• 대한기계학회논문집A
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• 제28권5호
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• pp.532-538
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• 2004

MEMS technology applying to the sensors and micro-electro devices is complete system. These microsystems are made by variable processes. Especially, the mentallization process has very important functions to transfer the power operating the sensor and signal induced from sensor part. But in the structures of MEMS the local stress concentration and deformation are often yielded by an irregular geometrical shape and different constraint. Therefore, this paper studies the effect of supporting type and thickness ratio about thin film of the substrate on the residual stress variation when the thermal loads is applied to the multi-layer thin film fabricated by metallization process. Specimens were made from several materials such as Al, Au and Cu. Then, uniform thermal load was applied, repeatedly. The residual stress was measured by FE Analysis and nano-indentation method using AFM. Generally, the specimen made of Al induced the larger residual stress than that of made of other materials. Specimen made of Cu and Au having the low thermal expansion coefficient induces the minimum residual stress. Similarly, the lowest indentation length was measured by nano-indentation method in the Si/Au/Cu specimen. Particularly, clusters are created in the specimen made of Cu by thermal load and the indentation length became increasingly large by cluster formation.

• 동력기계공학회지
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• 제15권6호
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• pp.67-72
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• 2011

In the present study, crack healing effect and residual stress of $Al_2O_3$ ceramics were investigated by changing the sintering temperature and heat treatment conditions. And also it was investigated that the influence of different filler loadings of nano-sized SiC particles on the crack healing behavior of $Al_2O_3$ ceramics. The test samples were characterized by three point bend flexural tests to evaluate their mechanical properties. The morphological changes were studied by FE-SEM and EDS. The test results indicated that the $Al_2O_3$ with nano-sized SiC ceramics sintered at $1800^{\circ}C$ were showed highest density. Sintering temperature at $1800^{\circ}C$, the bending strength of heat treatment in air atmosphere specimens showed about 42 % increment in comparison to the un-heat treated specimens. The cracked specimens can be healed by heat treatment in vacuum atmosphere but the crack healing effect of $Al_2O_3$ ceramics, which is heat treated in air atmosphere was higher than that of heat treated in vacuum atmosphere. $Al_2O_3$ with 30 wt% of SiC ceramics indicated higher crack healing ability than that with 15 wt% of SiC ceramics. The FE-SEM images showed that the median cracks and pores were disappeared after heat treatment in air.

• 수도
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• 제23권1_2호통권76_77호
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• pp.50-60
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• 1996

• 한국세라믹학회지
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• 제33권8호
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• pp.871-876
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• 1996

It is believed that fly ash could be suitable for preparing the sialon by carbothermal reduction method because the total amount of SiO2 and Al2O3 is above 80% and the unburned residual carbon is above 5% within the fly ash. The effects of reaction temperature (1350, 1400, 145$0^{\circ}C$) reaction time (1, 5, 10 hours) and the amount of carbon additions (C/SiO2=2, 3, 4 mole) on the $\beta$-sialon synthesis were obserbed, It was conformed that $\beta$-sialon (Z=2.15~2.18) was formed as major phase under all of the synthesis conditions and small amount of Si2ON2 SiC, AlN and Si3N4 was formed depending on the synthesis conditions. FeSix intermetal-lic compound was formed above 140$0^{\circ}C$ reaction temperature due to the large amount of iron oxides within the raw fly ash.

• 전자공학회논문지A
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• 제32A권12호
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• pp.122-129
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• 1995

The most important feature of a-Si TFT is dense localized states such as dangling bonds which exist in tis bandgap. Electrons trapped by localized states dominate the potential distribution in the active a-Si region ,and influence the performance of a-Si TFT. In this paper, we describe the electrical characteristics of a-Si TFT with respect to trap distribution within bandgap, electron mobility and interface states using 2-Dimensional device simulator and compare the result of simulation with measurements. Using the mixed-mode simulator, we can predict the potential variation of pixel which causes residual image problem during the turn-off of a-Si TFT driving circuit. Therefore it is possible to consider trade-off between potential variation of pixel and turn-on current of a-Si TFT for the optimized driving circuit.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 1999년도 춘계학술대회 논문집
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• pp.509-512
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• 1999

