• 제어로봇시스템학회:학술대회논문집
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• 2003.10a
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• pp.2713-2718
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• 2003

Some of manufacturing tasks such as sawing task often requires continuous impulsive motion. In case of sawing task, such impulsive motions can be observed between the teeth of the saw and the object. The amount of the external impulse exerted on the object has been treated as an important control parameter. The purpose of this work is to introduce a new concept of an effective mass in sawing task and to suggest an external impulse model in sawing task. A normalized impulse ellipsoid reflecting the velocity direction is employed to visualize the impact geometry. Experiments are performed for soft and hard workpieces to justify the external impulse model in the sawing task. It is demonstrated through simulation and experiment that the proposed external impulse model is effective to characterize the impact property.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.21 no.2
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• pp.195-204
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• 2020

To help solve the problems of how to set the optimal sawing force and the optimal controller parameters for different sawing conditions, a mathematical model of a proposed sawing system was established according to the principle of sawing force control. The conventional PID control method was then used for further research of the closed-loop control of the sawing force. Finally, through simulation and experimental research, the influence rule of the controller parameters and sawing load on the control performance and the relationships between the sawing width and controller parameters (proportion coefficient) and the sawing force setting value were obtained, from which a system scheme for intelligent sawing control of a band sawing machine was proposed. The research shows that the sawing efficiency of the intelligent sawing system was 18.1 (48%) higher than that of the original sawing system when sawing a grooved section sawing material, which verifies the good control effect of the proposed scheme.

• Journal of the Korea Society for Simulation
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• v.19 no.1
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• pp.1-11
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• 2010

K company produces semiconductor package products under the make-to-order policy to supply for domestic and foreign semiconductor manufacturing companies. Its production process is a machine-paced assembly line type, which consists of die sawing, assembly, and test. This paper suggests three plans to increase process throughput based on the process analysis of K company and evaluates them via a simulation model using a real data collected. The three plans are line balancing by adding machines to the bottleneck process, product group scheduling, and reallocation of the operators in non-bottleneck processes. The evaluation result shows the highest daily throughput increase of 17.3% with an effect of 2.8% reduction of due date violation when the three plans are applied together. Payback period for the mixed application of the three plans is obtained as 1.37 years.

• Journal of the Korean Wood Science and Technology
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• v.29 no.2
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• pp.100-108
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• 2001

An understanding of potential lumber cutting yields may lead to increased utilization of the lower grades of lumber in wood industry. Computer simulations of rough-mill operations require a lumber database as input to give reasonable estimates of such yields. The lumber database must contain detailed information regarding the location and type of defects, and then all manufacturing sequences can be tested with the same raw material. However, no suitable lumber database with mapped defects exists for Korean wood industry. In this study lumber databases of Pinus densiflora S. et Z and Quercus acutissima which are the main Korean domestic species were developed to prepare for coming era of "utilization of domestic species" in the near future. These databases were put into lumber cut-up simulation model(gang-rip-first simulator) to investigate the part yields. Gang-rip first simulation showed average part yields of 44.75% and 63.10% for Quercus acutissima and Pinus densiflora lumber database developed, respectively. In most cases process set-up of fixed blade best feed showed the best part yields and the level of acceptable defects could not make significant differences in part yields.

• Journal of the Semiconductor & Display Technology
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• v.17 no.3
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• pp.59-64
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• 2018

In recent years, the solar cell market has steadily grown with the demand for new energies. And wire sawing is one of the most critical processes in manufacturing solar cell wafer which is supposed to affect the breakage of wafers most during the process and afterwards. Generally, the defects of the wafers are generated from the structural vibrations of the machine. In the sawing process, the vibrations cause unnecessary normal stress on the cut surface of wafers, and eventually create the surface damage or leave the residual stress. In this study, the dynamic properties of a wire saw have been analyzed through the frequency response test and the computer simulation. And the effects of the design alterations have been investigated to stabilize the machine structure and further to reduce the vibrations. The result shows that relatively simple design alterations of supporting structure without any change of major parts of the machine can suppress the vibrations of the machine effectively.

• Laser Solutions
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• v.11 no.1
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• pp.19-24
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• 2008

It has been recognized that laser dicing of wafers results in low mechanical strength compared to the conventional sawing techniques. Thermal shock generated by rapid thermal loading is responsible for this problem. This work presents a two-dimensional ultra-short thermo elastic model for numerical simulation of femtosecond laser ablation of metals in the high-fluence regime where the phase explosion is dominant. Laser-induced thermoelastic stress is analyzed for Ni. The results show that the laser-induced thermal shock is large enough to induce mechanical damages.

• Korean Journal of Materials Research
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• v.22 no.9
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• pp.450-453
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• 2012

In crystalline solar cells, the substrate itself constitutes a large portion of the fabrication cost as it is derived from semiconductor ingots grown in costly high temperature processes. Thinner wafer substrates allow some cost saving as more wafers can be sliced from a given ingot, although technological limitations in slicing or sawing of wafers off an ingot, as well as the physical strength of the sliced wafers, put a lower limit on the substrate thickness. Complementary to these economical and techno-physical points of view, a device operation point of view of the substrate thickness would be useful. With this in mind, BC-BJ Si and GaAs solar cells are compared one to one by means of the Medici device simulation, with a particular emphasis on the substrate thickness. Under ideal conditions of 0.6 ${\mu}m$ photons entering the 10 ${\mu}m$-wide BC-BJ solar cells at the normal incident angle (${\theta}=90^{\circ}$), GaAs is about 2.3 times more efficient than Si in terms of peak cell power output: 42.3 $mW{\cdot}cm^{-2}$ vs. 18.2 $mW{\cdot}cm^{-2}$. This strong performance of GaAs, though only under ideal conditions, gives a strong indication that this material could stand competitively against Si, despite its known high material and process costs. Within the limitation of the minority carrier recombination lifetime value of $5{\times}10^{-5}$ sec used in the device simulation, the solar cell power is known to be only weakly dependent on the substrate thickness, particularly under about 100 ${\mu}m$, for both Si and GaAs. Though the optimum substrate thickness is about 100 ${\mu}m$ or less, the reduction in the power output is less than 10% from the peak values even when the substrate thickness is increased to 190 ${\mu}m$. Thus, for crystalline Si and GaAs with a relatively long recombination lifetime, extra efforts to be spent on thinning the substrate should be weighed against the expected actual gain in the solar cell output power.