional ion beam ion implantation has some disadvantages and limitations for the future applications. In order to solve them, therefore, plasma source ion implantation technique has been considered as a promising new method for the high throughputs at low energy and the fabrication of the ultra-shallow junctions. In this paper, we study about the effects of DC bias and base pressure as a process parameter. The diluted mixture gas (5% $PH_3/H_2$) was used as a precursor source and chamber is used for vacuum pressure conditions. After ion doping into the Si wafer(100), the samples were annealed via rapid thermal annealing, of which annealed temperature ranges above the $950^{\circ}C$. The junction depth, calculated at dose level of $1{\times}10^{18}/cm^3$, was measured by secondary ion mass spectroscopy(SIMS) and sheet resistance by contact and non-contact mode. Surface morphology of samples was analyzed by scanning electron microscopy. As a result, we could accomplish the process conditions better than in advance.

• Proceedings of the Korean Vacuum Society Conference
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• 1999.07a
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• pp.204-204
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• 1999

The plasma source ion implantation(PSII) technique which is a method using high negative voltage pulse in plasma system has the potential to change the surface properties of polymer. PSII technique increase the surface free energy by introducing polar functional groups on the surface so that it improves reactivity, hydrophilicity, adhension, biocompatability, etc. However, the mobility of polymer chains enables the modified surface layers to adapt their composition to interfacial force. This hydrophobic recovery interrupts the stability of modified surfaces to keep for the long time. In this study, poly(methyl methacrylate)(PMMA), poly(2-hydroxyethyl methacrylate)(PHEMA), and polu(2-hydroxypropyl methacylate)(PHPMA) for contact lens application, were modified to improve the wettability with PSII technique and were investigated the surface stabilities. Polymer film was prepared with solution casting(3 wt.% solution) and was annealed at 11$0^{\circ}C$ under vacuum oven to remove solvent completely and to eliminate physical ageing. The thickness of the film measured by scanning electron microscopy (SEM) and surface profilometer was about 10${\mu}{\textrm}{m}$. Polymers were treated with different kinds of gases, pulse frequency, pulse with, pulse voltage, and treatment time. Even though PMMA, PHEMA, and PHPMA have similar repeat unit structure, the optimal treatment conditions and the tendency to hydrophobic recovery were different. PHPMA, more hydrophilic polymer than PMMA and PHEMA showd better wettability and stability after mild treatment. Surface tensions were obtained by water and diiodomethane contact angle measurements to monitor the relation between hydrophobic recovery and polymer structure. Different ion species in plasma change the polar component and dispersion component of polymer surface. For better wettability surface, the increase of polar component was a dominant factor. We also characterized modified polymer surfaces using x-ray photoelectron spectroscopy(XPS), secondary ion mass spectrometry(SIMS), Fourier Transform infrared spectroscopy(FT-IR), and SEM.

• Korean Journal of Materials Research
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• v.29 no.11
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• pp.697-702
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• 2019

In this study, using a wet chemical process, we evaluate the effectiveness of different solution concentrations in removing layers from a solar cell, which is necessary for recovery of high-purity silicon. A 4-step wet etching process is applied to a 6-inch back surface field(BSF) solar cell. The metal electrode is removed in the first and second steps of the process, and the anti-reflection coating(ARC) is removed in the third step. In the fourth step, high purity silicon is recovered by simultaneously removing the emitter and the BSF layer from the solar cell. It is confirmed by inductively coupled plasma mass spectroscopy(ICP-MS) and secondary ion mass spectroscopy(SIMS) analyses that the effectiveness of layer removal increases with increasing chemical concentrations. The purity of silicon recovered through the process, using the optimal concentration for each process, is analyzed using inductively coupled plasma atomic emission spectroscopy(ICP-AES). In addition, the silicon wafer is recovered through optimum etching conditions for silicon recovery, and the solar cell is remanufactured using this recovered silicon wafer. The efficiency of the remanufactured solar cell is very similar to that of a commercial wafer-based solar cell, and sufficient for use in the PV industry.

• Proceedings of the Materials Research Society of Korea Conference
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• 2010.05a
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• pp.35.2-35.2
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• 2010

