• Applied Biological Chemistry
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• v.40 no.6
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• pp.508-513
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• 1997

Thermal characteristics and granular morphology on enzyme-resistant starches (RS) formed during heat-moisture treatment (HMT) and retrogradation were investigated in high amylose corn starches, Hylon V and Hylon VII. With each treatment, both starches showed a similar trend in the increase of RS, but RS yield of Hylon VII is higher than that of Hylon V. Specially, RS was increased remarkably by HMT. It was more than doubled from 11.4% to 26.6% for Hylon V and from 15.9% to 32.8% for Hylon VII. A small increase of RS resulted from retrogradation. HMT on starch increased gelatinization temperature, decreased enthalpy. Retrograded starch exhibited small three endothermic transitions at $94^{\circ}C$, $110^{\circ}C$ and $140^{\circ}C$ in differential scanning calorimetry (DSC) thermogram due to the remained ungelatinized starch granules, dissociation of amylose-lipid complex and melting of recrystallized amylose, respectively. Enzyme-resistant starches isolated from native and heat-moisture treated starches showed a broad endothermic transition at higher temperature than native starch, while retrograded starch exhibited a very sharp peak at ${\sim}150^{\circ}C$ due to the melting of amylose crystallites. Under microscopy, starch granules with HMT was not changed, but retrograded starches showed the aggregates of starch granules because amylose leached out during gelatinization. Iodine stained RS clearly showed the differences in enzyme hydrolysis on the native, heat-moisture treated and retrograded starches.

• Applied Chemistry for Engineering
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• v.17 no.6
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• pp.575-579
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• 2006

Solid electrolyte interface is formed on a carbon electrode used as an anode in Li-ion battery, which can be of $Li^{+}$ intercalation/deintercalation during the first cycle. The passivation film formed by a solvent decomposition during the initial charge process affects cell performance and it was one of the main reason of an initial irreversible capacity. This paper describes the use, for the first time, of $Li_2CO_3$ as the additive for the formation of a passivation film on the carbon surface to suppress the initial irreversible reaction. Chronopotentiometry, cyclic voltammetry, and impedance spectroscopy were used to investigate the effects of the $Li_{2}CO_{3}$ additive. Scanning electron microscopy, energy dispersive X-ray analysis, and X-ray diffraction were also used to monitor changes in the surface morphology and composition of the passivation film formed by solvent decomposition and the precipitation of $Li_{2}CO_{3}$. The addition of $Li_{2}CO_{3}$ to a solution of 1 M $LiPF_{6}$/EC:MA (1:3, v/v) resulted in a decrease in the initial irreversible capacity and it was due to the suppression of the solvent decomposition on the electrode surface.

• Applied Chemistry for Engineering
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• v.19 no.2
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• pp.185-190
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• 2008

In order to increase the surface area of electrodes for electrosorption, porous carbon electrodes were fabricated by a wet phase inversion method. A carbon slurry consisting of a mixture of activated carbon powder (ACP), polyvinylidene fluoride (PVdF), and N-methyl-2-pyrrolidone (NMP) as a solvent was cast directly on a graphite sheet. The cast film was then immersed in pure water for phase inversion. The physical and electrochemical properties of the electrodes were investigated using scanning electron microscopy (SEM), porosimetry, and cyclic voltammetry. The SEM images verified that the pores of various sizes were formed uniformly on the electrode surface. The average pore sizes determined for the electrodes fabricated with various NMP contents ranged from 64.2 to 82.4 nm and the size increased as the NMP content increased. All of the voltammograms showed a typical behavior of charging and discharging characteristic at the electric double layer. The electrical capacitance ranged from 3.88 to $5.87F/cm^2$ depending on the NMP contents, and the electrical capacitance increased as the solvent content decreased. The experimental results showed that the solvent content is an important variable controlling pore size and ultimately the capacitance of the electrode.

• Applied Chemistry for Engineering
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• v.18 no.6
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• pp.592-598
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• 2007

The adsorption capability of cobalt phthalocyanine derivatives was investigated by means of X-ray diffractometor (XRD), FT-IR spectroscopy, scanning electron microscopy (SEM), and temperature programmed desorption (TPD). According to TPD results for ammonia, cobalt phthalocyanine derivatives showed two desorption peaks at low temperature ($100{\sim}150^{\circ}C$) and high temperature ($350{\sim}400^{\circ}C$) indicating that there were two kinds of acidities. Tetracarboxylic cobalt phthalocyanine (Co-TCPC) has a stronger desorption peak (chemical adsorption) at high temperature and a weaker desorption peak (physical adsorption) at low temperature than cobalt phthalocyanine (Co-PC). The specific surface areas of Co-TCPC and Co-PC were 37.5 and $18.4m^2/g$, respectively. The pore volumes of Co-TCPC and Co-PC were 0.17 and $0.10cm^3/g$, respectively. The adsorption capability of triethyl amine calculated by breakthrough curve at 120 ppm of equilibrium concentration was 24.3 mmol/g for Co-TCPC and 0.8 mmol/g for Co-PC. The removal efficiencies of dimethyl sulfide of Co-TCPC and Co-PC in batch experiment of 225 ppm of initial concentration were 92 and 18%, respectively. The removal efficiencies of trimethyl amine of Co-TCPC and Co-PC in batch experiment of 118 ppm of initial concentration were 100 and 17%, respectively.

