• Journal of Korean Society of Industrial and Systems Engineering
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• v.43 no.2
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• pp.65-71
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• 2020

Worldwide plant market keeps maintaining steady growth rate and along with this trend, domestic plant market and its contractors also maintain such growing tendency. However, in spite of its external growth, win-win growth of domestic material industry that occupies the biggest share in plant industry cost portion is extremely marginal in reality. Domestic plant material suppliers are required to increase awareness of domestic material brand by securing quality and reliability of international standard through improvement of design quality superior to that of overseas material suppliers. Improvement of design quality of plant material becomes an essential element, not an option, for survival of domestic plant industry and its suppliers. Under this background, in this study, priority and importance by each evaluation index was analyzed by materializing plant design stage through survey of experts and defining evaluation index by each design stage and based on this analysis result, evaluation index of stage-gate based decision-making process that may improve design quality of plant material was suggested. It is considered that by utilizing evaluation index of stage-gate based decision-making process being suggested in this study, effective and efficient decision-making of project decision-makers would be enabled and it would be contributory to improve design quality of plant material.

• Asia-Pacific Journal of Business Venturing and Entrepreneurship
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• v.2 no.1
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• pp.15-36
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• 2007

This study attempts to investigate about the factor affecting the export performance of Korean venture companies. The ways of data collection for this study depend on documentary records, opinion investigation of experts, and the cases. The samples for this study are investigated from the Korea Chamber of Commerce and Industry and he Ministry of Commerce about the nation's 700 the small and medium export venture companies' the business showings in December 2005. The survey executed May 10th, 2006 to May 31st, 2006, for about 22 days. The survey collected total 518 copies which included telephone request and interview researched about 269 copies, direct visits 162 copies, mail survey 87 copies. This study used 500 copies except 18 copies which don't have reliability or can handle easy. The statistical analysis techniques, which are used in survey analysis, areas follows. First, it divided 2 categories which are an export strategy and other factors, then it executed factor analysis and reliability analysis. Second, it executed multiple regression analysis which can search effect export strategy and growth in each categories.

• Convergence Security Journal
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• v.7 no.3
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• pp.51-60
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• 2007

Infinite failure NHPP models presented in the literature exhibit either constant, monotonic increasing or monotonic decreasing failure occurrence rates per fault. In this paper, exponential distribution and Rayleigh distribution model was reviewed, proposes the mixture reliability model, which made out efficiency substituted for situation for failure time Algorithm to estimate the parameters used to maximum likelihood estimator and bisection method, model selection based on SSE and Kolmogorov distance, for the sake of efficient model, was employed. Analysis of failure using S27 data set for the sake of proposing shape parameter of the mixture distribution was employed. This analysis of failure data compared with the mixture distribution model and the existing model(using arithmetic and Laplace trend tests, bias tests) is presented.

• Journal of the Korea Society of Computer and Information
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• v.12 no.4
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• pp.33-42
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• 2007

Accurate predictions of software release times, and estimation of the reliability and availability of a software product require quantification of a critical element of the software testing process : test coverage. This model called Enhanced non-homogeneous poission process(ENHPP). In this paper, exponential coverage and S-shaped model was reviewed, proposes the Kappa coverage model, which maked out efficiency application for software reliability. Algorithm to estimate the parameters used to maximum likelihood estimator and bisection method, model selection based on SSE statistics and Kolmogorov distance, for the sake of efficient model, was employed. From the analysis of mission time, the result of this comparative study shows the excellent performance of Burr coverage model rather than exponential coverage and S-shaped model using NTDS data. This analysis of failure data compared with the Kappa coverage model and the existing model(using arithmetic and Laplace trend tests, bias tests) is presented.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2004.09a
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• pp.233-241
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• 2004

