• Electrical & Electronic Materials
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• v.9 no.6
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• pp.593-599
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• 1996

Laser scribing of silicon plays an important role in metallization including the grid pattern and the front surface geometry which means aspect ratio of metal contacts. To make a front metal electrode of buried contact solar cell, we used ND:YAG lasers that deliver average 3-4W at TEM$\_$00/ mode power to sample stage. The Q-switched Nd:YAG laser of 1.064 gm wavelength was used for silicon scribing with 20-40.mu.m width and 20-200.mu.m depth capabilities. After silicon slag etching, the groove width and depth for buried contact solar cell are -20.mu.m and 30-50.mu.m respectively. Using MEL 40 Nd:YAG laser system, we can scribe the silicon surface with 18-23.mu.m width and 20-200.mu.m depth controlled by krypton arc lamp power, scan speed, pulse frequency and beam focusing. We fabricated a buried contact Silicon Solar Cell which had an energy conversion efficiency of 18.8 %. In this case, the groove width and depth are 20.mu.m and 50.mu.m respectively.

• The Transactions of The Korean Institute of Electrical Engineers
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• v.57 no.8
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• pp.1407-1411
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• 2008

In material processing, a laser system with optimal laser parameters has been considered to be significant. Especially, the laser scribing technology is thought to be very important for fabricating DSSC(Dye sensitized solar eel!) modules with good quality. Moreover, the $TEM_{00}$ mode laser beam is the most dominant factor to decide the IPCE(Incident photon to current conversion efficiency) characteristics. In order to get the $TEM_{00}$ mode, a pin-hole is inserted within a simple pulsed Nd:YAG laser resonator. And the spatial field distribution is measured by using three size pin-hole diameters of 2.0, 6.0mm respectively. At that moment, each case has the same laser beam energy by adjusting the discharge voltage and pps(pulse per second). From those results, it is known that the pin-hole size of 2.0mm has the perfect $TEM_{00}$ mode. In addition, at the charging voltage of 1000V, 10pps and the feeding speed of 1.11mm/sec, the SEM photo of FTO(Fluorine-doped tin oxide) thin film layers shows the best scribing trace.

• Journal of the Korean Society of Manufacturing Technology Engineers
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• v.25 no.1
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• pp.36-41
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• 2016

A method is proposed for the improvement of deposition reproducibility in the selective electrodeposition process using laser masking and DC voltage. Selective electrodeposition using laser masking and DC voltage can achieve a deposited layer with micro patterns. However, selective electrodeposition using laser masking and DC voltage have a critical problem: the lack of reproducibility in selective deposition. The reproducibility of selective electrodeposition can be improved by a new process that consists of laser masking, two-step electro-deposition, laser scribing, and ultrasonic cleaning. The experiments in this study show that the reproducibility of selective deposition can be successfully improved by the combination of two-step electrodeposition and laser scribing.

• Proceedings of the Optical Society of Korea Conference
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• 2000.02a
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• pp.224-225
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• 2000

Transparent and hard materials such as sapphire are used for many industrial applications as optical windows, hard materials on mechanical contact against abrasion, and substrate materials for opto-electronic semiconductor devices such as blue LED and blue LD etc. The materials should be cut along the proper shapes possible to be used for each application. In case of blue LED, the blue LED wafer should be cut to thousands of blue LED pieces at the final stage of the manufacturing process. The process of cutting the wafer is usually divided into two steps. The wafer is scribed along the proper shapes in the first step. It is inserted between transparent flexible sheets for easy handling. And then, it is broken and split in the next step. Harder materials such as diamonds are usually used to scribe the wafer, while it has a problem of low depth of scribing and abrasion of the harder material itself. The low depth of scribing can induce failure in breaking the wafer along the scribed line. It was also known that the expensive diamond tip should be replaced frequently for the abrasion. (omitted)

• Proceedings of the Korean Society of Machine Tool Engineers Conference
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• 1995.03a
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• pp.70-80
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• 1995

광학용 정밀유리와 건축용 패널유리 전문가공을 위한 CNC Glass Scribing Machine 을 개발하였다. 이제까지는 고품질의 고가기계를 수입하여 사용하던가 간이 자동화된 자체 개발기계를 사용하여 여유있게 절단한후 연삭가공에서 정밀칫수를 맞추는 작업을 해왔었다. 그러나 금번 개발된 기계를 사용하여 작업한 결과 연삭공정을 생략할수 있음은 물론 가공칫 수 정밀도도 일급 수준을 얻을수 있었다. 그러나 아직 세계일류의 품질과 성능은 도달치 못 했다. 생산성 향상을 위한 이송속도 향상설계와 가공칫수 정밀도의 초일급 달성을 위한 초 정밀설계를 통해 품질과 성능에서 세계일류의 상품화 개발과정을 준비중에 있다. 본논문에 서는 본 기계의 개발과정 및 주요요소기술들과 개발 결과를 정리하였다.