• Applied Chemistry for Engineering
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• v.23 no.3
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• pp.313-319
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• 2012

In this work, the electroplating of copper was introduced on PAN-based carbon fibers for the enhancement of mechanical interfacial strength of carbon fibers-reinforced composites. The surface properties of carbon fibers were determined by scanning electron microscopy (SEM), X-ray photoelectron spectroscopy (XPS), X-ray diffraction (XRD), and contact angle measurements. Its mechanical interfacial properties of the composites were studied by interlaminar shear strength (ILSS) and critical stress intensity factor ($K_{IC}$). From the results, it was found that the mechanical interfacial properties of Cu-plated carbon fibers-reinforced composites (Cu-CFRPs) enhanced with increasing the Cu plating time, Cu content and COOH group up to Cu-CFRP-30. However, the mechanical interfacial properties of the Cu-CFRPs decreased dramatically in the excessively Cu-plated CFRPs sample. In conclusion, the presence of Cu particles on carbon fiber surfaces can be a key factor to determine the mechanical interfacial properties of the Cu-CFRPs, but the excessive Cu content can lead the failure due to the interfacial separation between fibers and matrices in this system.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.17 no.4
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• pp.772-779
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• 2016

Silver nanoparticles were prepared by reacting silver nitrate and trisodium citrate in an aqueous solution. Their size and shape were investigated by scanning electron microscopy (SEM). The synthesis was carried with different silver nitrate concentration, addition of TSC, solvent, surfactant, ultrasonication, and dispersing agent. With higher concentration of silver nitrate or TSC, the particles became large or agglomerated. The SEM results showed that the nanoparticles have spherical and pseudospherical shape with a narrow size distribution. The hydrophobic solvent did not affect the dispersibility, but the hydrophilic solvent enhanced it. The addition of HPMC surfactant caused the size to increase (50-100 nm) with non-uniform shapes and partial agglomeration. The dispersibility was significantly improved by ultrasonication for over 3 hours after the addition of a dispersing agent. Complete dispersion was achieved by adding the dispersant, and the nanoparticle sizes were as follows: 30-40 nm (BYK-182) < 42-78 nm (BYK-192) < 51-113 nm (BYK-142). The nanoparticles were 38.45-46.28 nm after the addition of 2-4 wt% TSC in 0.002 M silver nitrate solution.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2018.06a
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• pp.102-102
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• 2018

Electronic industry had required the finer size and the higher performance of the device. Therefore, 3-D die stacking technology such as TSV (through silicon via) and micro-bump had been used. Moreover, by the development of the 3-D die stacking technology, 3-D structure such as chip to chip (c2c) and chip to wafer (c2w) had become practicable. These technologies led to the appearance of HBM (high bandwidth memory). HBM was type of the memory, which is composed of several stacked layers of the memory chips. Each memory chips were connected by TSV and micro-bump. Thus, HBM had lower RC delay and higher performance of data processing than the conventional memory. Moreover, due to the development of the IT industry such as, AI (artificial intelligence), IOT (internet of things), and VR (virtual reality), the lower pitch size and the higher density were required to micro-electronics. Particularly, to obtain the fine pitch, some of the method such as copper pillar, nickel diffusion barrier, and tin-silver or tin-silver-copper based bump had been utillized. TCB (thermal compression bonding) and reflow process (thermal aging) were conventional method to bond between tin-silver or tin-silver-copper caps in the temperature range of 200 to 300 degrees. However, because of tin overflow which caused by higher operating temperature than melting point of Tin ($232^{\circ}C$), there would be the danger of bump bridge failure in fine-pitch bonding. Furthermore, regulating the phase of IMC (intermetallic compound) which was located between nickel diffusion barrier and bump, had a lot of problems. For example, an excess of kirkendall void which provides site of brittle fracture occurs at IMC layer after reflow process. The essential solution to reduce the difficulty of bump bonding process is copper to copper direct bonding below $300^{\circ}C$. In this study, in order to improve the problem of bump bonding process, copper to copper direct bonding was performed below $300^{\circ}C$. The driving force of bonding was the self-annealing properties of electrodeposited Cu with high defect density. The self-annealing property originated in high defect density and non-equilibrium grain boundaries at the triple junction. The electrodeposited Cu at high current density and low bath temperature was fabricated by electroplating on copper deposited silicon wafer. The copper-copper bonding experiments was conducted using thermal pressing machine. The condition of investigation such as thermal parameter and pressure parameter were varied to acquire proper bonded specimens. The bonded interface was characterized by SEM (scanning electron microscope) and OM (optical microscope). The density of grain boundary and defects were examined by TEM (transmission electron microscopy).

