• Journal of radiological science and technology
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• v.16 no.1
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• pp.41-55
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• 1993

Recently, various screen film system have been introduced in diagnostic radiology. There are two kinds of screen film system : blue emitting $CaWO_4$ screen has been largely used in these days. However, it tends to be changed to use green emitting $Gd_2O_2S$ : Tb screen. In this study, photographic characteristics of $CaWO_4$ and $Gd_2O_2S$ : Tb screen were investigated with luminescence, spectroscopy. The morphology of $CaWO_4$ and $Gd_2O_2S$ : Tb were also observed by using scanning electron microscope. The result obtained were as follows : 1. There was small difference in the thickness of phosphor layers for the front and back screen of blue emitting system, but little difference in those of green emitting system. 2. There was no difference in the size of phosphor particles between the front and back screen for each screen. However, the particle size was different for the various kinds of screens. 3. The shape of phosphor particle was round with many faces for all the screens. 4. In the exposure of X-ray with the same intensity, luminescent intensity of a green emitting system was $6{\sim}7$ times larger than that of a blue emitting system. 5. The thickness of phosphor layers does not affect on the sensitivity of the screens exposed by X-ray.

• Journal of the Korean Electrochemical Society
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• v.3 no.4
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• pp.235-240
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• 2000

Screen-printing and doctor blade method were investigated and proposed as an electrode coating process for high power capacitor. CV measured from the amorphous $MnO_2$ electrode prepared by screen-printing shows closer to ideal capacitor characteristics. Specific capacitances calculated from CVs with potential scan rate of 50mV/s were 5.8, 81.8, and 172.0 F/g for electrode thickness of $140{\mu}m,\;24{\mu}m,\; 3{\mu}m$, respectively. Assumed that utilization of active $MnO_2$ in electrode of screen-printing is $100\%$, those were $3.4\%$ in one of paste method and $47.6\%$ in one of doctor blade method. The screen-printing can be good technique to coat thin film on current collector for high power application.

• Journal of Energy Engineering
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• v.13 no.4
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• pp.267-274
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• 2004

Theoretical analysis for predicting the heat transport limitations of screen mesh wick and sintered wick heat pipes was performed. The heat pipe diameter was 8mm and water was used for working fluid. For the 250 mesh, each capillary pressures and heat transport limitations, thermal resistances were analyzed according to the operating temperatures, wick thicknesses and inclination angles, based on the effective capillary radius (r$\_$c/), porosity ($\varepsilon$) and permeability (K). The wick capillary limitation was increased as the operating temperature and the wick thickness were increased, and generally the sintered wick showed higher heat transport limitations than that of the screen wick. The thermal resistance of the screen wick was higher than that of the sintered wick and both thermal resistances were linearly increased as the wick thickness was increased.

• Transactions of the Korean Society of Automotive Engineers
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• v.19 no.2
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• pp.84-91
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• 2011

The purpose of this study is to find how to be formed the wet film thickness during the low friction coating process for a piston skirt with application to the theory of screen printing. In other words, the general expressions predicting the pressure under a blade and the volume of coating fluid passing through the blade edge are derived. Using these expressions, the coating thickness on a piston skirt during a sample blade coating process can be quantitatively assessed.

• Journal of electromagnetic engineering and science
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• v.16 no.2
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• pp.106-111
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• 2016

A resistive and capacitive (RC) microwave absorber with a layer thickness less than a quarter of a wavelength is investigated based on closed-form design equations, which are derived from the equivalent circuit of the RC absorber. The RC absorber is shown to have a theoretical 90% absorption bandwidth of 93% when the electrical layer thickness is $57^{\circ}$ (about ${\lambda}_0/6$). The trade-offs between the layer thickness and the absorption bandwidth are also elucidated. The presented formulation is validated by a design example at 3 GHz. The RC absorber is realized using a silver nanowire resistive rectangular structure with surrounding gaps. The measured 90% absorption bandwidth with a layer thickness of ${\lambda}_0/8$ is 76% from 2.3 GHz to 5.1 GHz in accordance with the theory and EM simulations. The presented design methodology is scalable to other frequencies.

