• Journal of the Korean Society of Manufacturing Technology Engineers
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• v.20 no.2
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• pp.187-192
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• 2011

UBM(Under Bump Metallurgy) is very important for successful realization of Flip-Chip technology. In this study, it is investigated the interfacial reactions between various Sn-Ag solder alloys and Ni-P/Au UBM and Cu plate finish. It is also evaluated the shear strength by using the micro shear-punch test method for Sn-37Pb alloy, binary and ternary alloys of environment-friendly Pb-free solder alloys which are applied in the electronic packages. In terms of interfacial microstructure, the Pb-free solder joints have thicker IMCs than the Sn-Pb solder joints. The thickness of IMC is related to Reflow time. The IMC has been observed to grow with the increase in Reflow time. As a result of the shear test, in case of Max. shear strength, Pb-free solder showed the highest strength value and Sn-37Pb showed the lowest strength value 10 be generally condition of Reflow time.

• Archives of Reconstructive Microsurgery
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• v.3 no.1
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• pp.40-44
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• 1994

Microsurgery has advanced beyond its nascent stages reaching success rates of 90% to 95%. However, this means that even in the best circumstances, 5% to 10% of free flaps and replants fail. Almost all failures are due to vessel thrombosis, resulting in ischemia of the transplanted tissue. Many attemps have been undertaken to treat and reverse its effects. Zdeblick and colleagues noted an improvement in the viability of amputated limbs replanted after an extended period of ischemia following intraarterial infusion of urokinase. Subsequent studies have investigated many modalities of urokinase administration in various animal models by differing ischemic periods. These studies, however, have failed to establish a definitive, generally accepted protocol for administration of urokinase in the salvage of tissue subjected to prolonged ischemia. Our clinical observations suggest that a bolus of urokinase delivered under pressure may increase the thromoblytic effect of the drug, probably by means of increased delivery to microvasculature. We intend to investigate the role of selective pressure perfusion of ischemic flaps as a new means for increasing the effectiveness of urokinase in the treatment of the "no-reflow" phenomenon. A total of 32 male New Zealand rabbits were used and divided into the four groups according to the method of infusion. After 12 hours of ischemia the flaps were injected with Hartmann's solution or with urokinase and the percent survival of the flap was determined at 7 days following flap reperfusion. As the result, the flap survival rate was highest in the pressure injection of urokinase group.

• Korean Journal of Veterinary Research
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• v.37 no.1
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• pp.111-117
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• 1997

This study was carried out determine the effect of renal ischemia on amino acid transport in rabbit renal cortical slices. The animal models of renal ischemia induced experimentally by clamping the renal artery. These results were summarized as follows: 1. The uptake of amino acids lysine and ${\alpha}$-aminobutyrate(AIB), dicarboxylate succinate and organic anion PAH in cortical slices was normal or increased after 30 or 60 min of ischemia in vivo. 2. In a 30 min ischemic kidney, the slice uptake of amino acids was returned to the control level by 30 min of reflow. In a 60 or 90 min ischemic kidney, the lysine uptake was returned to the control level after of reflow, but the uptake of AIB and succinate was significantly reduced during reflow period of 30-120 min. 3. Oxygen consumption in cortical slices was increased after 30 min of ischemia but was not altered by 60 min of ischemia. This results indicat that transient ischemia caused increasing of amino acid uptake in renal cortical slices without metabolic disorder of renal proximal tubule.

• Proceedings of the Korean Vacuum Society Conference
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• 2013.08a
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• pp.274.2-274.2
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• 2013

We described a simple and efficient fabrication method for generating microfluidic channels with a circular-cross sectional geometry by exploiting the reflow phenomenon of a thick positive photoresist. Initial rectangular shaped positive photoresist micropatterns on a silicon wafer, which were fabricated by a conventional photolithography process, were converted into a half-circular shape by tuning the temperature to around $105^{\circ}C$. Through optimization of the reflow conditions, we could obtain a perfect circular micropattern of the positive photoresist, and control the diameter in a range from 100 to 400 ${\mu}m$. The resultant convex half-circular photoresist was used as a template for fabricating a concave polydimethylsiloxane (PDMS) through a replica molding process, and a circular PDMS microchannel was produced by bonding two half-circular PDMS layers. A variety of channel dimensions and patterns can be easily prepared, including straight, S-curve, X-, Y-, and T-shapes to mimic an in vivo vascular network. To inform an endothelial cell layer, we cultured primary human umbilical vein endothelial cells (HUVECs) inside circular PDMS microchannels, and demonstrated successful cell adhesion, proliferation, and alignment along the channel.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2008.05a
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• pp.269-272
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• 2008

LGP is a key component of LCD back light unit because it determines the brightness and sharpness of display image. Usually, it has optical patterns fabricated on the bottom surface. In the present paper the LiGA-reflow method was applied to fabricate the LGP mold. Furthermore, the optical simulation considering the replication ratio of pattern height was applied to the pattern design. The optical simulation through systematic correction scheme helped find the optimum distribution of pattern density. Finally, the stamper fabricated by this method was installed in the mold and LGP was produced by injection molding. As a result of luminance measurement for the final product, the average luminance and luminance uniformity was measured 3,180 nit and 84%, respectively. Consequently, the mold fabrication method using the LiGA-reflow and optical simulation(CAE) can save the expense and time compared with the existing fabrication methods(laser ablation and chemical etching).