A new alloy definition will be presented concerning increasing demands for the board level reliability of miniaturized interconnections. The damage mechanism for LFBGA components on different board finishes is not quite understood. Further demands from mobile phones are the drop test, characterizing interface performance of different package constructions in relation to decreased pad constructions and therefore interfaces. The paper discusses the characterization of interfaces based on SnPb, SnPbXYZ, SnAgCu and SnAgCuInNd ball materials and SnAgCuInNd as solder paste, the stability after accelerated tests and the description of modified interfaces strictly related to the assembly conditions, dissolution behavior of finishes on board side and the influence of intermetallic formation. The type of intermetallic as well as the quantity of intermetallics are observed, primaliry the hardness, E modules describing the ability of strain/stress compensation. First results of board level reliability are presented after TCT-40/+150. Improvement steps from the ball formulation will be discussed in conjunction to the implementation of lead free materials In order to optimize ball materials for area array devices accelareted aging conditions like TCTs were used to analyze the board level reliability of different ball materials for BGA, LFBGA, CSP, Flip Chip. The paper outlines lead-free ball analysis in comparison to conventional solder balls for BGA and chip size packages. The important points of interest are the description of processability related to existing ball attach procedures, requirements of interconnection properties and the knowledge gained the board level reliability. Both are the primary acceptance criteria for implementation. Knowledge about melting characteristic, surface tension depend on temperature and organic vehicles, wetting behavior, electrical conductivity, thermal conductivity, specific heat, mechanical strength, creep and relaxation properties, interactions to preferred finishes (minor impurities), intermetallic growth, content of IMC, brittleness depend on solved elements/IMC, fatigue resistance, damage mechanism, affinity against oxygen, reduction potential, decontamination efforts, endo-/exothermic reactions, diffusion properties related to finishes or bare materials, isothermal fatigue, thermo-cyclic fatigue, corrosion properties, lifetime prediction based on board level results, compatibility with rework/repair solders, rework temperatures of modified solders (Impurities, change in the melting point or range), compatibility to components and laminates.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2004.09a
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• pp.211-219
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• 2004

A new alloy definition will be presented concerning increasing demands for the board level reliability of miniaturized interconnections. The damage mechanism for LFBGA components on different board finishes is not quite understood. Further demands from mobile phones are the drop test, characterizing interface performance of different package constructions in relation to decreased pad constructions and therefore interfaces. The paper discusses the characterization of interfaces based on SnPb, SnPbXYZ, SnAgCu and SnAgCuInNd ball materials and SnAgCuInNd as solder paste, the stability after accelerated tests and the description of modified interfaces stric시y related to the assembly conditions, dissolution behavior of finishes on board side and the influence of intermetallic formation. The type of intermetallic as well as the quantity of intermetallics are observed, primaliry the hardness, E modules describing the ability of strain/stress compensation. First results of board level reliability are presented after TCT-40/+150. Improvement steps from the ball formulation will be discussed in conjunction to the implementation of lead free materials. In order to optimize ball materials for area array devices accelareted aging conditions like TCTs were used to analyze the board level reliability of different ball materials for BGA, LFBGA, CSP, Flip Chip. The paper outlines lead-free ball analysis in comparison to conventional solder balls for BGA and chip size packages. The important points of interest are the description of processability related to existing ball attach procedures, requirements of interconnection properties and the knowledge gained the board level reliability. Both are the primary acceptance criteria for implementation. Knowledge about melting characteristic, surface tension depend on temperature and organic vehicles, wetting behavior, electrical conductivity, thermal conductivity, specific heat, mechanical strength, creep and relaxation properties, interactions to preferred finishes (minor impurities), intermetallic growth, content of IMC, brittleness depend on solved elements/IMC, fatigue resistance, damage mechanism, affinity against oxygen, reduction potential, decontamination efforts, endo-/exothermic reactions, diffusion properties related to finishes or bare materials, isothermal fatigue, thermo-cyclic fatigue, corrosion properties, lifetime prediction based on board level results, compatibility with rework/repair solders, rework temperatures of modified solders (Impurities, change in the melting point or range), compatibility to components and laminates.

