• 한국진공학회:학술대회논문집
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• 한국진공학회 2011년도 제41회 하계 정기 학술대회 초록집
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• pp.261-261
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• 2011

펄스 직류 전원 $BCl_3/SF_6$ 플라즈마를 이용하여 GaAs/$Al_{0.2}Ga_{0.8}As$의 선택적 식각을 연구하였다. 식각 주요 공정 변수는 $BCl_3/SF_6$ 플라즈마에서 $SF_6$ 가스 유량(0~50%)이었다. $BCl_3/SF_6$의 총 가스 유량은 20 sccm이었다. 다른 공정 조건인 공정 압력(100 mTorr), 펄스 파워(500 V), 펄스 주파수(200 kHz), 리버스 시간 (0.7 ${\mu}s$)은 일정하게 고정시켰으며 기계적 펌프만을 이용하여 공정을 진행하였다. 오실로스코프(Oscilloscope) 데이터에 의하면 가스의 조성 변화에도 척에 걸리는 입력 전압과 전류가 거의 변화가 없었다. $BCl_3/SF_6$ 가스가 10%의 조성에서 GaAs와 $Al_{0.2}Ga_{0.8}As$의 식각 선택비가 약 48 : 1로 우수한 결과를 나타내었다. 그러나 $BCl_3/SF_6$ 가스의 증가는 GaAs의 식각율과 선택도를 감소시켰다. 그리고 $SF_6$ 가스의 조성비가 30% 이상일 경우에는 GaAs와 $Al_{0.2}Ga_{0.8}As$가 식각되지 않았다. 식각 후에 GaAs의 표면 거칠기(RMS surface roughness)는 0.7~1.3 nm로 나타났다. 위의 결과들을 종합적으로 보면 펄스 직류 전원 $BCl_3/SF_6$의 조성비가 10%일 때 가장 좋은 식각 선택비를 얻을 수 있었다.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2011년도 제40회 동계학술대회 초록집
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• pp.2-2
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• 2011

Single-walled carbon nanotubes (SWNTs) have been considered as a promising candidate for nextgeneration electronics due to its extraordinary electrical properties associated with one-dimensional structure. Since diversity in electronic structure depends on geometrical features, the major concern has been focused on obtaining the diameter, chirality, and density controlled SWNTs. Despite huge efforts, the controlled synthesis of SWNTs has not been achieved. There have been various approaches to synthesize controlled SWNTs by preparation of homogeneously sized catalyst because the SWNTs diameter highly depends on catalyst nanoparticles size. In this study, geometrically controlled SWNTs were synthesized using designed catalytic layers: (a) morphologically modified Al2O3 supporting layer (Fe/Al2O3/Si), (b) Mo capping layer (Mo/Fe/Al/Si), and (c) heat-driven diffusion and subsequent evaporation process of Fe catalytic nanoparticles (Al2O3/Fe/Al2O3/Si). These results clearly revealed that (a) the grain diameter and RMS roughness of Al2O3 supporting layer play a key role as a diffusion barrier for obtaining Fe nanoparticles with a uniform and small size, (b) a density and diameter of SWNTs can be simultaneously controlled by adjusting a thickness of Mo capping layer on Fe catalytic layer, and (c) SWNTs diameter was successfully controlled within a few A scale even with its fine distribution. This precise control results in bandgap manipulation of the semiconducting SWNTs, determined by direct comparison of Raman spectra and theory of extended tight binding Kataura plot. We suggest that these results provide a simple and possible way for the direct growth of diameter, density, and bandgap controlled SWNTs by precise controlling the formation of catalytic films, which will be in demand for future electronic applications.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2012년도 제42회 동계 정기 학술대회 초록집
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• pp.154-154
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• 2012