• Proceedings of the Computational Structural Engineering Institute Conference
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• 2002.10a
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• pp.94-103
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• 2002

Accurately controlling the shape of the read/write head structure is critical in the performance of a modern hard disk drive. The sliders investigated are composed of alumina and titanium carbide (AlTiC) and act as an air bearing when passing over the disks. Controlling the curvature of the slider is of primary importance. A laser scribing system that produces curvature by Inducing residual stress into the slider can be utilized. Predicting the curvature created by a pattern of scribes is of great importance to increase the control over the sliders' shape. Using finite element analysis a force system that produces stresses similar to the laser scribing is applied. The curvatures created by the force system are calibrated to experimental measurements.

• Journal of the Korean Society of Manufacturing Technology Engineers
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• v.7 no.1
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• pp.126-134
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• 1998

In order to increase the modeling power and productivity of CAD/CAM systems, demands for customization of CAD/CAM system increased. Customization of a CAM system involves making it easier to learn and use, adding new modeling features not supported in a general purpose CAM system, and providing parametric inputting mechanism. A customization from a commercial CAM system (OMEGA) has implemented for two dimensional free curve CNC glass scribing machine of medium size company in Cheonan. A CAD technician who has no CAM experience can operate this customized CAM system satisfactorily.

• 제어로봇시스템학회:학술대회논문집
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• 2000.10a
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• pp.222-222
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• 2000

The general dicing process cuts a semiconductor wafer to lengthwise and crosswise direction by using a rotating circular diamond blade. But inferior goods are made under the influence of several parameters in dicing such as blade, wafer, cutting water and cutting conditions. Moreover we can not applicable this dicing method to GaN wafer, because the GaN wafer is harder than the other wafer as GaAs. In older to overcome this problem, a new dicing process is necessary. This paper describes a new machine using scriber and precision servo mechanism in order to dice a semiconductor wafer.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.18 no.5
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• pp.74-81
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• 2019

This study reports the CW $CO_2$ laser scribing of soda lime glass. In this study, scribing experiments are carried out at different laser powers, scan speeds, and focal positions to investigate the effect of the process parameters on the interaction characteristics between a laser beam and glass. In particular, the interaction characteristics are analyzed and described with the input laser energy per unit length. According to the experimental results, the damage threshold for the glass surface was found to exist between 0.072 and 0.08 J/mm. The input laser energy in this region induced partial melting of the surface and grain-shaped cracks. These cracks tended to increase as the input laser energy increased. At the laser input energy larger than 1 J/mm, a huge crack propagating along the scan direction was produced, and the volume below the scribed area was fully melted. The growth of this crack finally resulted in the complete cutting of the glass at the input laser energy above 8 J/mm. It was found that both the width and depth of the scribed line increased with increasing input laser energy. For the beam focusing at the rear surface, the width of the scribed line varied irregularly. This could be ascribed to the increased asymmetry of the beam intensity distribution when the laser beam was focused at the rear surface. Under this condition, a large burr was only produced on one side of the scribed line.

• Current Photovoltaic Research
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• v.12 no.2
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• pp.37-40
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• 2024

One of the current innovation trends in the solar industry is the increase in the size of silicon wafers. As the wafer size increases, the series resistance of the module rises, highlighting the need for research on methods for cutting and bonding solar cells. Among these, the Infrared (IR) laser scribing technique has been extensively researched. However, there is still insufficient optimization research regarding the thermal damage caused by lasers on the Transparent Conductive Oxide (TCO) layer of Heterojunction (HJT) solar cells. Therefore, in this study, we systematically varied conditions such as IR laser scribing speed, frequency, power, and the number of scribes to investigate their impact on the performance of cut cells under each condition. Additionally, we conducted a comparative analysis of thermal damage effects on the TCO layer based on varying scribing depths.