• Title/Summary/Keyword: resin film infiltration

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Fabrication of Ceramic 3D Integration Technology for Ink-jet Printing (Ink-jet Printing을 이용한 3D-Integration 구현)

  • Hwang, Myung-Sung;Kim, Ji-Hoon;Kim, Hyo-Tae;Yoon, Young-Joon;Kim, Jong-Hee;Moon, Joo-Ho
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2010.06a
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    • pp.332-332
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    • 2010
  • We have successfully demonstrated the inkjet printing method to create $Al_2O_3$ films withouWe have successfully demonstrated the inkjet printing method to create $Al_2O_3$ films without a high temperature sintering process. In order to remove the coffee ring effect in the ink drop, we have introduced a co-solvent system in order to create Marangoni flow in the ink drop, which leads to the dense packing of ceramic powders on the substrate during inkjet process. The packing density of the Inkjet-printed $Al_2O_3$ films is around 60% (max. 70%) which is very high compared to the value obtained from the same material films by other conventional methods such as film casting, dip coating process, etc. The voids inside the films (which are around 40% of the entire film volume) are filled with the polymer resin (Cyanate ester) by the infiltration process. This resin infiltration is also implemented by the inkjet printing process right after the Ah03 film ink-jetting process. The microstructures of the printed $Al_2O_3$ films are investigated by Scanning Electron Microscope (SEM) to understand the degree of packing density in the printed films. The inkjet-printed $Al_2O_3$ films have been characterized to investigate its thickness and roughness. Quality factor of the printed $Al_2O_3$ film is also measured to be over 300 at 1MHz.

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Transverse Flow and Process Modeling on the Polymer Composite with 3-Dimensionally Stitched Woven Fabric

  • Lee, Geon-Woong;Lee, Sang-Soo;Park, Min;Kim, Junkyung;Soonho Lim
    • Macromolecular Research
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    • v.10 no.4
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    • pp.194-203
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    • 2002
  • In resin infusion process(RIP), the fiber and the resin are in contact with each other for an impregnation step and often results in flow-induced defects such as poor fiber wetting and void formation. Resin flow characteristics in transverse direction and process modeling for woven fabric were studied, and the process modeling was applied to the manufacturing of hybrid composite materials. This study also considered the compressibility of woven fabrics in a series of compression force, and it was fitted well to an elastic model equation. Void formation was varied with the processing conditions in the stage of manufacturing composites using RIP. It was concluded from this study that proper combination of pressure build-up and dynamic heating condition makes important factor for flow-induced composite processing.

Variation of Dielectric Constant with Various Particle Size and Packing Density on Inkjet Printed Hybrid $BaTiO_3$ Films

  • Lim, Jong-Woo;Kim, Ji-Hoon;Yoon, Young-Joon;Yoon, Ho-Gyu;Kim, Jong-Hee
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2010.06a
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    • pp.271-271
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    • 2010
  • $BaTiO_3$(BT) has high permittivity so that has been applied to dielectric and insulator materials in 3D system-level package integration. In order to achieve excellent performance of device, the BT layer should be highly dense. In this study, BT thick films were prepared by the inkjet printing method. And these films were cured at $280^{\circ}C$ after infiltration of polymer resin. As a result, we have successfully fabricated not only the inkjet-printed hybrid BT film but also metal-insulator-metal(MIM) capacitor without sintering process. Changes in the dielectric constant of BT hybrid film with particle size and packing density were investigated. The dielectric constant was increased with increasing packing density and particle size. Further, the BT hybrid film using two different size particles had even higher packing density and dielectric constant.

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Compressive Shear and Bending Performance of Compressed Laminated Wood after Microwave Heating

