• Title/Summary/Keyword: reverse current

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Energy Conversion Efficiency Improvement of Piezoelectric Micropower Generator Adopting Low Leakage Diodes (저누설 다이오드를 사용한 저전력 압전발전기의 효율 개선에 관한 연구)

  • Kim, Hye-Joong;Kang, Sung-Muk;Kim, Ho-Seong
    • The Transactions of The Korean Institute of Electrical Engineers
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    • v.56 no.5
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    • pp.938-943
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    • 2007
  • In this paper, we show that, in case of piezoelectric micropower generator, just replacing Schottky diodes in the bridge rectifier with ultra-low reverse leakage current diodes improves the mechanical-to-electrical energy conversion efficiency by more than 100%. Experimental and PSPICE simulation results show that, due to the ultra-low leakage current, the charging speed of the circuit employing PAD1 is higher than that of the circuit employing Schottky diodes and the saturation voltage of the circuit employing PAD1 is also higher. This study suggests that , when the internal impedance of source is very large (a few tens of $M{\Omega}$) such that maximum charging current is a few microamperes or less, in order to realize literally the energy scavenging system, ultra-low reverse leakage current diodes should be used for efficient energy conversion. Since low-level vibration is ubiquitous in the environment ranging from human movement to large infrastructures and the mechanical-to-electrical energy conversion efficiency is much more critical for use of these vibrations, we believe that the improvement in the efficiency using ultra-low leakage diodes, as found in this work, will widen greatly the application of piezoelectric micropower generator.

Effects of Electroplating Condition on Micro Bump of Multi-Layer Build-Up PCB (다층 PCB 빌드업 기판용 마이크로 범프 도금에 미치는 전해조건의 영향)

  • Seo, Min-Hye;Hong, Hyun-Seon;Jung, Woon-Suk
    • Korean Journal of Materials Research
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    • v.18 no.3
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    • pp.117-122
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    • 2008
  • Micro-sized bumps on a multi-layered build-up PCB were fabricated by pulse-reverse copper electroplating. The values of the current density and brightener content for the electroplating were optimized for suitable performance with maximum efficiency. The micro-bumps thus electroplated were characterized using a range of analytical tools that included an optical microscope, a scanning electron microscope, an atomic force microscope and a hydraulic bulge tester. The optical microscope and scanning electron microscope analyses results showed that the uniformity of the electroplating was viable in the current density range of $2-4\;A/dm^2$; however, the uniformity was slightly degraded as the current density increased. To study the effect of the brightener concentration, the concentration was varied from zero to 1.2 ml/L. The optimum concentration for micro-bump electroplating was found to be 0.6 ml/L based on an examination of the electroplating properties, including the roughness, yield strength and grain size.

Effects of Carrier Leakage on Photoluminescence Properties of GaN-based Light-emitting Diodes at Room Temperature

  • Kim, Jongseok;Kim, Seungtaek;Kim, HyungTae;Choi, Won-Jin;Jung, Hyundon
    • Current Optics and Photonics
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    • v.3 no.2
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    • pp.164-171
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    • 2019
  • Photoluminescence (PL) properties of GaN-based light-emitting diodes (LEDs) were analyzed to study the effects of carrier leakage on the luminescence properties at room temperature. The electrical leakage and PL properties were compared for LEDs showing leakages at forward bias and an LED with an intentional leakage path formed by connecting a parallel resistance of various values. The leakages at the forward bias, which could be observed from the current-voltage characteristics, resulted in an increase in the excitation laser power density for the maximum PL efficiency (ratio of PL intensity to excitation power) as well as a reduction in the PL intensity. The effect of carrier leakages on PL properties was similar to the change in PL properties owing to a reduction of the photovoltage by a reverse current since the direction of the carrier movement under photoexcitation is identical to that of the reverse current. Valid relations between PL properties and electrical properties were observed as the PL properties deteriorated with an increase in the carrier leakage. The results imply that the PL properties of LED chips can be an indicator of the electrical properties of LEDs.

High Dose $^{60}Co\;{\gamma}$-Ray Irradiation of W/GaN Schottky Diodes

  • Kim, Jihyun;Ren, F.;Schoenfeld, D.;Pearton, S.J.;Baca, A.G.;Briggs, R.D.
    • JSTS:Journal of Semiconductor Technology and Science
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    • v.4 no.2
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    • pp.124-127
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    • 2004
  • W/n-GaN Schottky diodes were irradiated with $^{60}Co\;{\gamma}-rays$ to doses up to 315Mrad. The barrier height obtained from current-voltage (I-V) measurements showed minimal change from its estimated initial value of ${\sim}0.4eV$ over this dose range, though both forward and reverse I-V characteristics show evidence of defect center introduction at doses as low as 150 Mrad. Post irradiation annealing at $500^{\circ}C$ increased the reverse leakage current, suggesting migration and complexing of defects. The W/GaN interface is stable to high dose of ${\gamma}-rays$, but Au/Ti overlayers employed for reducing contact sheet resistance suffer from adhesion problems at the highest doses.

