• Proceedings of the Materials Research Society of Korea Conference
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• 2000.11a
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• pp.109-109
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• 2000

• Journal of the Korean Society of Clothing and Textiles
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• v.41 no.2
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• pp.212-223
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• 2017

This research investigated the screen printing method for natural indigo dye on cotton fabric. We examined four types of thickening agents (arabic gum, guar gum, indalca, and CMC) based on their ability to retard the oxidation of natural indigo print paste while the paste remained on the screen frame. The results indicated that the retardation of arabic gum towards oxidation was the greatest among the four types of thickening agents. The highest K/S value of the printed cotton was observed with a dye concentration of 50g/L fermented indigo powder. The best printing results were obtained when the duration of dye efficiency was tested for the 10 minutes of the dye paste remaining on the screen with a thickening agent concentration of 26.56% that represented 530 cps viscosity. The test of colorfastness to washing and rubbing of the printed cotton resulted in grade 5, and the colorfastness to sunlight resulted in grade 4. Chinese traditional Naminwhapo printing was reproduced on cotton fabric using the natural indigo printing method derived from this study.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2000.07a
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• pp.873-876
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• 2000

Characteristics of piezoelectric thick films prepared by screen printing method were investigated. The piezoelectric thick films were printed using Pb(Mg,Nb)O$_3$-Pb(Zr,Ti)O$_3$system. The lower electrodes were coated with various thickness of Ag-Pd by screen printing to investigate the effect as a diffusion barrier and deposited with Pt by sputtering on Ag-Pd. The ceramic paste was prepared by mixing powder and binder with various ratios using three roll miller. The fabricated thick films were burned out at 650$^{\circ}C$ and sintered at 950$^{\circ}C$ in the O$_2$condition for each 20, 60min after printing with 350mesh screen. The thickness of piezoelectric thick film was 15∼20 $\mu\textrm{m}$ and the Ag-Pd electrode acted as a diffusion barrier above 3 $\mu\textrm{m}$ thickness. When the lower electrode Ag-Pd was 6 $\mu\textrm{m}$ and the piezoelectric thick films were sintered by 2nd step (650$^{\circ}C$/20min and 950$^{\circ}C$/1h) using paste mixed Pb(Mg,Nb)O$_3$-Pb(Zr,Ti)O$_3$$.$ MnO$_2$+ Bi$_2$O$_3$. V$_2$O$\_$5/ and binder in the ratio of 70:30, the remnant polarization of thick film was 9.1 ${\mu}$C /cm$^2$.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2003.07b
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• pp.685-688
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• 2003

[ $(Ba,Sr,Ca)TiO_3$ ] powders, prepared by the sol-gel method, were mixed with an organic vehicle and the BSCT thick films were fabricated by the screen printing techniques on alumina substrates. The grain size decreased with increasing amounts of $MnO_2$, and the BSCT(50/40/10) thick film doped with 1wt% $MnO_2$ showed a value of 6.5mm. The thickness of thick films by four-cycle on printing/drying was approximately 100mm. The relative dielectric constant, dielectric loss and tunability of the BSCT(S0/40/10) thick films doped with 1.0wt% $MnO_2$ were 1296, 0.61% and 11.18%, respectively.

• Journal of the Korean Graphic Arts Communication Society
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• v.30 no.3
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• pp.45-56
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• 2012

Printing technology is accepted by appropriate technology that smart phones, tablet PC, display(LCD, OLED, etc.) precision recently in the electronics industry, the market grows, this process in the ongoing efforts to improve competitiveness through the development of innovative technologies. So printed electronics appeared by new concept. This technology development is applied on electronic components and circuits for the simplification of the production process and reduce processing costs. Low-temperature process making possible for widening, slimmer, lighter, and more flexible, plastic substrates, such as(flexible) easily by forming a thin film on a substrate has been studied. In the past, the formation of the electrode used a screen printing method. But the screen printing method is formation of fine patterns, high-speed printing, mass production is difficult. The roll-to-roll printing method as an alternative to screen printing to produce electronic devices by printing techniques that were used traditionally in the latest technology and processing techniques applied to precision control are very economical to implement fine-line printing equipment has been evaluated as. In order to function as electronic devices, especially the dozens of existing micro-level of non-dot print fine line printing is required, the line should not break at all, because according to the specifications required to fit the ink transfer conditions should be established. In this study of roll-to-roll printing conductive paste suitable for gravure offset printing by developing Ag paste for forming fine patterns to study the basic physical properties with the aim of this study were to.