• 한국정보디스플레이학회:학술대회논문집
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• 2007.08b
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• pp.1519-1521
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• 2007

In this work, a coplanar-type plasma flat fluorescent lamp having cross type of electrode was fabricated by screen printing and sealing technique. Cross type of electrode with a dielectric layer were screen-printed on a rear glass plate, and then fired at $550^{\circ}C$. Phosphor was printed on and fired at $450^{\circ}C$. Finally, the lamp was sealed by frit glass at $450^{\circ}C$. The lamp of cross electrode type was studied depending on the electrode gap and the thickness of dielectric layer.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.45 no.4
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• pp.72-77
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• 2008

This paper investgated on fabrication process and tolerance of resistance body with a uniform thickness formed by the process of cavity type on organic substrate for application of embedded resistor. To improve the tolerance of resistance value according to a position of PCB cause by conventional screen printing, we introduced the process of cavity type from organic substrate. A resistor with a desired shape and volume was precisely formed by the process of cavity using a resistor paste and screen printing. This method can increase PCB's productivity by shortening its production time because process conditions of a screen prining device can be set quickly without any affection on its position accuracy.

• Journal of the Korean institute of surface engineering
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• v.44 no.4
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• pp.149-154
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• 2011

Martensitic stainless steel STS 431 has been nitrided by active screen ion nitriding under the various temperature and time. The thickness of diffusion layer, case depth, hardness and composition phases were investigated using field emission scanning electron microscopy (FE-SEM), micro-Vickers hardness tester, X-ray diffraction (XRD) and glow discharge spectroscopy (GDS). It was observed that the thickness of diffusion layer depends strongly on the treatment temperature and time. A sample, which was nitrided at $450^{\circ}C$ for 8hours, was a maximum hardness of Hv0.01 1558 and nitride layer of $70{\mu}m$. As shown in XRD patterns, $\varepsilon(Fe_{2-3}N)$ and expanded martensite (${\alpha}_N$) phases which was saturated with nitrogen solid solution were in the nitrided layer treated at $450^{\circ}C$ for 2 hours. Composition phases of $\varepsilon$ $(Fe_{2-3}N)$ and ${\gamma}'$ ($Fe_4N$) were observed after active screen nitriding at $450^{\circ}C$ for 8 hours.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.18 no.9
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• pp.827-832
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• 2005

Dual band internal antennas were fabricated with Ag conducting paste of various preparation conditions and different print thickness by silk screen print. We have investigated microwave properties were compared Ag conducting paste antenna with copperplate antenna at 800 MHz and 1,800 MHz. Gain of Ag conducting paste antenna was improved when preparation conditions were the single size Ag particle, using dry type resin and high Ag containing percent. However, it was lower than that of copperplate antenna within $0.1\~2.0dBi$ at 800MHz. In addition, it was improved at 800MHz when thickness of Ag conducting paste was printed more than skin depth but it was held after critical print thickness. On the other hand, it was reached level of copperplate antenna at 1,800MHz.

• Journal of the Korean Ceramic Society
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• v.51 no.4
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• pp.344-349
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• 2014

$RuO_2$-based high frequency thick-film resistor paste was printed at the speed of 10, 100, 300 mm/sec on the AlN substrate, and then sintered at between 750 and $900^{\circ}C$. The sintered thick films were characterized in terms of printing and sintering conditions. With increasing printing speed, the thickness and roughness of sintered film increased. The resistance of the thick film resistor was reduced by increasing the printing speed from 10 to 100 mm/sec, but did not significantly change at 300 mm/sec speed. With increasing sintering temperature, the surface roughness and thickness of sintered resistor film decreased. The reduction rate was large in case of fast printed resistor. The resistance of the resistor increased up to $800^{\circ}C$ with sintering temperature, but again decreased at the higher sintering temperature.