  • Park, Cheul-Woo;Lim, Nam-Gi
    • Journal of the Korea Institute of Building Construction
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    • v.12 no.5
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    • pp.539-547
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    • 2012
  • To manufacture laminated wood with improved mechanical properties by providing uniform adhesiveness, the adhesive was applied and the plate adhesive was laminated on the wood surface. Then, after laminating the wood on the top part of the adhesivebond, it was heated and dried while the adhesive was stiffened using microwaves, and the test piece was manufactured by compressing it with the press machine for thirty minutes. The temperature and the water content were examined according to the heating time of the wood heated with the microwave, and testing was conducted on the shear strength and flexural strength of the wood. In addition, the microstructure of the adhesive bond between the wood was recorded to confirm the penetrabilityinto the wood structure for the adhesive. After the test was conducted, it was found that the test piece manufactured with wood that has its water content leveled with the microwave heating showed improved shear strength and bending strength compared to the standard test piece. With regard to adhesives, liquefied polyvinyl acetate resin and plate's PVB resin were found to have superior adhesive strength. Also, after filming the cellular microstructure, it was found that when the laminated wood is heated with microwaves, the infiltration of the adhesive into the inside of the wood becomes easy, which makes it effective for improving adhesiveness.

EFFECT OF ULTRASONIC VIBRATION ON ENAMEL AND DENTIN BOND STRENGTH AND RESIN INFILTRATION IN ALL-IN-ONE ADHESIVE SYSTEMS (All-in-one 접착제에서 초음파진동이 법랑질과 상아질의 결합강도와 레진침투에 미치는 영향)

  • Lee, Bum-Eui;Jang, Ki-Taeg;Lee, Sang-Hoon;Kim, Chong-Chul;Hahn, Se-Hyun
    • Journal of the korean academy of Pediatric Dentistry
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    • v.31 no.1
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    • pp.66-78
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    • 2004
  • The objective of this study was to apply the vibration technique to reduce the viscosity of bonding adhesives and thereby compare the bond strength and resin penetration in enamel and dentin achieved with those gained using the conventional technique and vibration technique. For enamel specimens, thirty teeth were sectioned mesio-distally. Sectioned two parts were assigned to same adhesive system but different treatment(vibration vs. non-vibration). Each specimen was embedded in 1-inch inner diameter PVC pipe with a acrylic resin. The buccal and lingual surfaces were placed so that the tooth and the embedding medium were at the same level. The samples were subsequently polished silicon carbide abrasive papers. Each adhesive system was applied according to its manufacture's instruction. Vibration groups were additionally vibrated for 15 seconds before curing. For dentin specimen, except removing the coronal part and placing occlusal surface at the mold level, the remaining procedures were same as enamel specimen. Resin composite(Z250. 3M. U.S.A.) was condensed on to the prepared surface in two increments using a mold kit(Ultradent Inc., U.S.A.). Each increments was light cured for 40 seconds. After 24 hours in tap water at room temperature, the specimens were thermocycled for 1000cycles. Shear bond strengths were measured with a universal testing machine(Instron 4465, England). To investigate infiltration patterns of adhesive materials, the surface of specimens was examined with scanning electron microscope. The results were as follows: 1. In enamel the mean values of shear bond strengths in vibration groups(group 2, 4, 6) were greater than those of non-vibration group(group 1, 3, 5). The differences were statistically significant except AQ bond group. 2. In dentin, the mean values of shear bond strengths in vibration groups(group 2, 4, 6) were greater than those of non-vibration groups(group 1, 3, 5). But the differences were not statistically significant except One-Up Bond F group. 3. The vibration group showed more mineral loss in enamel and longer resin tag and greater number of lateral branches in dentin under SEM examination.

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Fabrication of Inkjet-printed and Non-sintered $BaTiO_3$ Dielectric Film

  • Lim, Jong-Woo;Kim, Ji-Hoon;Kim, Hyo-Tea;Yoon, Young-Joon;Yoon, Ho-Gyu;Kim, Jong-Hee
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2009.11a
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    • pp.80-80
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    • 2009
  • $BaTiO_3$ has high permittivity so that has been applied to dielectric and insulator materials in 3D system-level package integration. In order to achieve excellent performance of device, the $BaTiO_3$ layer should be highly dense. In this study, $BaTiO_3$ thick films were prepared by the inkjet printing method using 4 vol.% $BaTiO_3$ colloidal inks and cured at $28^{\circ}C$ for 5 h after infiltration of polymer resin for non-sintered process using 3 vol.% cyanate ester emulsion ink. From the obtained results. packing density was determined to be improved by overlapping rabbit ears which were generated by coffee ring effect. We also calculated the packing densities of the films and correlated these packing densities to the measured permittivity of the films.

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