• Proceedings of the KSR Conference
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• 2011.10a
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• pp.2090-2100
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• 2011

Railway rail fastening system is the critical device which gives big influences to not only the vehicle driving stability and the orbit's structural stability against the impulsive load, but also the noise vibration and the ride comfort. As a part of the low-carbon green growth, the importance of the railroad industry is getting highlights on its excellent energy-efficiency and eco-friendliness. However, so far the Korea's domestic rail fastening system technology is not so good and the technical reliance to abroad is very heavy. In this study, we conducted comparative analysis on the rail fastening system with new and used one of the same type. And those systems are imported by Seoul Metro and are being used by it. With this basis, we developed the components and the materials and then, established the durability assessment methods appropriate to the Korean domestic circumstances. And through the reliability qualification test on the 7 parts of the rail fastening system, we've improved the reliability and guaranteed the 15 years of service lifetime. ($B_{10}Life15$) Establishment and standardization of Reliability Standard on the parts of the rail fastening system such as anti-vibration pads, guide-plate, screw spike made it possible to perform the internationally fair assessment. And it is thought that we can satisfy the manufactures' and consumers' needs of cost-cutting and qualification security by shortening of assessment period on rail fastening system.

• Transactions of Materials Processing
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• v.33 no.3
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• pp.200-207
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• 2024

In this study, we developed a semi-analytical approach for the numerical analysis of residual stress in oxide scales formed on hot-rolled steels. The oxide scale, formed during the hot rolling process, experiences complex interactions due to thermal and mechanical influences, significantly affecting the material's integrity and performance. Our research focuses on integrating various stress components such as thermal stress, growth stress, and creep behavior to predict the residual stress within the oxide layer. The semi-analytical method combines analytical expressions for each stress component with numerical integration to account for their cumulative effects. Validation through instrumented indentation tests confirms the reliability of our model, which considers thermal expansion coefficient (CTE) differences, scale growth, and creep-induced stress relaxation. Our findings indicate that thermal stress resulting from CTE differences significantly impacts the overall residual stress, with growth stress contributing a compressive component during cooling, and creep behavior playing a minor role in stress relaxation. This comprehensive approach enhances the accuracy of residual stress prediction, facilitating the optimization of material design and processing conditions for hot-rolled steel products.

• The Research Journal of the Costume Culture
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• v.20 no.2
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• pp.195-207
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• 2012

In South Korea, the growth of online shopping malls that are overtaking traditional offline distributors in sales requires the latter to concentrate on developing a variety of contents amidst the ever-changing and competitive market environment. First of all, attention should be paid to information on fashion item materials. This study examined the current status of online shopping malls with a focus on their three different types-specialized malls, general malls, and open markets-and investigated consumers' hedonic shopping motives and influence on fashion materials in terms of purchasing behavior. In doing so, this study surveyed men and women in their 20s-30s residing in Seoul or its surrounding cities and used a total of 255 questionnaires for statistical analysis. The statistical software program SPSS 15.0 was used to conduct frequency analysis, factor analysis, reliability analysis, and multiple regression analysis. The study results showed that in general and specialized shopping malls, consumers granted greater reliability and importance to fashion materials when their interest in shopping or attention to fashion items/brands was high and when they wanted rare items. In open markets, the more interest consumers had in shopping and the more sensitive they were to fashion information, the more dependent they were on prices; in other words, prices were found to have a greater influence on their purchase decisions than the quality of fashion materials. The findings of this study would be useful to marketers and distributors who are trying to develop their marketing strategies based on fashion material information, according to the different types of online shopping malls.

• The Journal of Korea Institute of Information, Electronics, and Communication Technology
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• v.9 no.2
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• pp.171-177
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• 2016

Software reliability in the software development process is an important issue. Software process improvement helps in finishing with reliable software product. Infinite failure NHPP software reliability models presented in the literature exhibit either constant, monotonic increasing or monotonic decreasing failure occurrence rates per fault. In this study, reliability software cost model considering shape parameter based on life distribution from the process of software product testing was studied. The cost comparison problem of the Lomax distribution reliability growth model that is widely used in the field of reliability presented. The software failure model was used the infinite failure non-homogeneous Poisson process model. The parameters estimation using maximum likelihood estimation was conducted. For analysis of software cost model considering shape parameter. In the process of change and large software fix this situation can scarcely avoid the occurrence of defects is reality. The conditions that meet the reliability requirements and to minimize the total cost of the optimal release time. Studies comparing emissions when analyzing the problem to help kurtosis So why Kappa efficient distribution, exponential distribution, etc. updated in terms of the case is considered as also worthwhile. In this research, software developers to identify software development cost some extent be able to help is considered.