Flexible complementary inverters based on thin-film transistors (TFTs) are important because they have low power consumption and high voltage gain compared to single type circuits. We have manufactured flexible complementary inverters using pentacene and amorphous indium gallium zinc oxide (IGZO) for the p-channel and n-channel, respectively. The circuits were fabricated on polyimide (PI) substrate. Firstly, a thin poly-4-vinyl phenol (PVP) layer was spin coated on PI substrate to make a smooth surface with rms surface roughness of 0.3 nm, which was required to grow high quality IGZO layers. Then, Ni gate electrode was deposited on the PVP layer by e-beam evaporator. 400-nm-thick PVP and 20-nm-thick ALD Al2O3 dielectric was deposited in sequence as a double gate dielectric layer for high flexibility and low leakage current. Then, IGZO and pentacene semiconductor layers were deposited by rf sputter and thermal evaporator, respectively, using shadow masks. Finally, Al and Au source/drain electrodes of 70 nm were respectively deposited on each semiconductor layer using shadow masks by thermal evaporator. The characteristics of TFTs and inverters were evaluated at different bending radii. The applied strain led to change in voltage transfer characteristics of complementary inverters as well as source-drain saturation current, field effect mobility and threshold voltage of TFTs. The switching threshold voltage of fabricated inverters was decreased with increasing bending radius, which is related to change in parameters of TFTs. Throughout the bending experiments, relationship between circuit performance and TFT characteristics under mechanical deformation could be elucidated.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2011년도 제40회 동계학술대회 초록집
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• pp.479-479
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• 2011

Flexible inverters based on complementary thin-film transistor (CTFTs) are important because they have low power consumption and other advantages over single type TFT inverters. In addition, integrated CTFTs in flexible electronic circuits on low-cost, large area and mechanically flexible substrates have potentials in various applications such as radio-frequency identification tags (RFIDs), sensors, and backplanes for flexible displays. In this work, we introduce flexible complementary inverters using pentacene and amorphous indium gallium zinc oxide (IGZO) for the p-channel and n-channel, respectively. The CTFTs were fabricated on polyimide (PI) substrate. Firstly, a thin poly-4-vinyl phenol (PVP) layer was spin coated on PI substrate to make a smooth surface with rms surface roughness of 0.3 nm, which was required to grow high quality IGZO layers. Then, Ni gate electrode was deposited on the PVP layer by e-beam evaporator. 400-nm-thick PVP and 20-nm-thick ALD Al2O3 dielectric was deposited in sequence as a double gate dielectric layer for high flexibility and low leakage current. Then, IGZO and pentacene semiconductor layers were deposited by rf sputter and thermal evaporator, respectively, using shadow masks. Finally, Al and Au source/drain electrodes of 70 nm were respectively deposited on each semiconductor layer using shadow masks by thermal evaporator. Basic electrical characteristics of individual transistors and the whole CTFTs were measured by a semiconductor parameter analyzer (HP4145B, Agilent Technologies) at room temperature in the dark. Performance of those devices then was measured under static and dynamic mechanical deformation. Effects of cyclic bending were also examined. The voltage transfer characteristics (Vout- Vin) and voltage gain (-dVout/dVin) of flexible inverter circuit were analyzed and the effects of mechanical bending will be discussed in detail.

• 한국전기전자재료학회논문지
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• 제16권12S호
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• pp.1187-1194
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• 2003

A BCl$_3$/Ne plasma chemistry was used to etch Ga-based (GaAs, AIGaAs, GaSb) and In-based (InGaP, InP, InAs and InGaAsP) compound semiconductors in a Planar Inductively Coupled Plasma (ICP) reactor. The addition of the Ne instead of Ar can minimize electrical and optical damage during dry etching of III-V semiconductors due to its light mass compared to that of Ar All of the materials exhibited a maximum etch rate at BCl$_3$ to Ne ratios of 0.25-0.5. Under all conditions, the Ga-based materials etched at significantly higher rates than the In-based materials, due to relatively high volatilities of their trichloride etch products (boiling point CaCl$_3$ : 201 $^{\circ}C$, AsCl$_3$ : 130 $^{\circ}C$, PCl$_3$: 76 $^{\circ}C$) compared to InCl$_3$ (boiling point : 600 $^{\circ}C$). We obtained low root-mean-square(RMS) roughness of the etched sulfate of both AIGaAs and GaAs, which is quite comparable to the unetched control samples. Excellent etch anisotropy ( > 85$^{\circ}$) of the GaAs and AIGaAs in our PICP BCl$_3$/Ne etching relies on some degree of sidewall passivation by redeposition of etch products and photoresist from the mask. However, the surfaces of In-based materials are somewhat degraded during the BCl$_3$/Ne etching due to the low volatility of InCl$_{x}$./.