• Textile Coloration and Finishing
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• v.21 no.6
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• pp.1-11
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• 2009

Super-hydrophobic surface, with a water contact angle greater than $150^{\circ}$, has a self cleaning effect termed 'lotus effect'. We introduced super-hydrophobicity onto aramid/rayon mixture fabric with dual-scale structure by assembling silica nano-sol. Mixture fabric was treated with silica nano-sol, fluoric polymer using various parameters such as particle size, concentration. Silica nano-sol size were measured using particle size analyzer. Morphological changes by particle size were observed using field emission scanning electron microscopy(FE-SEM), contact angle measurement equipment. The contact angle of water was about $134.0^{\circ}$, $137.0^{\circ}$, $143.0^{\circ}$, $139.5^{\circ}$ and $139.0^{\circ}$ for mixture fabric coated with 100.2nm, 313.7nm, 558.2nm, 628.5nm and 965.4nm silica nano-sol, compared with about $120.0^{\circ}$ for mixture fabric coated with fluoric polymer. When we mixed particle sizes of 100.2nm and 558.2nm by 7:3 volume ratio, the contact angle of water was about $146.2^{\circ}$. And we mixed particle sizes of 313.7nm and 558.2nm by 7:3 volume ratio, the contact angle of water was about $141.8^{\circ}$. Also we mixed particle sizes of 558.2nm and 965.4nm by 7:3 volume ratio, the best super-hydrophobicity was obtained. In this paper, we fabricated the water-repellent surfaces with various surface structures by using four types of silica nano-sol, and we found that the dual-scale structure was very important for the super-hydrophobicity.

• Economic and Environmental Geology
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• v.25 no.3
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• pp.317-336
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• 1992

The garden soils, main road dusts, residential road dusts, and playground soils/dusts of Seoul, Geumsan, Onsan, and Taebaek areas were analyzed in order to investigate the level of heavy metal pollution by urbanization and industrialization. The soil pH is in the range of 5.48~8.40 and was generally neutral. The color of soils and dusts is mainly Raw Umber to dark greyish Raw Umber. Some samples from Taebaek city, a coal mining area, showed a deep black color due to contamination by coal dusts. Major minerals of the dusts and soils are quartz, feldspars, and micas, reflecting the composition of the parent rocks. However, pyrite was found as a major mineral in the samples of industrial road dusts of Onsan, a smelting area, and resicential road dusts of Taebaek. Thus, the high level of heavy metals in mining and smelting areas can be explained with the sulfide minerals. The mode of occurences of heavy metals in Seoul, a comprehensive urbanized area, were related to the metallic pollutants and organic materials through observation by scanning eletron microscopy. In main road and residential road dusts of Onsan area, Cd, Zn, and Cu were extremely high. Some industrial road and residential road dusts of Seoul area showed high Cu, Zn, and Pb contents, wereas some garden soils and residential road dusts of Taebaek area were high in As content. In general, the heavy metal contents in dust samples were two to three times higher than those in soil samples. Main road dust samples were the most reflective from the discriminant analysis of multi-element data. Cadmium, Sb, and Se in Onsan area, As in Taebaek area, Pb and Te in Seoul area were most characteristic in discriminating the studied areas. Therefore, Cd in smelting areas, As in coal mining areas, and Pb in metropolitan areas can be suggested as the characteristic elements of each pollution pattern. The dispersion of heavy metal elements in urban areas tends to orignate in main roads and deposit in garden soils through the atmosphere and residential roads. The heavy metal contamination in Seoul is characteristic in areas with high population, factory, road, and traffic decsities. Heavy metal contents are high in the vicinity of smelters in Onsan area and are decayed to background levels from one kilometer away from the smelters.

• Journal of Animal Science and Technology
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• v.48 no.5
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• pp.691-698
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• 2006

Three species of the yeast Saccharomyces cerevisiae, Humicola grisea and Candida glabrata were assumed as microbial inoculants for fermentation of rice straw silage. Four types of silage innoculated with three yeasts including control (non-treatment) were opened on day 1, 3, 6, 9, 15 and 20 after ensiling, and analyzed for fermentation status (pH, crude protein, microbial counts) and the microbial population attached with silage texture using SEM (Scanning Electron Microscopy). The results obtained were summarized as fallow; The pH of silage juice was decreased to 4.3 after 6th day of fermentation in the treatments innoculated with yeast, but was not changed at the ranges of 5.47 to 5.67 in control. Crude protein concentration of silage was increased by 38～41% with yeast inoculation compared to control. From SEM observation, it could be confirmed that crude protein concentration of silage was increased by microbial growth and SCP synthesis. The yeast Saccharomyces cerevisiae and Candida glabrata could be used as useful fermenters of rice straw silage.