• Journal of the Korean institute of surface engineering
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• v.33 no.5
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• pp.373-380
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• 2000

The flow melting behavior of the electrolytic tinplate during reflow treatment was investigated in terms of morphology and structure of coating layers which were electrodeposited with variation of electrolyte temperature. It was commonly found that the nucleation density of the electrodeposits showed little difference with the electrolyte temperature, and the growth of electrodeposited tin occurred along <100> direction of (002) plane. At low electrolyte temperature, the (002) plane of tin nucleated paralleling to the substrate and grew perpendicularly to the substrate, which rendered porous rod-like deposits. With increasing the temperature, the (002) plane nucleated declining $15^{\circ}$ to the substrate and also grew to the normal <100> direction, which enabled lateral growth of the tin crystals and rendered compact deposits. During reflow treatment, the matte deposit transformed to the reflowed state via transition regions consisted of contraction, island formation, and wetting . The matte deposits formed at low temperature exhibited wide transition regions because of poor thermal transfer between crystals due to their porous nature. While that formed at high temperature transformed very rapidly to the reflowed state by enhanced thermal transfer between the compact crystals.

• Progress in Superconductivity and Cryogenics
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• v.12 no.2
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• pp.9-12
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• 2010

A lamination system using reflow soldering was developed to enhance the mechanical properties of high temperature superconductor (HTS) tape. The laminated coated conductor tape was fabricated using the continuous lamination process. The mean, maximum, and minimum tensile loads in a T-peel test of the laminated coated conductor were 9.9 N, 12.5 N, and 7.6 N, respectively. The critical current ($I_c$) distributions of the non-laminated and laminated coated conductor were compared using anon-contact Hall probe method. The transport $I_c$ nearly matched the non-contact $I_c$; however, some degraded Ic regions were found on the length of 800 cm of laminated coated conductor. We confirmed that the cause of the partially degraded $I_c$ was due to an increase in line tension by (1) solidification induced by a change of composition that usually occurs in molten brass (Cu, Zn) in solder, or (2) non-homogeneity of the thickness of the coated conductor or metal tapes. We suggest that reflow soldering is a promising method for reinforced HTS tape if the controlling solder thickness and lamination guide are modified.

• Journal of the Microelectronics and Packaging Society
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• v.8 no.1
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• pp.33-38
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• 2001

We investigate the via-size dependance of as-electroplated- and reflow-bump shapes for realizing both high-density and high-aspect ratio of solder bump. The solder bump is fabricated by subsequent processes as follows. After sputtering a TiW/Al electrode on a 5-inch Si-wafer, a thick photoresist for via formation it obtained by multiple-codling method and then vias with various diameters are defined by a conventional photolithography technique using a contact alinger with an I-line source. After via formation the under ball metallurgy (UBM) structure with Ti-adhesion and Cu-seed layers is sputtered on a sample. Cu-layer and Sn/pb-layer with a competition ratio of 6 to 4 are electroplated by a selective electroplating method. The reflow-bump diameters at bottom are unchanged, compared with as-electroplated diameters. As-electroplated- and reflow-bump shapes, however, depend significantly on the via size. The heights of as-electroplated and reflow bumps increase with the larger cia, while the aspect ratio of bump decreases. The nearest bumps may be touched by decreasing the bump pitch in order to obtain high-density bump. The touching between the nearest bumps occurs during the overplating procedure rather than the reflowing procedure because the mushroom diameter formed by overplating is larger than the reflow-bump diameter. The arrangement as zig-zag rows can be effective for realizing the flip-chip-interconnect bump with both high-density and high-aspect ratio.

• Journal of the Microelectronics and Packaging Society
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• v.29 no.3
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• pp.55-61
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• 2022

In this study, properties of Pb-free solder joints which were combined using Sn-3.0Ag-0.5Cu (SAC305) Pb-free solder with a mid-temperature type of melting temperature and Sn-57Bi-1Ag Pb-free solder with a low-temperature type of melting temperature were reported. Combined Pb-free solder joints were formed by reflow soldering processes with ball grid array (BGA) packages which have SAC305 solder balls and flame retardant-4 (FR-4) printed circuit boards (PCBs) which printed Sn-57Bi-1Ag solder paste. The reflow soldering processes were performed with two types of temperature profiles and interfacial properties of combined Pb-free solder joints such as interfacial reactions, formations of intermetallic compounds (IMCs), diffusion mechanisms of Bi, and so on were analyzed with the reflow process conditions. In order to compare reliability characteristics of combined Pb-free solder joints, we also conducted thermal shock test and analyzed changes of mechanical properties for joints from a shear test during the thermal shock test.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2002.05a
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• pp.14-14
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• 2002