Ferroelectric Sr$_2$(Nb, Ta)$_2$O$_{7}$(SNTO), La$_2$Ti$_2$O$_{7}$(LTO) thin films were prepared by sol-gel processes. SNTO, LTO thin films were spin-coated on Pt/TiO$_2$/SiO$_2$/Si(100). Pt/Ti/SiO$_2$/Si(100). PT/ZrO$_2$/SiO$_2$/Si(100) substrates. After multiple coating, dried thin films were heat-treated for decomposition of residual organics and crystallization. Dielectric and other relevant electrical properties were measured and the results showed a little possibility in ferroelectric gate random access memory devices.ces.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2007년도 하계학술대회 논문집 Vol.8
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• pp.346-347
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• 2007

Aluminum nitride (AlN) thin films were deposited on Polycrystalline (poly) 3C-SiC buffer layers using pulsed reactive magnetron sputtering. Characteristics of AlN films were investigated experimentally by means of FE-SEM, X-ray diffraction, and FT-IR, respectively. As a result, highly (002) oriented AlN thin films with almost free residual stress were achieved using 3C-SiC buffer layers. Therefore, AlN thin films grown on 3C-SiC buffer layers can be used for various piezoelectric fields and M/NEMS applications.

• 한국주조공학회지
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• 제29권5호
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• pp.204-212
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• 2009

The effects of addition of magnesium only and the simultaneous addition of magnesium and aluminum on the graphite morphology of the cast iron with the composition of 3.6wt.% and 2.5wt.%Si poured into shell stack mold were investigated. The nodularity and mechanical properties of the specimen with smaller cross-section were higher than those with langer one, when copper was not added. When the magnesium only was added, the nodularity was decreased with decreased residual magnesium content and the C. V, graphite was obtained with the magnesium content in the range of 0.010~0.015wt.%. When the magnesium and aluminum were added together, the nodularity was decreased with decreased residual magnesium and increased aluminum contents. When copper was added, the volume fraction of pearlite in the matrix, strength and hardness were higher and elongation was lower for specimen with smaller cross-section. The volume fraction of pearlite, strength and hardness were increased and the elongation was decreased with increased copper content for the specimen with C, V, graphite.

• 한국정보통신학회:학술대회논문집
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• 한국해양정보통신학회 2004년도 SMICS 2004 International Symposium on Maritime and Communication Sciences
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• pp.70-73
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• 2004

The packaging of the integrated circuits requires knowledge of ceramics and metals to accommodate the fabrication of modules that are used to construct subsystems and entire systems from extremely small components. Composite ceramics (Al$_2$O$_3$-SiO$_2$) were tested for substrates. A stress analysis was conducted for a linear work-hardening metal cylinder embedded in an infinite ceramic matrix. The bond between the metal and ceramic was established at high temperature and stresses developed during cooling to room temperature. The calculations showed that the stresses depend on the mismatch in thermal expansion, the elastic properties, and the yield strength and work hardening rate of the metal. Experimental measurements of the surface stresses have also been made on a Cu/Al$_2$O$_3$-SiO$_2$ceramic system, using an indentation technique. A comparison revealed that the calculated stresses were appreciably larger than the measured surface stresses, indicating an important difference between the bulk and surface residual stresses. However, it was also shown that porosity in the metal could plastically expand and permit substantial dilatational relaxation of the residual stresses. Conversely it was noted that pore clusters were capable of initiating ductile rupture, by means of a plastic instability, in the presence of appreciable tri-axiality. The role of ceramics for packaging of microelectronics will continue to be extremely challenging.

• Bulletin of the Korean Chemical Society
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• 제28권4호
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• pp.533-537
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• 2007

This paper describes the heteroepitaxial growth of single-crystalline 3C-SiC (cubic silicon carbide) thin films on Si (100) wafers by atmospheric pressure chemical vapor deposition (APCVD) at 1350 oC for micro/nanoelectromechanical system (M/NEMS) applications, in which hexamethyldisilane (HMDS, Si2(CH3)6) was used as a safe organosilane single-source precursor. The HMDS flow rate was 0.5 sccm and the H2 carrier gas flow rate was 2.5 slm. The HMDS flow rate was important in obtaing a mirror-like crystalline surface. The growth rate of the 3C-SiC film in this work was 4.3 μm/h. A 3C-SiC epitaxial film grown on the Si (100) substrate was characterized by X-ray diffraction (XRD), transmission electron microscopy (TEM), reflection high energy electron diffraction (RHEED), atomic force microscopy (AFM), X-ray photoelectron spectroscopy (XPS) and Raman scattering, respectively. These results show that the main chemical components of the grown film were single-crystalline 3C-SiC layers. The 3C-SiC film had a very good crystal quality without twins, defects or dislocations, and a very low residual stress.