• Journal of the Korean Graphic Arts Communication Society
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• v.13 no.1
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• pp.13-24
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• 1995

The color filter os made in four methods ; dyeing, printing electrodisposition and pigment dispersed method. Among technologies for color filter manufacture, pigment-dispersed and hybrid method are dominant over all others in commercial manufacture of large scale, fine resolution color filter for liquid crystal display. In this paper to investigate the possibility of the color filter manufacture for LCD by screen printing method, we synthesyzed PVA/sbQ screen emulation for high resolution, estimated image of printed fine pattern and manufactured color filter by screen printing. Results of the study are as follow and found the screen printing method os useful and valid from it. 1. Fine pattern is formed due to photocyclodomerization of -C=C- bond at 342nm, on the other hand unexposured parts are removed in water. 2. sharpness and resolution of fine pattern is improved at mesh streching angle 22.5 and 45 than 0 degree. It is expected due to resistance between inks and mesh streching angles. 3. Spectral characteristics of sample inks were R(640nm), G(535nm), B(470nm), transmittance were R(92%), G(79%), B(70%) and chromaticity coordinate values were R(0.62,0.33), G(0.32,0.59), B(0.14,0.17)

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2002.11a
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• pp.342-345
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• 2002

As the size of chip components and module decreases, new patteming method for fine line and geometry is needed. So far, in LTCC(Low Temperature Cofired Ceramic) process, screen printing method has been used generally. But screen printing method has some disadvantages as follows. First, the geometry including line, vias, etc. smaller than $100{\mu}m$ can't be evaluated easily. Second, the patterned dimension is different from designed value, which makes distortion in charactersitics of not only chip components but also modules. Thick film lithography has advantages of thick film screen printing process, low cost and thin film process, fine line feasibility. Using this method, the line with $30{\mu}m$ width and the geometry with expected dimension can be evaluated. In this study, the fine line with $35{\mu}m$ line/space is formed and the embedded capacitor with very small tolerance is developed using thick film lithography.

• Proceedings of the Korean Vacuum Society Conference
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• 2013.02a
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• pp.686-686
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• 2013

Crystalline silicon solar cell is a semiconductor device that converts light into electrical energy. Screen printing is commonly used to form the front/back electrodes in silicon solar cell. Screen printing method is convenient but usually shows high resistance and low aspect ratio, which cause the efficiency decrease in crystalline silicon solar cell. Recently the plating method is applied in c-Si solar cell to reduce the resistance and improve the aspect ratio. In this paper, we investigated the effect of additional electroless Ag plating into screen-printed c-Si solar cell and compared their electrical properties. All wafers used in this experiment were textured, doped, and anti-reflection coated. The electrode formation was performed with screen-printing, followed by the firing step. Aften then we carried out electroless Ag plating by changing the plating time in the range of 20 sec~5 min and light intensity. The light I-V curve and optical microscope were measured with the completed solar cell. As a result, the conversion efficiency of solar cells was increased mainly due to the decreased series resistance.

• Progress in Superconductivity
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• v.5 no.2
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• pp.132-135
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• 2004

We fabricated YBCO thick films by using a screen printing method with $Y_2$BaCuO$_{5}$(Y211) and BaCO$_3$ powders on Cu-substrate in $N_2$ atmosphere. Cu-sheathed YBCO thick film process is more simple and economic than YBCO coated conductor methods. The heat treatment is performed in the range of 860 - 875 $^{\circ}C$ for 5 min in the tube furnace of $N_2$ atmosphere. The flow rate of $N_2$ gas is fixed 60 $m\ell$/min. Microstructure and phases of thick films were investigated by optical microscope, X-ray diffraction(XRD) and SEM. At heat-treatment temperature, the thick films were partially melted by liquid reaction between CuO of oxidized copper substrate and the powders screen-printed on Cu-sheath. During the heat-treatment procedure, YBCO superconducting grains nucleate.e.

• Korean Journal of Materials Research
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• v.28 no.12
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• pp.714-718
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• 2018

Anti-reflection thin films are fabricated on glass substrates using the screen printing method. Tetra ethyl silicate(TEOS) and methyl tri methoxy silane(MTMS) are used as starting materials and buthyl carbitol acetate(BCA) and buthyl cellusolve(BC) are mixed to improve the viscosity of the solution. Anti-reflection thin films are fabricated according to the number of the screen mesh and the characteristics improve as the mesh size increases. The transmittance and reflectance of the coated thin film using 325 mesh are about 94 % and 0.43 % in the visible wavelength. The thickness and refractive index of the AR thin film are 107 nm and n = 1.26, respectively.