• Current Optics and Photonics
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• 제1권4호
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• pp.364-371
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• 2017

Compared to one made of glass, an aluminum mirror features light weight, compact design, low cost, and quick manufacturing. Reflective mirrors and supporting structures can be made from the same material, to improve the athermal performance of the system. With the rapid development of ultraprecise machining technologies, the field of applications for aluminum mirrors has been developed rapidly. However, most of them are rotationally symmetric in shape, and are used for infrared applications. In this paper, the design and manufacture of an off-axis aluminum mirror used for a three-mirror-anastigmat (TMA) optical system at visible wavelengths is presented. An optimized, lightweight design provides a weight reduction of more than 40%, while the surface deformation caused by earth's gravity can meet the required tolerance. The two pieces of an off-axis mirror can be diamond-turned simultaneously in one setup. The centrifugal deformation of the off-axis mirror during single-point diamond turning (SPDT) is simulated through the finite-element method (FEM). The techniques used to overcome centrifugal deformation are thoroughly described in this paper, and the surface error is reduced to about 1% of the original value. After post-polishing, the form error is $1/30{\lambda}$ RMS and the surface roughness is better than 5 nm Ra, which can meet the requirements for visible-light imaging.

• 한국재료학회지
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• 제13권4호
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• pp.266-270
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• 2003

We studied BCl$_3$ dry etching of GaAs in a planar inductively coupled plasma system. The investigated process parameters were planar ICP source power, chamber pressure, RIE chuck power and gas flow rate. The ICP source power was varied from 0 to 500 W. Chamber pressure, RIE chuck power and gas flow rate were controlled from 5 to 15 mTorr, 0 to 150 W and 10 to 40 sccm, respectively. We found that a process condition at 20 sccm $BCl_3$ 300 W ICP, 100 W RIE and 7.5 mTorr chamber pressure gave an excellent etch result. The etched GaAs feature depicted extremely smooth surface (RMS roughness < 1 nm), vertical sidewall, relatively fast etch rate (> $3000\AA$/min) and good selectivity to a photoresist (> 3 : 1). XPS study indicated a very clean surface of the material after dry etching of GaAs. We also noticed that our planar ICP source was successfully ignited both with and without RIE chuck power, which was generally not the case with a typical cylindrical ICP source, where assistance of RIE chuck power was required for turning on a plasma and maintaining it. It demonstrated that the planar ICP source could be a very versatile tool for advanced dry etching of damage-sensitive compound semiconductors.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2013년도 제44회 동계 정기학술대회 초록집
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• pp.352-352
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• 2013

국내 에너지 소비량의 21.6%가 건물 분야에 소비되고 있다. 창호는 벽체에 비해 8~10배 이상 낮은 단열 특성을 가지기 때문에 열 손실량이 크다. 유리는 창호를 이루는 요소 중 가장 큰 면적을 차지하고 있으며, 창호의 단열성능을 2배로 향상시키면 30% 이상 건물의 에너지 절감 효과를 가질 수 있다. 창호의 단열 성능을 향상시키기 위해서 Low-e(emissivity) 기술 연구가 진행 중이다. 이번 실험에서는 RF 마그네트론 스퍼터링 시스템을 사용하여 XG 유리기판 위에 ZnO박막을 증착하고, evaporator 장비를 사용하여 metal층인 Ag를 증착하였다. 그리고 다시 한번 ZnO박막을 증착하였다. Low-e 연구에 활용할 수 있는지를 확인하기 위해 XRD, AFM, 투과도를 측정하였다. ZnO박막의 증착 조건은 초기압력 $3.0{\times}10^{-6}$ Torr, 공정압력 $2.0{\times}10^{-2}$ Torr, RF파워 30 W, Ar gas는 50 sccm, 증착온도는 상온으로 하였다. Metal층인 Ag를 증착하기 위해 evaporator의 증착 조건은 Rotate rate 2 rpm, voltage 0.3V, 공정압력 $5.0{\times}10^{-6}$ Torr이며, 변수로 Ag두께를 3,5,7,9,11,13,15 nm로 하였다. AFM 측정결과 Ag두께가 증가할수록 RMS roughness값이 높아졌으며, 최소 0.71 nm의 거칠기를 가지는 것을 확인하였다. XRD분석결과 37도 부근의 피크가 발생하여 ZnO 박막이 결정질 구조임을 확인할 수 있었다. 그리고 UV-Visible-NIR 분광 광도계를 이용하여 광학적 투과를 측정한 결과 Ag두께가 13 nm일 때 가시광 영역의 투과도가 최대 75%, 적외선 영역의 투과도가 최소 28%로 좋은 차단 특성을 가지는 것을 확인하였다. 위 결과들로 ZnO 박막이 Low-e 기술에 활용될 수 있음을 확인하였다.

