• 제목/요약/키워드: resole curing

검색결과 2건 처리시간 0.017초

Thermal Curing Behavior and Tensile Properties of Resole Phenol-Formaldehyde Resin/Clay/Cellulose Nanocomposite

  • Park, Byung-Dae;Kadla, John F.
    • Journal of the Korean Wood Science and Technology
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    • 제40권2호
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    • pp.110-122
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    • 2012
  • This study investigated the effects of layered clay on the thermal curing behavior and tensile properties of resole phenol-formaldehyde (PF) resin/clay/cellulose nanocomposites. The thermal curing behavior of the nanocomposite was characterized using conventional differential scanning calorimetry (DSC) and temperature modulated (TMDSC). The addition of clay was found to accelerate resin curing, as measured by peak temperature ($T_p$) and heat of reaction (${\Delta}H$) of the nanocomposite’ curing reaction increasing clay addition decreased $T_p$ with a minimum at 3~5% clay. However, the reversing heat flow and heat capacity showed that the clay addition up to 3% delayed the vitrification process of the resole PF resin in the nanocomposite, indicating an inhibition effect of the clay on curing in the later stages of the reaction. Three different methods were employed to determineactivation energies for the curing reaction of the nanocomposite. Both the Ozawa and Kissinger methods showed the lowest activation energy (E) at 3% clay content. Using the isoconversional method, the activation energy ($E_{\alpha}$) as a function of the degree of conversion was measured and showed that as the degree of cure increased, the $E_{\alpha}$ showed a gradual decrease, and gave the lowest value at 3% nanoclay. The addition of clay improved the tensile strengths of the nanocomposites, although a slight decrease in the elongation at break was observed as the clay content increased. These results demonstrated that the addition of clay to resole PF resins accelerate the curing behavior of the nanocomposites with an optimum level of 3% clay based on the balance between the cure kinetics and tensile properties.

레졸로 가교된 고무 복합체의 열노화 거동 (Thermal Aging Behaviors of Resole-Cured Rubber Composites)

  • 최성신;하성호;우창수
    • Elastomers and Composites
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    • 제40권4호
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    • pp.284-289
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    • 2005
  • 레졸로 가교된 NR 복합체의 열노화에 의한 가교밀도변화를 연구하였다. 노화 온도는 $50-90^{\circ}C$였다. 가교밀도 변화는 노화 온도가 올라감에 따라 증가하다 감소하였다. 가교밀도 변화 정도는 레졸 함량이 증가함에 따라 감소하였다. 열노화에 의한 가교밀도의 증가는 레졸로 마감된 매달린 작용기들의 결합 반응과 메틸올이나 메틸렌 퀴논 중간체를 갖는 매달린 작용기의 가교 반응으로 설명하였다. 그리고 열노화에 의한 가교밀도의 감소는 디메틸렌 에테르 연결을 갖는 기존 레졸 가교의 분해로 설명하였다.