최근 $Cu(In,Ga)Se_2$(CIGS)와 같은 박막 태양전지에 대한 연구가 많은 관심을 끌고 있다. CIGS 태양전지의 광투과층으로 사용되고 있는 II-VI족 화합물 반도체인 CdS는 상온에서의 에너지 밴드 갭(band gap)이 2.42eV 정도로서, 가시광영역의 많은 빛을 투과시키고, 적절한 제작 조건하에서 비교적 낮은 비저항을 나타내기 때문에 널리 사용되고 있다. 하지만 CIGS 태양전지 연구는 주로 CIGS 흡수층 제조공정에 편중되어 있으며, CdS 버퍼층 공정조건에 대한 체계적인 연구가 부족하다고 판단된다. 습식공정인 Chemical Bath Deposition (CBD)에 의해 주로 제조되는 CdS는 단순한 제조공정에도 불구하고 CIGS 태양전지의 성능에 지대한 영향을 미치는 것으로 알려져 있다. 특히, CdS합성반응이 개시되기 전까지의 용액잔류시간 (dip time)은 CIGS내로의 Cd이온 농도를 결정하는 중요한 공정변수로 판단된다. CIGS 표면에 Cd이 도핑될 경우, CIGS는 n형 전도성을 갖는 얇은 층을 갖게 되어 전체적으로 n-CIGS/p-CIGS의 동종 접합을 형성하는 장점을 부여할 것으로 기대된다. 따라서 본 논문에서는 dip time을 주요변수로 하여 CIGS 태양전지의 성능에 미치는 영향을 주로 고찰하였다. Cd의 확산 정도는 secondary ion mass spectroscopy (SIMS)를 이용하여 정량화하였으며, 제조된 CIGS 태양전지의 전류-전압 특성과 상관성을 제시하고자 한다.

• Proceedings of the KIEE Conference
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• 1999.11d
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• pp.867-869
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• 1999

In this study, $SrBi_{2}Ta_{2}O_{9}$(SBT) thin films were etched as a function of $SF_6$/Ar gas mixing ratio in magnetically enhanced inductively coupled plasma(MEICP) system fer a fixed rf power, dc-bias voltage, and chamber pressure. The etch rate of SBT thin film was $1500{\AA}/min$ and the selectivities of photoresist (PR) and $SiO_2$ to SBT thin film were 0.48 and 0.62, respectively when the samples were etched at a rf power of 600W, a dc-bias voltage of -150V, a chamber pressure of 10 mTorr and a gas mixing ratio of $SF_6/(SF_6+A)$=0.1. In order to examine the chemical reactions on the etched surface, X-ray photoelectron spectroscopy(XPS) and secondary ion mass spectrometry(SIMS) were done.

• Proceedings of the Korean Vacuum Society Conference
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• 2011.02a
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• pp.396-396
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• 2011

유연기판(Flexible) CIGS 박막태양전지는 금속 및 폴리머 기판을 이용하고 roll-to-roll 공정에 적합하기 때문에 유리기판을 이용한 태양전지에 비해 가볍고 공정단가를 절감할 수 있다. 그러나 기존의 soda-lime 유리 기판에 비해 금속 및 폴리머 기판을 사용시 Na 공급의 부재로 CIGS 박막 태양전지는 Voc, FF의 감소로 효율이 감소한다. 본 연구에서는 기존 유리기판과 유사한 Na의 공급을 위해 soda lime 유리 박막(SLGTF)을 Mo 후면전극 증착 전에 도입하였으며, CIGS 박막 및 태양전지를 제조함으로써 SLGTF의 영향을 분석하였다. SLGTF는 rf magnetron 스퍼터링법으로 두께를 조절하여 철강기판과 Mo 사이에 증착하였다. 본 연구에서는 SLGTF의 두께에 따른 CIGS 박막의 미세구조 및 Na 함량의 변화를 기존의 유리기판 및 SLGTF이 없는 철강기판과 비교하여 분석하고자 하였다. CIGS 박막은 3-stage 진공증발법으로 증착하였으며, CIGS 박막의 우선배향성(texture) 변화를 관찰하기 위해 XRD (X-ray Diffraction)를 이용하였고 Na 양을 확인하기 위해 SIMS(Secondary Ion Mass Spectroscopy)를 사용하였다. SLGTF의 도입 및 두께의 변화에 따라 CIGS 박막의 우선배향성(texture) 및 Na의 양에 큰 변화가 있었으며, 이러한 변화가 CIGS 태양전지 셀 효율에 미치는 영향을 분석하였다.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.14 no.9
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• pp.714-719
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• 2001

SrBi$_2$Ta$_2$$O_{9}$ thn films were etched in inductively coupled Cl$_2$/CF$_4$/Ar plasma. THe maximum etch rate was 1060 $\AA$/min at a Cl$_2$/(Cl$_2$+CF$_4$+Ar)=0.2. The 20% additive Cl$_2$ into CF$_4$/Ar plasma decreased carbon and fluorine radicals, but increased Cl radicals. Sr was effectively removed by reacting with Cl radical because the boiling point of SrCl$_2$(125$0^{\circ}C$) is lower than that of SrF$_2$(246$0^{\circ}C$). The chemical reactions on the etched surface were studied with x-ray photoelectron spectroscopy and secondary ion mass spectrometry. The etching profile was evaluated by using scanning electron microscopy.y.