• 한국전기전자재료학회논문지
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• 제30권4호
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• pp.199-203
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• 2017

$ZrO_2/PSS$ thin film with a high refractive index was fabricated on a glass substrate by a layer-by-layer self-assembly method. The surface morphology and thickness of the fabricated $ZrO_2/PSS$ thin films were measured as a function of the number of $(ZrO_2/PSS)n$. As the number of $(ZrO_2/PSS)n$ increased from n = 5 to n = 20, RMS roughness decreased from 29.01 nm to 8.368 nm. The $ZrO_2$ thin films exhibited high transmittance of 85% or more; and the 15-bilayer thin film exhibited the highest transmittance among the samples. The transmittance of the fabricated $(ZrO_2/PSS)_{15}$ thin film was ca. 90.8% in the visible range. The refractive index of the glass substrate coated by a $(ZrO_2/PSS)_{15}$ thin film with a thickness of 160 nm increased from ca. 1.52 to 1.74 at the 632 nm wavelength.

• 한국재료학회:학술대회논문집
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• 한국재료학회 2009년도 춘계학술발표대회
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• pp.26.2-26.2
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• 2009

이 논문은 반응성 $BCl_3$ 플라즈마로 GaAs의 건식 식각을 진행한 후 그 결과에 대하여 연구 분석 한 것이다. 이 때 사용한 식각 공정 변수는 $BCl_3$ 플라즈마에서의 가스유량, 공정 압력과 RIE 척 파워의 변화이다. 먼저 공정 압력을 75 mTorr 고정시킨 후 $BCl_3$ 유량을 변화 (2.5~10 sccm)해서 실험하였다. 또한 BCl3의 유량을 5 sccm으로 고정시킨 후 공정압력을 변화(47~180 mTorr)해서 식각 실험을 실시하였다. 마지막으로 47 mTorr와 100 mTorr 의 각각의 공정압력에서 RF 척 파워를 변화시켜 (50~200 W) 실험하였다. GaAs 플라즈마 식각이 끝난 후 표면단차 측정기 (Surface profiler)를 사용하여 표면의 단차와 거칠기를 분석하였다. 그 후 그 결과를 이용하여 식각율 (Etch rate), 식각 표면 거칠기 (RMS roughness), 식각 선택비 (Selectivity) 등의 식각 특성평가를 하였다. 또한 식각 공정 중에 샘플 척에 발생하는 자기 바이어스와 $BCl_3$ 플라즈마 가스를 광학 발광 분석기 (Optical Emission Spectroscopy)를 이용하여 플라즈마의 상태를 실시간으로 분석하였다. 이 실험 결과에 따르면 공정 압력의 증가는 샘플 척의 자기 바이어스의 값을 감소시켰다. $BCl_3$ 압력 변화에 의한 GaAs의 식각 결과를 정리하면 5 sccm의 $BCl_3$ 가스유량과 RF 척 파워를 100 W로 고정시켰을 때 식각율은 47 mTorr에서 가장 높았으며, 그 값은 $0.42{\mu}m/min$ 이었다. GaAs의 식각 속도는 공정압력이 증가할수록 감소하였으며 180 mTorr에서는 식각율이 $0.03{\mu}m/min$로 거의 식각되지 않았다. 또한 공정압력을 75 mTorr, RF 척 파워를 100 W로 고정시키고, $BCl_3$ 가스유량을 2.5 sccm에서 10 sccm까지 변화시켰을 때, 10 sccm 의 $BCl_3$ 가스유량에서 가장 높은 식각율인 $0.87{\mu}m/min$이 측정되었다. 압력에 따른 GaAs의 식각 후 표면 거칠기는 최대 2 nm 정도로 비교적 매끈하였으며, 거의 식각되지 않은 180mTorr의 조건에서는 약 1 nm로 낮아졌다. 본 실험 조건에서 GaAs의 감광제에 대한 식각 선택비는 최대 약 3:1 이내였다.