Ultraviolet Photodetection Properties of ZnO/Si Heterojunction Diodes Fabricated by ALD Technique Without Using a Buffer Layer

  • Hazra, Purnima;Singh, S.K.;Jit, S.
    • JSTS:Journal of Semiconductor Technology and Science
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    • v.14 no.1
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    • pp.117-123
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    • 2014
  • The fabrication and characterization of a Si/ZnO thin film heterojunction ultraviolet photodiode has been presented in this paper. ZnO thin film of ~100 nm thick was deposited on <100> Silicon (Si) wafer by atomic layer deposition (ALD) technique. The Photoluminescence spectroscopy confirms that as-deposited ZnO thin film has excellent visible-blind UV response with almost no defects in the visible region. The room temperature current-voltage characteristics of the n-ZnO thin film/p-Si photodiodes are measured under an UV illumination of $650{\mu}W$ at 365 nm in the applied voltage range of ${\pm}2V$. The current-voltage characteristics demonstrate an excellent UV photoresponse of the device in its reverse bias operation with a contrast ratio of ~ 1115 and responsivity of ~0.075 A/W at 2 V reverse bias voltage.

A New IGBT Gate Driver for Hard Switching Inverter (하드 스위칭 인버터를 위한 새로운 IGBT용 게이트 드라이버)

  • Jung, Y.C.;Kim, H.S.;Jeong, J.H.;Lee, B.W.;Cho, Gyu-Hyeong
    • Proceedings of the KIEE Conference
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    • 1993.07b
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    • pp.746-748
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    • 1993
  • To overcome the problem of the diode reverse recovery in high switching frequency inverter, a new gate drive scheme is proposed for IGBT in this paper. Using this circuit, the reverse recovery current can be controlled and faster switching time can be achieved for hard switching inverter. The over-current protection method, which is suitable for the proposed gate driver, is also presented. The operation of the proposed circuit is investigated and its usefulness is verified through the experimental results.

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$CH_4N_2S$$C_{10}H_{13}NO_3S$ 첨가가 Ni 패턴 상의 구리도금 형상에 미치는 영향

  • Lee, Jin-Hyeong;Lee, Ju-Yeol;Kim, Man
    • Proceedings of the Korean Institute of Surface Engineering Conference
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    • 2009.10a
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    • pp.155-155
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    • 2009
  • The copper plating was deposited by pulse reverse current (PRC) method with additives. The all specimens were first immersted in 10% H2SO4 for 10 minutes, and then were rinsed with deionized water. The current densities of forward pulse were 400mA/$cm^2$, and those of reverse pulse were 1900mA/$cm^2$ and 100mA/$cm^2$. Results are compared for different additives for pulse plating conditions. When it added in Only CH4N2S (TU) or only C10H13NO3S (SVH), the effect of surface side growth of Cu was not different. But when it added in TU and SVH, surface side growth of Cu decreased. Polarization curves were measured from OCP to -0.7 V at a rate of 1mV/sec. Each specimen was observed under the PHENOM to see surface morphology.

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Reliability Analysis in PtSi-nSi Devices with Concentration Variations of Junction Parts (접합 부분의 농도 변화를 갖는 PtSi-nSi 소자에서 신뢰성 분석)

  • 이용재
    • Journal of the Korea Institute of Information and Communication Engineering
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    • v.3 no.1
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    • pp.229-234
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    • 1999
  • We analyzed the reliability characteristics in platinum schottky diodes with variations of n-type silicon substrates concentrations and temperature variations of measurements. The parameters of reliability measurement analysis are saturation current. turn-on voltage and ideality factor in the forward bias, the breakdown voltage in the reverse bias with device shapes. The shape of devices are square type and long rectangular type for edge effect. As a result, we analyzed that the forward turn-on voltage, barrier height, dynamic resistance and reverse breakdown voltage were decreased but ideality factor and saturation current were increased by increased concentration in platinum and n-silicon junction parts. In measurement temperature(RT, $50^{\circ}C$, $75^{\circ}C$), the extracted electrical parameter values of reliability characteristics were increased at the higher temperature under the forward and reverse bias. The long rectangular type devices were more decreased than the square type in reverse breakdown voltage by tunneling effects of edge part.

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A Effect of Saturable Reactor-Resistor Pair on High Power SCR Chopper (대전력 SCR 초퍼에서 가포하리액터-저항짝의 효과)

  • 강민구;조규형
    • The Transactions of the Korean Institute of Electrical Engineers
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    • v.37 no.7
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    • pp.442-447
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    • 1988
  • Saturable reactor-resistor pair is proposed as a part of snubber and applied to a hard commutation chopper. SCR turn off process is modeled to simulate the hard commutation chopper. State equations are derived for each mode of the chopper and they are solved by Runge-Kutta 4th order method. It is shown that the reverse voltage spike and reverse dv/dt can be minimized by applying saturable reactor-resistor pair to the chopper which controls peak reverse recovery current and damping factor. Saturable reactor-resistor pair can be used to reduced SCR power loss and value of snubber capacitor and can be applied to high power thyristor devices.

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Design and Implementation of Location Utility Service for LBS

  • Kim, K.S.;Kim, J.C.;Lee, J.W.;Park, J.H.
    • Proceedings of the KSRS Conference
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    • 2003.11a
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    • pp.849-851
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    • 2003
  • A location-based service or LBS in a cellular telephone network is a service provided to the subscriber based on his current geographic location. This position can be known by user entry or a GPS receiver that he carries with him, but most often the term implies the use of a function built into the cell network that uses the known geographic coordinates of the base stations through which the communication takes place. One implication is that knowledge of the coordinates is owned and controlled by the network operator, and not by the end user. Location utility service provides two kinds of functions, geocoder and reverse geocoder. Geocoder converts an address into a coordinate and reverse geocoder changes a coordinate into an address. Because location utility service is the first step to progress LBS, various servises such as directory, routing, presentation, and etc require to access that. In this paper, we will describe the architecture of LBS platform and the concept and the role of location utility service.

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